Flexible display module and manufacturing method thereof
The present disclosure provides a flexible display module and a method for manufacturing the flexible display module. The flexible display module includes a flexible display panel, a driving chip and a circuit board. The flexible display panel includes a display region and a bonding region, and the driving chip and the circuit board are arranged at the bonding region. The circuit board includes a first flexible printed circuit and a first printed circuit board provided with an electronic element, the first printed circuit board is coupled to one end of the first flexible printed circuit, and the first flexible printed circuit includes a bonded portion coupled to the bonding region of the flexible display panel. The first flexible printed circuit is bent so that a first space is defined by the first flexible printed circuit, the first printed circuit board and the flexible display panel.
1. A flexible display module, comprising a flexible display panel, and a driving chip and a circuit board arranged on the flexible display panel, wherein the flexible display panel comprises a display region and a bonding region arranged at a side of the display region opposite to a light-exiting side, and the driving chip and the circuit board are arranged at the bonding region;
the circuit board comprises a first flexible printed circuit, and a first printed circuit board provided with an electronic element and coupled to one end of the first flexible printed circuit, and the first flexible printed circuit comprises a bonded portion coupled to the bonding region of the flexible display panel; and
a first space is defined by the first flexible printed circuit, the first printed circuit board and the flexible display panel through bending the first flexible printed circuit, and the electronic element is received in the first space;
wherein the first printed circuit board is arranged at a side of the driving chip away from the flexible display panel, the electronic element is arranged at a surface of the first printed circuit board facing the flexible display panel, and the driving chip is received in the first space;
wherein the circuit board further comprises a second flexible printed circuit and a second printed circuit board, the second flexible printed circuit is coupled to one end of the first printed circuit board away from the first flexible printed circuit, a second space is defined by the second printed circuit board, the second flexible printed circuit and the first printed circuit board through bending the second flexible printed circuit, and an electronic element of the second printed circuit board is received in the second space;
wherein the second printed circuit board comprises an adhesive arranged on a surface where the electronic element is located, and the second printed circuit board is adhered to the first printed circuit board through the adhesive.
2. The flexible display module according to claim 1 , wherein the first printed circuit board is a multi-layer printed circuit board, and the first flexible printed circuit is coupled to any layer of the first printed circuit board.
3. The flexible display module according to claim 1 , further comprising a first adhesive arranged at the bonding region of the flexible display panel and surrounding the driving chip, wherein the electronic element is adhered to the bonding region of the flexible display panel through the first adhesive.
4. The flexible display module according to claim 3 , wherein the first adhesive is a foam adhesive tape.
5. The flexible display module according to claim 1 , wherein the adhesive is an insulating double-sided adhesive tape.
6. A flexible display module, comprising a flexible display panel, and a driving chip and a circuit board arranged on the flexible display panel, wherein the flexible display panel comprises a display region and a bonding region arranged at a side of the display region opposite to a light-exiting side, and the driving chip and the circuit board are arranged at the bonding region;
the circuit board comprises a first flexible printed circuit, and a first printed circuit board provided with an electronic element and coupled to one end of the first flexible printed circuit, and the first flexible printed circuit comprises a bonded portion coupled to the bonding region of the flexible display panel; and
a first space is defined by the first flexible printed circuit, the first printed circuit board and the flexible display panel through bending the first flexible printed circuit, and the electronic element is received in the first space;
the flexible display module further comprises a flexible substrate and a heat dissipation film, wherein the flexible substrate comprises a first flexible substrate and a second flexible substrate, the display region of the flexible display panel is arranged at one side of the first flexible substrate, the heat dissipation film is arranged at the other side of the first flexible substrate, the bonding region of the flexible display panel is arranged on the second flexible substrate, the first printed circuit board is arranged at a side of the second flexible substrate adjacent to the heat dissipation film, and the electronic element is arranged at a surface of the first printed circuit board facing the second flexible substrate;
wherein the first printed circuit board comprises a first adhesive and a second adhesive arranged at opposite surfaces respectively, the first printed circuit board is adhered to the second flexible substrate through the first adhesive, and the first printed circuit board is adhered to the heat dissipation film through the second adhesive.
7. The flexible display module according to claim 6 , wherein the first adhesive, the first printed circuit board and the second adhesive have a total thickness of 0.15 mm to 0.3 mm.
8. The flexible display module according to claim 6 , wherein the first adhesive and the second adhesive are each a foam adhesive tape or an insulating double-sided adhesive tape.
9. The flexible display module according to claim 6 , wherein an orthogonal projection of the electronic element onto the heat dissipation film is outside an orthogonal projection of the second flexible substrate onto the heat dissipation film.
