IP Library Granted Patent US 11,784,459
Granted Patent B2
US 11,784,459 · App. 17/539,882 · Granted Oct 10, 2023

Electrical element mounting package, array package, and electrical device

Inventors: Sentarou Yamamoto (Kagoshima, JP); Youji Furukubo (Kirishima, JP); Masanori Okamoto (Kirishima, JP); Toshifumi Higashi (Kirishima, JP)
Assignee: KYOCERA Corporation
H01S5/02315H01L23/12H01L23/13H01L23/15H01L23/36H01L23/49827H01L23/49838H01S5/022H01S5/023H01S5/0233H01S5/0235H01S5/02469H01S5/4093H01L2224/48091H01L2924/15192H01S5/02345
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Quick Facts
Patent No.
US 11,784,459
App. No.
17/539,882
Granted
Oct 10, 2023
Kind
B2
Abstract

A light emitting element mounting package includes a plate-like substrate and a base that protrudes from a front surface of the substrate and has a mounting surface on which a light emitting element is mounted. A power supply terminal is provided on the front surface of the substrate, and the power supply terminal is arranged in a direction that is opposite to a direction where an emitting surface of the light emitting element is oriented. The light emitting element mounting package further includes a wiring conductor inside the substrate, wherein the wiring conductor extends to a side of the power supply terminal where one end thereof is positioned at a side of the power supply terminal with respect to the emitting surface of the light emitting element and the other end thereof is electrically connected to the power supply terminal.

Claims (42)

1. A light emitting element mounting package comprising:

a substrate that is plate-like;

a base that protrudes from a front surface of the substrate and that has a mounting surface on which a light emitting element is mounted;

a first power supply terminal and a second power supply terminal that are provided on the front surface of the substrate, wherein the first power supply terminal and the second power supply terminal are arranged in a direction that is opposite to a direction where an emitting surface of the light emitting element is oriented, and the first power supply terminal and the second power supply terminal are positioned on an opposite side of the emitting surface and a back side of the mounting surface;

a first wiring conductor and a second wiring conductor that extend in a surface direction of the substrate;

a first element terminal that is provided to be adjacent to the base on the front surface of the substrate; and

a second element terminal that is provided on the mounting surface of the base, wherein

the first element terminal is electrically connected to the first power supply terminal through the first wiring conductor, and

the second element terminal is electrically connected to the second power supply terminal through the second wiring conductor.

2. The light emitting element mounting package according to claim 1 , wherein

the first element terminal is positioned in a transverse direction with respect to a direction where the emitting surface of the light emitting element and the first power supply terminal are aligned.

3. The light emitting element mounting package according to claim 1 , wherein:

the first wiring conductor and the second wiring conductor are provided inside the substrate;

the first wiring conductor extends to a side of the first power supply terminal where one end thereof is positioned at a side of the first power supply terminal with respect to the emitting surface of the light emitting element and the other end thereof is electrically connected to the first power supply terminal; and

the second wiring conductor extends to a side of the second power supply terminal where one end thereof is positioned at a side of the second power supply terminal with respect to the emitting surface of the light emitting element and the other end thereof is electrically connected to the second power supply terminal.

4. The light emitting element mounting package according to claim 1 , further comprising:

a side conductor that is provided on a side surface of the base and that extends in a thickness direction of the base; and

a substrate-side via conductor that is provided inside the substrate and that extends in a thickness direction of the substrate, wherein:

the second element terminal is electrically connected to the second power supply terminal through the side conductor, the substrate-side via conductor, and the second wiring conductor.

5. The light emitting element mounting package according to claim 1 , further comprising:

a base-side via conductor that is provided inside the base and that extends in a thickness direction of the base; and

a substrate-side via conductor that is provided inside the substrate and that extends in a thickness direction of the substrate, wherein:

the second element terminal is electrically connected to the second power supply terminal through the base-side via conductor, the substrate-side via conductor, and the second wiring conductor.

6. The light emitting element mounting package according to claim 1 , wherein

the first wiring conductor and the second wiring conductor are arranged to be closer to a back surface of the substrate than the front surface of the substrate.

7. The light emitting element mounting package according to claim 1 , wherein

the first power supply terminal and the second power supply terminal are provided to be lower than the front surface of the substrate.

8. The light emitting element mounting package according to claim 1 , further comprising

a sealing metal film that is provided on the front surface of the substrate to surround the base, wherein

an inner region of the sealing metal film except for a portion of the base is recessed with respect to the front surface of the substrate.

9. The light emitting element mounting package according to claim 1 , wherein

a height of the first element terminal with respect to the mounting surface is greater than a height of the second element terminal with respect to the mounting surface.

10. An array package comprising

a plurality of the light emitting element mounting packages according to claim 1 that are connected.

11. The array package according to claim 10 , wherein

the plurality of light emitting element mounting packages are integrated with sintering.

12. An electrical device comprising:

the light emitting element mounting package according to claim 1 ; and

a light emitting element that is mounted on the mounting surface of the light emitting element mounting package.

13. An electrical device comprising:

the light emitting element mounting packages that are included in the array package according to claim 10 ; and

light emitting elements that are mounted on the mounting surfaces of the light emitting element mounting packages.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 16, 2022
From: YAMAMOTO, SENTAROU; FURUKUBO, YOUJI; OKAMOTO, MASANORI; HIGASHI, TOSHIFUMI
To: KYOCERA CORPORATION
Reel/Frame 062121/0098 →
Priority Claims (2)
JP 2016-157221 · Aug 10, 2016 · national
JP 2016-221034 · Nov 11, 2016 · national
Continuity (2)
Continuation 16323803
Related Publication 20220094135A1 · Mar 24, 2022
Cited By (4)
US 12,431,691 US 12,468,102 US 12,592,539 US 12,712,331