IP Library Granted Patent US 12,644,187
Granted Patent B2
US 12,644,187 · App. 17/559,653 · Granted Jun 2, 2026

Metallized polymer particles and related methods

Inventors: Nan-Xing Hu (Oakville, CA); Yulin Wang (Oakville, CA); Sandra J. Gardner (Oakville, CA)
Assignee: Xerox Corporation
C23C18/1641C08J3/05C08J3/14C23C18/31C08J2377/00
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Quick Facts
Patent No.
US 12,644,187
App. No.
17/559,653
Granted
Jun 2, 2026
Kind
B2
Abstract

Metallized polymer particle compositions may comprise polymer particles, and a metal coating on an outer surface of at least a portion of the polymer particles. The metal coating comprises a plating metal and overlays a plurality of two-dimensional conductive nanoparticles and a catalyst metal. The metal coating may be formed by at least an electroless plating process conducted in the presence of the catalyst metal. The polymer particles may comprise thermoplastic polymer particles.

Claims (27)

1 . A metallized polymer particle composition comprising:

polymer particles comprising thermoplastic polymer particles; and

a metal coating on an outer surface of at least a portion of the polymer particles, the metal coating comprising a plating metal that overlays a plurality of two-dimensional conductive nanoparticles and a catalyst metal;

wherein the thermoplastic polymer particles have a circularity of about 0.90 or greater; and

wherein the thermoplastic polymer particles comprise a thermoplastic polymer selected from the group consisting of a polyamide, a polyurethane, a polyacetal, a polycarbonate, polybutylene terephthalate (PBT), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polytrimethylene terephthalate (PTT), polyhexamethylene terephthalate, a polyester, polylactic acid, a polyether, a polyether sulfone, a polyetherether ketone, a polyimide, a polyphenylene sulfide, a polyarylene ether, a polyarylene sulfide, a polysulfone, a polyether ketone, a polyamide-imide, a polyetherimide, a polyetherester, a chlorinated or chlorosulphonated polyethylene, a phenolic resin, a silicone, and any combination thereof.

2 . The metallized polymer particle composition of claim 1 , wherein the plurality of two-dimensional conductive nanoparticles comprises a nanoparticle selected from the group consisting of graphene, reduced graphene oxide, a two-dimensional transition metal compound, and any combination thereof.

3 . The metallized polymer particle composition of claim 1 , wherein the plurality of two-dimensional conductive nanoparticles comprises a MXene having a layered structure selected from the group consisting of a transition metal carbide, a transition metal nitride, a transition metal carbonitride, and any combination thereof.

4 . The metallized polymer particle composition of claim 3 , wherein the MXene further comprises a surface terminating group selected from the group consisting of a hydrogen, an oxygen, a sulfur, a hydroxyl, a halide, and any combination thereof.

5 . The metallized polymer particle composition of claim 3 , wherein the MXene further comprises a surface terminating group selected from the group consisting of an oxygen, a sulfur, a hydroxyl, a halide, and any combination thereof.

6 . The metallized polymer particle composition of claim 1 , further comprising:

an adhesion promoter interposed between the outer surface of the polymer particles and the two-dimensional conductive nanoparticles.

7 . The metallized polymer particle composition of claim 1 , wherein the plurality of two-dimensional conductive nanoparticles is localized at an interface of the metal coating and the outer surface of the polymer particles.

8 . The metallized polymer particle composition of claim 1 , wherein the plurality of two-dimensional conductive nanoparticles is present at about 0.00001 wt % to about 0.1 wt % relative to a mass of the plating metal in the metal coating.

9 . The metallized polymer particle composition of claim 1 , wherein a mass ratio of the plurality of two-dimensional conductive nanoparticles to the catalyst metal ranges from about 1,000:1 to about 1:1,000.

10 . The metallized polymer particle composition of claim 1 , wherein the metal coating has a thickness ranging from about 0.005 μm to about 10 μm.

11 . The metallized polymer particle composition of claim 1 , wherein the catalyst metal comprises at least one of copper, silver, platinum, or palladium.

12 . The metallized polymer particle composition of claim 1 , wherein the plating metal comprises at least one of copper, silver, gold, chromium, nickel, or any alloy thereof.

13 . A process comprising:

depositing a particulate composition comprising a first plurality of particles comprising the metallized polymer particle composition of claim 1 and optionally a second plurality of particles comprising thermoplastic polymer particles lacking a metal coating; and

consolidating a portion of the particulate composition to form a consolidated body comprising a metal.

14 . The metallized polymer particle composition of claim 1 , wherein the thermoplastic polymer particles comprise a thermoplastic polymer selected from the group consisting of a polyamide, a polyurethane, and any combination thereof.

15 . A method comprising:

providing polymer particles comprising a plurality of two-dimensional conductive nanoparticles and a catalyst metal on an outer surface of at least a portion of the polymer particles;

wherein the polymer particles comprise thermoplastic polymer particles, and the thermoplastic polymer particles have a circularity of about 0.90 or greater; and

wherein the thermoplastic polymer particles comprise a thermoplastic polymer selected from the group consisting of a polyamide, a polyurethane, a polyacetal, a polycarbonate, polybutylene terephthalate (PBT), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polytrimethylene terephthalate (PTT), polyhexamethylene terephthalate, a polyester, polylactic acid, a polyether, a polyether sulfone, a polyetherether ketone, a polyimide, a polyphenylene sulfide, a polyarylene ether, a polyarylene sulfide, a polysulfone, a polyether ketone, a polyamide-imide, a polyetherimide, a polyetherester, a chlorinated or chlorosulphonated polyethylene, a phenolic resin, a silicone, and any combination thereof; and

performing electroless plating upon the outer surface of the polymer particles using a plating metal precursor to form metallized polymer particles having a metal coating upon the outer surface of the polymer particles;

wherein the metal coating comprises a plating metal that overlays the plurality of two-dimensional conductive nanoparticles and the catalyst metal.

Assignments (7)
SECOND LIEN NOTES PATENT SECURITY AGREEMENT Recorded Jul 2, 2025
From: XEROX CORPORATION
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 071785/0550 →
FIRST LIEN NOTES PATENT SECURITY AGREEMENT Recorded Apr 11, 2025
From: XEROX CORPORATION
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 070824/0001 →
SECURITY INTEREST Recorded Feb 13, 2024
From: XEROX CORPORATION
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 066741/0001 →
SECURITY INTEREST Recorded Nov 20, 2023
From: XEROX CORPORATION
To: JEFFERIES FINANCE LLC, AS COLLATERAL AGENT
Reel/Frame 065628/0019 →
RELEASE OF SECURITY INTEREST IN PATENTS AT R/F 062740/0214 Recorded May 18, 2023
From: CITIBANK, N.A., AS AGENT
To: XEROX CORPORATION
Reel/Frame 063694/0122 →
SECURITY INTEREST Recorded Nov 10, 2022
From: XEROX CORPORATION
To: CITIBANK, N.A., AS AGENT
Reel/Frame 062740/0214 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 22, 2021
From: HU, NAN-XING; WANG, YULIN; GARDNER, SANDRA J.
To: XEROX CORPORATION
Reel/Frame 058464/0470 →
Continuity (1)
Related Publication 20230193470A1 · Jun 22, 2023
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