10. A method for manufacturing the flexible display module according to claim 1 , comprising:
enabling the first flexible printed circuit to be bonded to the bonding region of the flexible display panel through the bonded portion;
bending the first flexible printed circuit so that a first space is defined by the first flexible printed circuit, the first printed circuit board and the flexible display panel, the electronic element being received in the first space; and
bending the flexible display panel so that the bonding region is arranged at a side of the display region opposite to the light-exiting side;
wherein the bending the first flexible printed circuit so that the first space is defined by the first flexible printed circuit, the first printed circuit board and the flexible display panel comprises bending the first flexible printed circuit and enabling the first printed circuit board to move in a direction close to the driving chip, so that the first printed circuit board is arranged at a side of the driving chip away from the flexible display panel and the first space is defined by the first flexible printed circuit, the first printed circuit board and the bonding region, wherein the electronic element is arranged at a surface of the first printed circuit board facing the flexible display panel, and the driving chip is received in the first space;
wherein the method further comprises: bending the second flexible printed circuit to enable the second flexible printed circuit to be coupled to one end of the first printed circuit board away from the first flexible printed circuit; wherein a second space is defined by the second printed circuit board, the second flexible printed circuit and the first printed circuit board through bending the second flexible printed circuit, and an electronic element of the second printed circuit board is received in the second space;
wherein the second printed circuit board comprises an adhesive arranged on a surface where the electronic element is located, and the second printed circuit board is adhered to the first printed circuit board through the adhesive.
11. The method according to claim 10 , wherein subsequent to enabling the first flexible printed circuit to be bonded to the bonding region of the flexible display panel through the bonded portion, the method further comprises attaching a first adhesive in such a manner as to surround the driving chip on a surface of the flexible display panel where the driving chip is located;
wherein subsequent to bending the first flexible printed circuit and enabling the first printed circuit board to move in the direction close to the driving chip so that the first printed circuit board is arranged at the side of the driving chip away from the flexible display panel and the first space is defined by the first flexible printed circuit, the first printed circuit board and the bonding region, the method further comprises enabling the electronic element of the first printed circuit board to be in contact with, and adhered to, the first adhesive on the flexible display panel.
12. The method according to claim 11 , wherein the first adhesive is a foam adhesive tape.
13. A method for manufacturing the flexible display module according to claim 6 , comprising:
enabling the first flexible printed circuit to be bonded to the bonding region of the flexible display panel through the bonded portion;
bending the first flexible printed circuit so that a first space is defined by the first flexible printed circuit, the first printed circuit board and the flexible display panel, the electronic element being received in the first space; and
bending the flexible display panel so that the bonding region is arranged at a side of the display region opposite to the light-exiting side;
wherein the flexible display module further comprises a flexible substrate and a heat dissipation film, the flexible substrate comprises a first flexible substrate and a second flexible substrate, the display region of the flexible display panel is arranged at one side of the first flexible substrate, the heat dissipation film is arranged at the other side of the first flexible substrate, and the bonding region of the flexible display panel is arranged on the second flexible substrate;
the bending the first flexible printed circuit so that the first space is defined by the first flexible printed circuit, the first printed circuit board and the flexible display panel comprises bending the first flexible printed circuit so that the first printed circuit board is arranged at a side of the second flexible substrate away from the flexible display panel; wherein the electronic element is arranged on a surface of the first printed circuit board facing the second flexible substrate; and
the bending the flexible display panel comprises bending the flexible display panel and the flexible substrate so that the first printed circuit board is attached to the heat dissipation film;
wherein the first printed circuit board comprises a first adhesive and a second adhesive arranged at opposite surfaces respectively, the first printed circuit board is adhered to the second flexible substrate through the first adhesive, and the first printed circuit board is adhered to the heat dissipation film through the second adhesive.
14. The method according to claim 10 , wherein the first printed circuit board is a multi-layer printed circuit board, and prior to enabling the first flexible printed circuit to be bonded to the bonding region of the flexible display panel through the bonded portion, the method further comprises enabling the first flexible printed circuit to be coupled to any layer of the first printed circuit board through a via-hole.
15. The method according to claim 10 , wherein the adhesive is an insulating double-sided adhesive tape.
16. The method according to claim 13 , wherein the first adhesive, the first printed circuit board and the second adhesive have a total thickness of 0.15 mm to 0.3 mm.
17. The method according to claim 13 , wherein the first adhesive and the second adhesive are each a foam adhesive tape or an insulating double-sided adhesive tape.
18. The method according to claim 13 , wherein an orthogonal projection of the electronic element onto the heat dissipation film is outside an orthogonal projection of the second flexible substrate onto the heat dissipation film.