Granted Patent B2

US 12,471,527 · App. 17/546,775 · Granted Nov 18, 2025

Inventors: Eric L. Walker (Narvon, PA); Cory Douglas Hunt (Millersville, PA); Bart Lenaerts (Zutendaal, BE)

Assignee: CNH Industrial America LLC

A01D41/127A01B79/005G01B5/10G01B21/12G01N33/0098G01S13/86A01B63/24A01D45/021

Abstract

Claims (62)

1 . An agricultural harvester, comprising:

a frame;

a crop cleaning assembly supported on the frame, the crop cleaning assembly including an oscillating component configured to oscillate relative to the frame in a manner that conveys crop material across the oscillating component;

a RADAR sensor configured to emit a radio wave or microwave signal directed at the crop material present on the oscillating component and detect an echo signal reflected by the crop material present on the oscillating component; and

a computing system communicatively coupled to the RADAR sensor, the computing system configured to:

detect a first interface between the crop material and the oscillating component based on the echo signal;

detect a second interface between the crop material and air above the crop material based on the echo signal;

determine a distance between the first interface and the second interface; and

determine a thickness of the crop material present on the oscillating component based on the determined distance.

2 . The agricultural harvester of claim 1 , wherein the RADAR sensor is positioned below the oscillating component in a vertical direction such that the emitted radio wave or microwave signal is directed upward in the vertical direction toward the oscillating component.

3 . The agricultural harvester of claim 1 , wherein the computing system is further configured to:

compare the determined thickness of the crop material to a predetermined thickness range; and

adjust an operation of the crop cleaning assembly when the determined thickness falls outside of the predetermined thickness range.

4 . The agricultural harvester of claim 3 , wherein, when adjusting the operation of the crop cleaning assembly, the computing system is further configured to initiate an adjustment of at least one of an orientation of the oscillating component relative to the frame or an oscillatory motion of the oscillating component.

5 . The agricultural harvester of claim 1 , wherein the oscillating component comprises a pan or a sieve.

6 . A system for monitoring crop material thickness within an agricultural harvester, the system comprising:

a crop cleaning assembly including an oscillating component configured to oscillate relative to a frame of the agricultural harvester in a manner that conveys crop material across the oscillating component;

a RADAR sensor configured to emit a radio wave or microwave signal directed at the crop material present on the oscillating component and detect an echo signal reflected by the crop material present on the oscillating component; and

a computing system communicatively coupled to the RADAR sensor, the computing system configured to:

detect a first interface between the crop material and the oscillating component based on the echo signal;

detect a second interface between the crop material and air above the crop material based on echo signal:

determine a distance between the first interface and the second interface; and

determine a thickness of the crop material present on the oscillating component based on the determined distance.

7 . The system of claim 6 , wherein the RADAR sensor is positioned below the oscillating component in a vertical direction such that the emitted radio wave or microwave signal is directed upward in the vertical direction toward the oscillating component.

8 . The system of claim 6 , wherein the computing system is further configured to:

compare the determined thickness of the crop material to a predetermined thickness range; and

adjust an operation of the crop cleaning assembly when the determined thickness falls outside of the predetermined thickness range.

9 . The system of claim 8 , wherein, when adjusting the operation of the crop cleaning assembly, the computing system is further configured to initiate an adjustment of at least one of an orientation of the oscillating component relative to the frame or an oscillatory motion of the oscillating component.

10 . The system of claim 6 , wherein the RADAR sensor is coupled to the oscillating component such that the RADAR sensor oscillates with the oscillating component relative to the frame.

11 . The system of claim 6 , wherein data associated with the echo signal is sampled at a sampling rate set based on an oscillatory motion of the oscillating component.

