Tuned edge profile of a disk substrate for use in magnetic recording media
A disk for a magnetic recording apparatus is described. The disk includes a first surface extending along a first plane, a second surface extending along a second plane parallel to the first plane, and a disk thickness between the first surface and the second surface, measured along a first direction substantially normal to the first surface. The disk further includes an edge surface disposed along a perimeter of the disk and between the first surface and the second surface, where the edge surface extends along a third plane substantially perpendicular to the first surface, a first chamfer disposed between the first surface and the edge surface, and a second chamfer disposed between the second surface and the edge surface. In an aspect, a length of the edge surface measured along the first direction may be between 40% and 80% of the disk thickness.
1. A magnetic recording disk, the disk comprising:
a first surface extending along a first plane;
a second surface extending along a second plane parallel to the first plane;
a disk thickness between the first surface and the second surface, measured along a first direction substantially normal to the first surface;
an edge surface disposed along a perimeter of the disk and between the first surface and the second surface, wherein the edge surface extends along a third plane substantially perpendicular to the first surface;
a first chamfer disposed between the first surface and the edge surface; and
a second chamfer disposed between the second surface and the edge surface,
wherein a length of the edge surface measured along the first direction is between 40% and 80% of the disk thickness, and
wherein the edge surface comprises an edge profile with a convex shape such that a cross section of the edge surface, taken along a plane perpendicular to the first surface and along a diameter line of the disk, comprises the convex shape without a flat portion.
2. The disk of claim 1 , wherein the disk thickness is less than or equal to 0.5 mm.
3. The disk of claim 1 , wherein a chord height of the convex shape is less than 10 μm.
4. The disk of claim 1 , wherein a roughness parameter for the edge surface is less than 8 μm.
5. The disk of claim 1 , wherein a cross section of the first chamfer taken along a plane perpendicular to the first surface and along a diameter line of the disk comprises a first chamfer surface between the first surface and the edge surface at an angle, and a cross section of the second chamfer taken along a plane perpendicular to the second surface and along a diameter line of the disk comprises a second chamfer surface between the second surface and the edge surface at an angle.
6. The disk of claim 5 , where the first chamfer surface and the second chamfer surface are substantially flat.
7. The disk of claim 5 , wherein the first chamfer surface of the first chamfer has a first surface chamfer length along the first plane and a first edge chamfer length along the third plane, and the second chamfer surface of the second chamfer has a second surface chamfer length along the second plane and a second edge chamfer length along the third plane, and
wherein the first surface chamfer length is substantially equal to the second surface chamfer length, and the first edge chamfer length is substantially equal to the second edge chamfer length.
8. The disk of claim 5 , wherein the first chamfer surface is at an angle ranging between about 40 degrees and about 50 degrees from the first surface and the third plane, and the second chamfer surface is at an angle ranging between about 40 degrees and about 50 degrees from the second surface and the third plane.
9. The disk of claim 1 , wherein the first chamfer is symmetrical to the second chamfer.
10. A deposition apparatus comprising:
the disk of claim 1 ;
one or more contact pins having an electrical contact with the edge surface of the disk; and
a bias voltage power supply configured to apply a voltage to the one or more contact pins during at least one of a deposition process for depositing one or more layers on the disk or an ion-etching process for etching the disk.
11. The deposition apparatus of claim 10 , further comprising:
a disk carrier comprising:
a carrier body; and
the one or more contact pins comprising at least three contact pins disposed between the carrier body and the edge surface of the disk, wherein the at least three contact pins secure the disk within the disk carrier for the deposition process;
wherein the disk carrier is electrically coupled to the bias voltage power supply.
12. A data storage device comprising:
the disk of claim 1 , the disk further comprising a magnetic recording layer; and
a slider comprising a magnetic head;
wherein the slider is configured to write information to the magnetic recording layer of the disk.
13. The disk of claim 1 , wherein the length of the edge surface measured along the first direction is between 50% and 70% of the disk thickness.
14. The disk of claim 1 , wherein the length of the edge surface measured along the first direction is between 55% and 65% of the disk thickness.
15. The disk of claim 1 , wherein the edge surface comprises the edge profile with the convex shape such that the cross section of the edge surface, taken along the plane perpendicular to the first surface and along the diameter line of the disk, consists of the convex shape without a flat portion.
16. A magnetic recording disk, the disk comprising:
a first surface extending along a first plane;
a second surface extending along a second plane parallel to the first plane;
a disk thickness between the first surface and the second surface, measured along a first direction substantially normal to the first surface;
an edge surface disposed along a perimeter of the disk and between the first surface and the second surface, wherein the edge surface extends along a third plane substantially perpendicular to the first surface;
a conductive layer disposed on the first surface and the edge surface;
a first chamfer disposed between the first surface and the edge surface; and
a second chamfer disposed between the second surface and the edge surface,
wherein a length of the edge surface measured along the first direction is between 40% and 80% of the disk thickness,
wherein the disk comprises a non-conductive material, and
wherein a contact resistance between the edge surface and a point on the first surface is below 200 Ohms.
