Granted Patent B2

US 12,226,628 · App. 17/534,004 · Granted Feb 18, 2025

Inventors: Timothy Searfoss (New Port Richey, FL); Brian Walguarnery (Palm Harbor, FL); Thomas P. Osypka (Palm Harbor, FL)

Assignee: Oscor Inc.

A61N1/0556

Abstract

Claims (42)

1. A method for manufacturing an implantable lead, comprising the steps of:

a) molding a top silicone layer having a thickness extending from a first surface to a second surface, wherein the molded top silicon layer has a plurality of electrode receptacles extending through its thickness and a gap extending from the second surface part-way through the thickness of the top silicone layer, the gap extending to an outer edge of the top silicone layer;

b) embedding a plurality of electrodes in a respective one of the plurality of electrode receptacles in the top silicone layer so that an exposed electrode portion resides adjacent to the first surface of the top silicone layer, wherein each of the plurality of electrodes has a back surface that resides adjacent to the second surface of the top silicone layer;

c) positioning a plurality of wires in the gap and connecting an electrode to a respective one of the plurality of wires;

d) molding a bottom silicone layer;

e) placing the bottom silicone layer on top of the second surface of the top silicone layer so that the bottom silicone layer covers the back surfaces of the plurality of electrodes and the plurality of wires in the gap in a face-to-face relationship with the top silicone layer to provide an assembly;

f) forming the assembly into a desire shape against a shim;

g) placing the assembly including the shim within a canister to control an outer expansion of the assembly; and

h) curing the assembly in the canister.

2. The method of claim 1 , including molding the top and bottom silicone layers comprising a platinum-cured elastomer.

3. The method of claim 1 , including partially curing the top and bottom silicone layers for a period ranging from 2 seconds to 15 seconds inclusive before the steps of embedding the plurality of electrodes in a respective one of the plurality of electrode receptacles in the top silicone layer and positioning the plurality of wires in the gap.

4. The method of claim 1 , including partially curing the top and bottom silicone layers at a temperature ranging from 120° Centigrade to 180° Centigrade inclusive before the steps of embedding the plurality of electrodes in a respective one of the plurality of electrode receptacles in the top silicone layer and positioning the plurality of wires in the gap.

5. The method of claim 1 , including curing the assembly for a period that ranges from 120 minutes to 240 minutes inclusive.

6. The method of claim 1 , including curing the assembly at a temperature that is above 180° Centigrade.

7. The method of claim 1 , including providing each of the plurality of electrode receptacles having a step to ensure retention of the electrodes in their respective receptacle.

8. The method of claim 1 , further including placing the first surface of the top silicone layer including the exposed electrode portions against the shim before curing the assembly.

9. The method of claim 1 , including providing the desired shape for the assembly comprising at least one roll or coil.

10. The method of claim 9 , including providing the desired shape for the assembly comprising a coil of greater than 360°.

11. The method of claim 1 , including curing the assembly by flowing air over the assembly in the canister.

12. The method of claim 11 , including providing the airflow ranging from 80 liters/minute to 110 liters/minute inclusive.

13. The method of claim 1 , including removing the assembly including the shim from the canister when the assembly is fully cured.

14. The method of claim 1 , including providing the shim as a stainless steel shim or a nitinol shim.

15. An implantable lead, comprising:

a) a top silicone layer having a thickness extending from a first surface to a second surface, the top silicone layer having a plurality of electrode receptacles extending through its thickness and a gap extending from the second surface part-way through the thickness of the top silicone layer, the gap extending to an outer edge of the top silicone layer;

b) a plurality of electrodes embedded in a respective one of the plurality of electrode receptacles of the top silicone layer so that an exposed electrode portion resides adjacent to the first surface and a back electrode portion of each of the plurality of electrodes resides adjacent to the second surface of the top silicone layer;

c) a plurality of wires positioned in the gap of the top silicone layer, wherein one of the plurality of electrodes is connected to a respective one of the plurality of wires; and

d) a bottom silicone layer cured to the second surface of the top silicone layer so that the bottom silicone layer covers the back surfaces of the plurality of electrodes and the plurality of wires in the gap in a face-to-face relationship with the top silicone layer to define an assembly.

16. The implantable lead of claim 15 , wherein the plurality of electrodes are stamped platinum electrodes.

17. The implantable lead of claim 15 , wherein the plurality of electrodes are arranged in an array within the top silicone layer, the array comprising at least two rows of paired side-by-side electrodes with the gap extending longitudinally between each of the paired electrodes, and wherein each of the electrodes is connected to a respective one of the plurality of wires.

18. The implantable lead of claim 15 , wherein the exposed electrode portion of each of the plurality of electrodes is flush with or raised above the first surface of the top silicone layer.

19. The method of claim 1 , including arranging the plurality of electrodes in an array within the top silicone layer, the array comprising at least two rows of paired side-by-side electrodes with the gap containing the plurality of wires extending Longitudinally between each of the paired electrodes, followed by connecting one of the electrodes to a respective one of the plurality of wires in the gap.

20. A method for manufacturing an implantable lead, comprising the steps of:

a) molding a top silicone layer having a thickness extending from a first surface to a second surface, wherein the molded top silicon layer has a plurality of electrode receptacles extending through its thickness and a gap extending from the second surface part-way through the thickness of the top silicone layer, the gap extending to an outer edge of the top silicone layer;

b) embedding a plurality of electrodes in a respective one of the plurality of electrode receptacles in the top silicone layer so that an exposed electrode portion resides adjacent to the first surface of the top silicone layer, wherein each of the plurality of electrodes has a back surface that resides adjacent to the second surface of the top silicone layer;

c) positioning a plurality of wires in the gap and connecting one of the plurality of electrodes to a respective one of the plurality of wires;

d) molding a semi-cured platinum-cured elastomer silicone layer;

e) placing the semi-cured platinum-cured elastomer silicone layer on top of the second surface of the top silicone layer so that the semi-cured platinum-cured elastomer silicone layer covers the back surfaces of the plurality of electrodes and the plurality of wires in the gap in a face-to-face relationship with the top silicone layer;

f) molding a bottom silicone layer;

g) placing the bottom silicone layer on top of the semi-cured platinum-cured elastomer silicone layer to provide an assembly;

h) forming the assembly into a desire shape against a shim;

i) placing the assembly including the shim in a canister to control an outer expansion of the assembly; and

j) curing the assembly in the canister.

Assignments (1)

Continuity (2)

References Cited (13)

Cited By (1)

US 12,324,911