12 . The system of claim 6 , wherein the RADAR sensor corresponds to a first RADAR sensor configured to emit a first radio wave or microwave signal directed at the crop material present on the oscillating component at a first location and detect a first echo signal reflected by the crop material present on the oscillating component at the first location such that the distance corresponds to a first distance and the thickness corresponds to a first thickness of the crop material present on the oscillating component at the first location, the system further comprising:

a second RADAR sensor configured to emit a second radio wave or microwave signal directed at the crop material present on the oscillating component at a second location and detect a second echo signal reflected by the crop material present on the oscillating component at the second location, the second location being different than the first location,

wherein the computing system is communicatively coupled to the second RADAR sensor, the computing system further configured to;

detect a third interface between the crop material and the oscillating component based on the second echo signal;

detect a fourth interface between the crop material and air above the crop material based on the second echo signal;

determine a second distance between the third interface and the fourth interface; and

determine a second thickness of the crop material present at the second location on the oscillating component based on the determined second distance.

13 . The system of claim 12 , wherein the first location is spaced apart from the second location in a lateral direction of the agricultural harvester extending perpendicular to a direction of travel of the agricultural harvester.

14 . The system of claim 12 , wherein the first location is spaced apart from the second location in a longitudinal direction of the agricultural harvester extending parallel to a direction of travel of the agricultural harvester.

15 . The system of claim 12 , wherein the computing system is further configured to determine a thickness differential between the first thickness and the second thickness.

16 . The system of claim 11 , wherein the computing system is further configured to:

compare the determined thickness differential to a predetermined differential range; and

adjust an operation of the crop cleaning assembly when the determined thickness differential falls outside of the predetermined differential range.

17 . A method for monitoring crop material thickness within an agricultural harvester, the agricultural harvester including a crop cleaning assembly having an oscillating component configured to oscillate relative to a frame of the agricultural harvester in a manner that conveys crop material across the oscillating component, the method comprising:

receiving, with a computing system, data from a RADAR sensor configured to emit a radio wave or microwave signal directed at the crop material present on the oscillating component and detect an echo signal reflected by the crop material present on the oscillating component;

detecting, with the computing system, a first interface between the crop material and the oscillating component based on the echo signal;

detecting, with the computing system, a second interface between the crop material and air above the crop material based on echo signal;

determining, with the computing system, a distance between the first interface and the second interface;

determining, with the computing system, a thickness of the crop material present on the oscillating component based on the determined distance;

comparing, with the computing system, the determined thickness of the crop material to a predetermined thickness range; and

adjusting, with the computing system, an operation of the crop cleaning assembly when the determined thickness falls outside of the predetermined thickness range.

18 . The method of claim 17 , wherein the RADAR sensor corresponds to a first RADAR sensor configured to emit a first radio wave or microwave signal directed at the crop material present on the oscillating component at a first location and detect a first echo signal reflected by the crop material present on the oscillating component at the first location such that the distance corresponds to a first distance and the determined thickness corresponds to a first thickness of the crop material present on the oscillating component at the first location, the method further comprising:

receiving, with the computing system, data from a second RADAR sensor configured to emit a second radio wave or microwave signal directed at the crop material present on the oscillating component at a second location and detect a second echo signal reflected by the crop material present on the oscillating component at the second location, the second location being different than the first location;

detecting, with the computing system, a third interface between the crop material and the oscillating component based on the second echo signal;

detecting, with the computing system, a fourth interface between the crop material and air above the crop material based on the second echo signal;

determining, with the computing system, a second distance between the third interface and the fourth interface; and

determining, with the computing system, a second thickness of the crop material present on the oscillating component at the second location based on the second distance.

19 . The method of claim 18 , further comprising:

determining, with the computing system, a thickness differential between the first thickness and the second thickness.

20 . The method of claim 19 , further comprising:

comparing, with the computing system, the determined thickness differential to a predetermined differential range; and

adjusting, with the computing system, an operation of the crop cleaning assembly when the determined thickness differential falls outside of the predetermined differential range.

Assignments (3)

Continuity (1)

References Cited (11)