17. The disk of claim 16 , wherein the non-conductive material includes at least one of a glass material or a glass ceramic material.
18. A method of fabricating a disk for a magnetic recording apparatus, the method comprising:
providing a disk comprising an annulus shape and comprising:
a first surface extending along a first plane;
a second surface extending along a second plane parallel to the first plane; and
a disk thickness between the first surface and the second surface, measured along a first direction substantially normal to the first surface;
removing material from a first perimeter corner of the disk to form a first chamfer; and
removing material from a second perimeter corner of the disk to form a second chamfer and an edge surface disposed between the first chamfer and the second chamfer, wherein the edge surface is disposed and between the first surface and the second surface, wherein the edge surface extends along a third plane substantially perpendicular to the first surface, wherein a length of the edge surface measured along the first direction is between 40% and 80% of the disk thickness, and
wherein the edge surface comprises an edge profile with a convex shape such that a cross section of the edge surface, taken along a plane perpendicular to the first surface and along a diameter line of the disk, comprises the convex shape without a flat portion.
19. The method of claim 18 , wherein the disk thickness is less than or equal to 0.5 mm.
20. The method of claim 18 , further comprising:
depositing a conductive layer on the first surface and the edge surface, wherein the disk consists of one or more non-conductive materials; and
applying a bias voltage to the conductive layer,
wherein the method further comprises at least one of:
ion-etching the conductive layer while applying the bias voltage; or
depositing one or more layers on the conductive layer of the disk while applying the bias voltage.
21. The method of claim 20 , wherein the one or more layers comprises a magnetic recording layer.
22. The method of claim 18 , wherein the edge surface comprises the edge profile with the convex shape such that the cross section of the edge surface, taken along the plane perpendicular to the first surface and along the diameter line of the disk, consists of the convex shape without a flat portion.
23. A magnetic recording disk substrate, the disk substrate comprising:
a first surface extending along a first plane;
a second surface extending along a second plane parallel to the first plane;
a disk substrate thickness between the first surface and the second surface, measured along a first direction substantially normal to the first surface;
an edge surface disposed along a perimeter of the disk substrate and between the first surface and the second surface, wherein the edge surface extends along a third plane substantially perpendicular to the first surface;
a first chamfer disposed between the first surface and the edge surface; and
a second chamfer disposed between the second surface and the edge surface,
wherein a length of the edge surface measured along the first direction is between 40% and 80% of the disk substrate thickness, and
wherein the edge surface comprises an edge profile with a convex shape such that a cross section of the edge surface, taken along a plane perpendicular to the first surface and along a diameter line of the disk, comprises the convex shape without a flat portion.
24. The disk substrate of claim 23 , wherein the disk substrate thickness is less than or equal to 0.5 mm.
25. The disk substrate of claim 23 , wherein a chord height of the convex shape is less than 10 μm.
26. The disk substrate of claim 23 , wherein a roughness parameter for the edge surface is less than 8 μm.
27. The disk substrate of claim 23 , wherein a cross section of the first chamfer taken along a plane perpendicular to the first surface and along a diameter line of the disk substrate comprises a first chamfer surface between the first surface and the edge surface at an angle, and a cross section of the second chamfer taken along a plane perpendicular to the second surface and along a diameter line of the disk substrate comprises a second chamfer surface between the second surface and the edge surface at an angle.
28. The disk substrate of claim 27 , where the first chamfer surface and the second chamfer surface are substantially flat.
29. The disk substrate of claim 27 , wherein the first chamfer surface of the first chamfer has a first surface chamfer length along the first plane and a first edge chamfer length along the third plane, and the second chamfer surface of the second chamfer has a second surface chamfer length along the second plane and a second edge chamfer length along the third plane, and
wherein the first surface chamfer length is substantially equal to the second surface chamfer length, and the first edge chamfer length is substantially equal to the second edge chamfer length.
30. The disk substrate of claim 27 , wherein the first chamfer surface is at an angle ranging between about 40 degrees and about 50 degrees from the first surface and the third plane, and the second chamfer surface is at an angle ranging between about 40 degrees and about 50 degrees from the second surface and the third plane.
31. The disk substrate of claim 23 , wherein the first chamfer is symmetrical to the second chamfer.
32. A magnetic recording disk, the disk comprising:
the disk substrate of claim 23 ; and
a conductive layer disposed on the first surface and the edge surface of the disk substrate,
wherein the disk substrate comprises a non-conductive material; and
wherein a contact resistance between the edge surface and a point on the first surface is below 200 Ohms.
33. The disk of claim 32 , wherein the non-conductive material includes at least one of a glass material or a glass ceramic material.
34. The disk substrate of claim 23 , wherein the length of the edge surface measured along the first direction is between 50% and 70% of the disk substrate thickness.
35. The disk substrate of claim 23 , wherein the length of the edge surface measured along the first direction is between 55% and 65% of the disk substrate thickness.
36. The disk substrate of claim 23 , wherein the edge surface comprises the edge profile with the convex shape such that the cross section of the edge surface, taken along the plane perpendicular to the first surface and along the diameter line of the disk, consists of the convex shape without a flat portion.