Transversely-excited film bulk acoustic resonator
An acoustic resonator device is formed using a wafer-to-wafer bonding process by etching recesses into a first surface of a piezoelectric substrate, a depth of the recesses greater than a target piezoelectric membrane thickness; then wafer-to-wafer bonding the first surface of the piezoelectric substrate to a handle wafer using a releasable bonding method. The piezoelectric substrate is then thinned to the target piezoelectric membrane thickness to form a piezoelectric plate and at least one conductor pattern is formed on the thinned piezoelectric plate. The side of the thinned piezoelectric plate having the conductor pattern is bonded to a carrier wafer using a metal-to-metal wafer bonding process and the handle wafer is removed.
1. An acoustic resonator device comprising:
a carrier wafer having a carrier surface and a carrier conductor pattern on the carrier surface;
a piezoelectric layer having front and back surfaces, a portion of the piezoelectric layer forming a diaphragm that is over a cavity between the carrier wafer and the piezoelectric layer, and the carrier conductor pattern;
a device conductor pattern including an interdigital transducer (IDT) on the front surface of the piezoelectric layer and facing the carrier wafer, wherein interleaved fingers of the IDT are disposed on the diaphragm; and
a second metal layer over a surface of the device conductor pattern to provide electrical connections between the IDT and the carrier conductor pattern, wherein surfaces of the second metal layer are metal-to-metal bonded to surfaces of the carrier conductor pattern,
wherein the piezoelectric layer comprises openings extending therethrough.
2. The acoustic resonator device of claim 1 , wherein the interleaved fingers are disposed over the cavity.
3. The acoustic resonator device of claim 1 , wherein the carrier wafer further comprises contact pads bonded by contact bumps extending through the openings extending through the piezoelectric layer to contact pads of a capping layer.
4. The acoustic resonator device of claim 1 , wherein the device conductor pattern comprises a passivation layer over the interleaved fingers of the conductor pattern.
5. The acoustic resonator device of claim 1 , wherein the piezoelectric layer and the device conductor pattern are configured such that radio frequency signals applied to the device conductor pattern excite a primary shear acoustic mode in the diaphragm, and wherein a thickness of the diaphragm is selected to tune the primary shear acoustic mode.
6. The acoustic resonator device of claim 1 , wherein a thickness of the piezoelectric layer ts is between 100 nm and 1000 nms.
7. An acoustic resonator device comprising:
a carrier wafer having a carrier surface and a carrier conductor pattern on the carrier surface;
a piezoelectric layer having front and back surfaces, a portion of the piezoelectric layer forming a diaphragm that is over a cavity between the diaphragm, the carrier conductor pattern and the carrier surface;
a device conductor pattern including an interdigital transducer (IDT) on the front surface of the piezoelectric layer, wherein interleaved fingers of the IDT are on the diaphragm and facing towards the carrier wafer; and
a second metal layer over a surface of the device conductor pattern and having surfaces that are metal-to-metal bonded to surfaces of the carrier conductor pattern,
wherein the piezoelectric layer and the device conductor pattern are configured such that radio frequency signals applied to the device conductor pattern excite a primary shear acoustic mode in the diaphragm, and
wherein a thickness of the diaphragm is selected to tune the primary shear acoustic mode in the piezoelectric layer.
8. The acoustic resonator device of claim 7 , wherein a thickness of the piezoelectric layer ts is between 100 nm and 1000 nms.
9. The acoustic resonator device of claim 7 , wherein the piezoelectric layer comprises openings extending through the piezoelectric layer.
10. The acoustic resonator device of claim 9 , wherein the carrier wafer further comprises contact pads bonded by contact bumps extending through the openings extending through the piezoelectric layer to contact pads of a capping layer.
11. The acoustic resonator device of claim 7 , wherein the interleaved fingers are facing towards the cavity, and wherein the device conductor pattern comprises a passivation layer over the interleaved fingers of the conductor pattern and disposed over the cavity.
12. An acoustic resonator device comprising:
a carrier wafer having a carrier surface and a carrier metal layer over the carrier surface;
a piezoelectric layer having front and back surfaces, a portion of the piezoelectric layer forming a diaphragm that is over a cavity between the diaphragm, parts of the carrier metal layer and the carrier surface;
a resonator metal layer including an interdigital transducer (IDT) on the front surface of the piezoelectric layer, wherein interleaved fingers of the IDT are on the diaphragm and over the cavity; and
a second metal layer over a surface of the resonator metal layer, wherein surfaces of the second metal layer are metal-to-metal bonded to surfaces of the carrier metal layer,
wherein the piezoelectric layer comprises openings extending therethrough.
13. The acoustic resonator device of claim 12 , further comprising contact bumps extending through the openings and bonding contact pads of the carrier wafer to contact pads of a capping layer.
14. The acoustic resonator device of claim 12 , wherein the piezoelectric layer and the resonator metal layer are configured such that radio frequency signals applied to the resonator metal layer excite a primary shear acoustic mode in the piezoelectric layer, wherein a thickness of the diaphragm is selected to tune the primary shear acoustic modes in the piezoelectric layer.
15. The acoustic resonator device of claim 12 , wherein a thickness of the piezoelectric layer ts is between 100 nm and 1000 nms.
16. The acoustic resonator device of claim 12 , wherein the the second metal layer comprises contact pads that are metal-to-metal bonded to opposing contact pads of the carrier metal layer.
17. The acoustic resonator device of claim 12 , further comprising a passivation layer over the interleaved fingers of the metal layer and disposed over the cavity.