Semiconductor device and manufacturing method thereof
The present invention provides a small and thin semiconductor device. The semiconductor device flip-chip bonds a semiconductor chip 1 and a lead 6 via a metal bonding portion 5 and includes a sealing resin covering them. The metal bonding portion 5 is provided with a gold-rich bonding layer 5 a on the side of a first electrode 3 a of the semiconductor chip 1 and a gold-rich bonding layer 5 b on the side of a second electrode 3 b of the lead 6 , and connection between the semiconductor chip 1 and the lead 6 is strengthened, so that the semiconductor device does not require an anchor portion.
1. A semiconductor device, comprising:
a semiconductor chip comprising a plurality of first electrodes;
a lead having a support surface, a lead bottom surface, and a lead side surface, and comprising a second electrode on the support surface;
a metal bonding portion connecting the first electrodes and the second electrode;
a sealing resin sealing the semiconductor chip, the lead, and the metal bonding portion; and
an external terminal formed on the lead bottom surface and the lead side surface and exposed from the sealing resin,
wherein the metal bonding portion comprises an alloy containing gold, a first gold-rich bonding layer on a first electrode side of the metal bonding portion and having a higher gold content than the alloy, and a second gold-rich bonding layer on a second electrode side of the metal bonding portion and having a higher gold content than the alloy, and a content ratio of gold in the first gold-rich bonding layer at a side facing the semiconductor chip is higher than a content ratio of gold in the first gold-rich bonding layer at an opposing side facing away the semiconductor chip.
2. The semiconductor device according to claim 1 , wherein the lead comprises a thick region provided on a lead side surface side and a thin region extending inward from the thick region, and the semiconductor chip is mounted on the thin region.
3. The semiconductor device according to claim 1 , wherein a bonding area of the metal bonding portion on the second electrode side is larger than a bonding area of the metal bonding portion on the first electrode side.
4. The semiconductor device according to claim 3 , wherein the lead comprises a thick region provided on a lead side surface side and a thin region extending inward from the thick region, and the semiconductor chip is mounted on the thin region.