Photoresist patterning process supporting two step phosphor-deposition to form an LED matrix array
A method is described for low temperature curing of silicone structures, including the steps of providing patterning photoresist structures on a substrate. The photoresist structures define at least one open region that can be at least partially filled with a condensation cure silicone system. Vapor phase catalyst deposition is used to accelerate the cure of the condensation cure silicone, and the photoresist structure is removed to leave free standing or layered silicone structures. Phosphor containing silicone structures that are coatable with a reflective metal or other material are enabled by the method.
1. A phosphor structure comprising:
a plurality of phosphor pixels spaced apart from each other, each of the phosphor pixels comprising side walls facing adjacent phosphor pixels, and a top surface and a bottom surface having at least one of the side walls in between them; and
a reflective structure disposed between the side walls of adjacent phosphor pixels, and disposed at alternating top surfaces and bottom surfaces of adjacent phosphor pixels.
2. The phosphor structure of claim 1 , wherein each of the phosphor pixels comprises phosphors in a silicone or siloxane.
3. The phosphor structure of claim 1 , wherein the reflective structure comprises a distributed Bragg reflector.
4. The phosphor structure of claim 1 , wherein the reflective structure comprises a binder and light reflective particles.
5. The phosphor structure of claim 4 , wherein the binder is an inorganic binder.
6. The phosphor structure of claim 4 , wherein the binder is an organic binder.
7. The phosphor structure of claim 1 , wherein the reflective structure comprises wall portions extending in a vertical direction disposed between the side walls of adjacent phosphor pixels and surface portions extending in a horizontal direction perpendicular to the vertical direction disposed at the alternating top surfaces and bottom surfaces of adjacent phosphor pixels, and adjacent surface portions disposed at respective top and bottom surfaces are connected to each other through respective ones of the wall portions between adjacent surface portions.
8. The phosphor structure of claim 1 , wherein adjacent phosphor pixels comprise a pair of top surfaces that are not flush with each other, and adjacent phosphor pixels comprise a pair of bottom surfaces that are not flush with each other.
9. The phosphor structure of claim 1 , wherein a spacing between adjacent phosphor pixels is equal to the thickness of the reflective structure disposed between them, which is less than or equal to about 3 microns.
10. The phosphor structure of claim 1 , wherein the phosphor pixels comprise dyes.
11. The phosphor structure of claim 1 , wherein the phosphor pixels comprise lenses.
12. The phosphor structure of claim 1 , wherein at least some of the phosphor pixels have different emission properties from each other.
13. The phosphor structure of claim 1 , wherein the phosphor pixels comprise silicone.
14. The phosphor structure of claim 1 , further comprising a substrate in direct contact with the reflective structure.
15. The phosphor structure of claim 1 , wherein the substrate is in direct contact with at least some of the phosphor pixels.