IP Library Granted Patent US 12,084,588
Granted Patent B2
US 12,084,588 · App. 17/558,850 · Granted Sep 10, 2024

Multi-component composition for additive manufacturing

Inventors: Eric Arndt (Everett, MA); Luke Kwisnek (Somerville, MA); Michael Morin (Somerville, MA)
Assignee: Formlabs, Inc.
C09D163/10B29C64/30B33Y40/20B33Y70/00C08G59/1466C08G59/245C08G59/4028C08G59/685B29K2063/00
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,084,588
App. No.
17/558,850
Granted
Sep 10, 2024
Kind
B2
Abstract

A multi-component composition for additive manufacturing, and related methods, are generally described.

Claims (16)

1. A multi-component composition for additive manufacturing, the composition comprising:

at least one cyanate ester-containing compound;

an epoxy-containing compound, wherein the epoxy-containing compound comprises a bisphenol epoxy-containing compound, a novolac epoxy-containing compound, a glycidyl ether epoxy-containing compound, a cycloaliphatic epoxy-containing compound, and/or mixtures thereof; and

an acrylate- or methacrylate-containing compound,

wherein a combined amount of the at least one cyanate ester-containing compound and the epoxy-containing compound is greater than 60 wt. % and less than or equal to 80 wt. % based on a total weight of the composition.

2. The composition of claim 1 , comprising the at least one cyanate ester-containing compound in an amount between greater than or equal to 20 wt. % and less than or equal to 50 wt. % based on the total weight of the composition.

3. The composition of claim 1 , comprising the epoxy-containing compound in an amount between greater than or equal to 10 wt. % and less than or equal to 50 wt. % based on the total weight of the composition.

4. The composition of claim 1 , comprising the acrylate- or methacrylate-containing compound in an amount between greater than or equal to 10 wt. % and less than or equal to 70 wt. % based on the total weight of the composition.

5. The composition of claim 1 , further comprising a photoinitiator.

6. The composition of claim 5 , wherein the photoinitiator comprises diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide (TPO) and/or phenylbisphosphine oxide (BAPO).

7. The composition of claim 5 , comprising the photoinitiator in an amount between greater than or equal to 0.1 wt. % and less than or equal to 2 wt. % based on the total weight of the composition.

8. The composition of claim 1 , further comprising a catalyst.

9. The composition of claim 8 , comprising the catalyst in an amount less than or equal to 1 wt. % based on the total weight of the composition.

10. The composition of claim 1 , wherein the at least one cyanate ester-containing compound comprises a bisphenol-A cyanate ester-containing compound, a bisphenol-E cyanate ester-containing component, a bisphenol-F cyanate ester-containing component, a bisphenol-M cyanate ester-containing compound, a novolac cyanate ester-containing compound, and/or mixtures thereof.

11. The composition of claim 1 , wherein the acrylate- or methacrylate-containing compound comprises ethyl acrylate; 2-hydroxyethyl methacrylate; phenoxyethyl (meth)acrylate; 2-hydroxyethyl (meth)acrylate; octadecyl acrylate; cyclic trimethylolpropane formal acrylate; 2[[(butylamino)carbonyl]oxy]ethyl acrylate; lauryl acrylate; bisphenol A-glycidyl methacrylate; 2(2-ethoxyethoxy) ethyl acrylate; isobornyl (meth)acrylate ; caprolactone acrylate; 1,6 hexanediol di(meth)acrylate; tricyclodecane dimethanol di(meth)acrylate; tripropylene glycol diacrylate; urethane dimethacrylate (UDMA); ethoxylated trimethylolpropane triacrylate;

trimethylolpropane triacrylate; tris (2-hydroxy ethyl) isocyanurate triacrylate; pentaerythritol tetraacrylate; dipentaerythritol pentaacrylate; dendritic acrylates; and/or mixtures thereof.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 26, 2022
From: ARNDT, ERIC; KWISNEK, LUKE; MORIN, MICHAEL
To: FORMLABS, INC.
Reel/Frame 061545/0667 →
AMENDED AND RESTATED INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Aug 5, 2022
From: FORMLABS INC.; FORMLABS OHIO INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 061087/0001 →
Continuity (2)
Provisional Application 63129785 · Dec 23, 2020
Related Publication 20220195236A1 · Jun 23, 2022