Method for manufacturing a circuit having a lamination layer using laser direct structuring process
A method of forming a multi-layer circuit on a curved substrate includes forming, by a laser direct structuring process, a first layer of the multi-layer circuit on a first surface of the curved substrate. The method includes applying a first layer of paint to the first layer of the multi-layer circuit. The method includes forming, by the laser direct structuring process, a second layer of the multi-layer circuit on the first layer of the paint and electrically coupled to the first layer of the multi-layer circuit. The method includes applying a second layer of paint over the second layer of the multi-layer circuit and forming, by the laser direct structuring process, a third layer of the multi-layer circuit on the second layer of the paint and electrically coupled to the second layer of the multi-layer circuit.
1. A method of forming a multi-layer circuit on a curved substrate, the method comprising:
forming, by a laser direct structuring process, a first layer of the multi-layer circuit on a first surface of the curved substrate;
applying a first layer of paint to the first layer of the multi-layer circuit;
forming; by the laser direct structuring process, a second layer of the multi-layer circuit on the first layer of the paint, the second layer of the multi-layer circuit being electrically coupled to the first layer of the multi-layer circuit;
applying a second layer of the paint over the second layer of the multi-layer circuit; and
forming, by the laser direct structuring process, a third layer of the multi-laver circuit on the second layer of the paint, the third layer of the multi-layer circuit being electrically coupled to the second layer of the multi-layer circuit.
2. The method of claim 1 , wherein:
the first layer of the multi-layer circuit has a first circuit pattern; and
the second layer of the multi-layer circuit has a second circuit pattern that is different than the first circuit pattern.
3. The method of claim 1 , wherein:
the first layer of the paint has a first thickness; and
the second layer of the paint has a second thickness, the second thickness being different than the first thickness.
4. The method of claim 3 , wherein the first thickness and the second thickness are each less than 1000 micrometers.
5. The method of claim 3 , wherein the first thickness and the second thickness are each between 25 micrometers and 50 micrometers.
6. The method of claim 1 , further comprising:
forming a single-layer circuit on a second surface of the curved substrate, the second surface being different than the first surface; and
forming a through-hole in the curved substrate to provide an electrical path between the single-layer circuit and the first layer of the multi-layer circuit.
7. The method of claim 1 , wherein the through-hole is a tapered through-hole.