Wire-wound structures for electromagnetic sensing of objects

1. An apparatus for detecting a presence of an object in a predetermined area of an inductive wireless power transfer system, the apparatus comprising: a first wire-wound structure that is electrically conductive, substantially planar, and configured for electromagnetically sensing of the object, wherein the first wire-wound structure comprises at least one piece of wire; a coil-former coupled to the first wire-wound structure, wherein the coil-former is substantially planar and has a first surface and a second surface opposite to the first surface, the coil-former configured to form a portion of the at least one piece of wire of the first wire-wound structure into a substantially two-dimensional wire-wound structure via first wire placement structures, wherein the substantially two-dimensional wire-wound structure comprises at least one single-wire lead line having a capacitance smaller than a capacitance of the substantially two-dimensional wire-wound structure, wherein the substantially two-dimensional wire-wound structure is configured to sense the object capacitively via an alternating electric field; form a second wire-wound structure via second wire placement structures, wherein the second wire-wound structure is configured to transfer power inductively; and hold in place the first wire-wound structure on the first surface and the second wire-wound structure on the second surface; and a detection circuit coupled to the first wire-wound structure and configured to: measure an electrical characteristic of the first wire-wound structure; and determine the presence of the object in response to a change in the electrical characteristic.

2. The apparatus of claim 1 , wherein the first wire placement structures and the second wire placement structures comprise protrusive structures protruding from the coil-former or recessed structures recessing within the coil-former.

3. The apparatus of claim 2 , wherein the at least one piece of wire is one or more of a non-insulated wire, an insulated wire, a copper wire, an aluminum wire, a copper alloy wire, an enameled wire, a magnetic wire, a solderable wire, a directly solderable enameled wire, a tin plated copper wire, a wire-wrapping wire, a Litz wire, a twisted wire, a wire bundle, a heat-sensitive electrical-resistance wire, a temperature compensated electrical resistance wire, and a heat resistant insulation wire.

4. The apparatus of claim 2 , wherein:

each end of the at least one piece of wire is configured to provide a terminal to electrically couple the at least one piece of wire to the detection circuit; and

the at least one piece of wire forms a wire loop of one or more turns and a double-wire lead line having an inductance smaller than an inductance of the at least one piece of wire.

5. The apparatus of claim 4 , wherein the inductance of the double-wire lead line is a short circuit inductance as measured between a first terminal and a second terminal of the at least one piece of wire.

6. The apparatus of claim 4 , wherein the wire loop is configured to sense the object inductively via an alternating magnetic field.

7. The apparatus of claim 4 , wherein the wire loop is a densely wound multi-turn loop maximizing an inductance of the wire loop.

8. The apparatus of claim 4 , wherein the wire loop is a planar spiral coil with a spacing between windings that is substantially larger than a diameter of the at least one piece of the wire.

9. The apparatus of claim 8 , wherein the planar spiral coil is configured to reduce a variation of an object detection sensitivity over the predetermined area.

10. The apparatus of claim 1 , wherein:

one end of the at least one piece of wire is configured to provide a terminal to electrically couple the at least one piece of wire to the detection circuit.

11. The apparatus of claim 10 , wherein the capacitance is an open-circuit capacitance of the single-wire lead line as measured between the terminal and a ground reference of the detection circuit or as measured between a terminal of a first piece of wire and a terminal of a second piece of wire.

12. The apparatus of claim 10 , wherein the two-dimensional wire-wound structure includes one or more of a folded wire-wound structure, a spiral wire-wound structure, a serpentine wire-wound structure, and a meander wire-wound structure.

13. The apparatus of claim 10 , wherein the two-dimensional wire-wound structure is configured to reduce a variation of an object detection sensitivity over the predetermined area.

14. The apparatus of claim 1 , wherein a predetermined area for sensing the object inductively differs from a predetermined area for sensing the object capacitively.

15. The apparatus of claim 1 , wherein the object includes one or more of a metallic object, a dielectric object, a ferromagnetic object, a living object, a human extremity, an animal, a vehicle underbody, a wireless power transfer structure, an inductive passive beacon, and a capacitive passive beacon.

16. The apparatus of claim 1 , wherein the coil-former includes one or more of an electrically insulating material, a low electric permittivity material, a plastic material, an epoxy material, a glass-fiber-reinforced material, a ceramic material, a composite material, a carbon material, a heat-sensitive electrical conductance material, a heat-sensitive electrical impedance material, a heat-sensitive magnetic permeability material, a heat-sensitive electric permittivity material, a heat-resistant material, and a heat-conductive material.

17. The apparatus of claim 1 , wherein the coil-former:

provides structures configured to form and accommodate the first and second wire-wound structures; and

is further configured for automated robot winding of the first and second wire-wound structures.

18. The apparatus of claim 17 , wherein the structures provide one or more of a rectangular-shaped profile, a right-angled trapezoidal-shaped profile, a dovetail-shaped profile, an “L”-shaped profile, and a “T”-shaped profile.

19. The apparatus of claim 17 , wherein:

the structures are configured as grooves;

a portion of the grooves have a first depth;

another portion of the grooves are deeper than the first depth; and

the first depth is less than three millimeters.