Systems and methods for vector-short-open-calibration de-embedding of microwave circuits
A method of de-embedding a feed line is shown. The method includes measuring network parameters of a multilayered planar substrate and obtaining network parameters of a feed line using a short-open-calibration (SOC) according to an ABCD-matrix. An “a” block of the ABCD-matrix includes a first matrix multiplied by a transpose of a first short-circuit current. The first matrix is an inverse of a difference of an open-circuit current and a second short-circuit current. A “c” block of the ABCD-matrix includes the open-circuit current multiplied by the “a” block. The method includes de-embedding the network parameters of the feed line from the network parameters of the multilayered planar substrate to obtain microwave circuit network parameters and, responsive to the microwave circuit network parameters being within or not within a specified range, respectively approving or rejecting customer shipment of the microwave circuit.
1. A method comprising:
measuring network parameters of a multilayered planar substrate including a microwave circuit and a feed line with a first port at a reference plane coupled to the microwave circuit and a second port coinciding with a boundary of the multilayered planar substrate;
measuring, with reference to the first port and the second port, an open-circuit current, a first short-circuit current, and a second short-circuit current;
obtaining network parameters of the feed line using a short-open-calibration (SOC) according to an ABCD-matrix, wherein an “a” block of the ABCD-matrix comprises a first matrix multiplied by a transpose of the first short-circuit current, wherein the first matrix is an inverse of a difference of the open-circuit current and the second short-circuit current, and wherein a “c” block of the ABCD-matrix comprises the open-circuit current multiplied by the “a” block;
de-embedding the network parameters of the feed line from the network parameters of the multilayered planar substrate to obtain microwave circuit network parameters;
comparing the microwave circuit network parameters to a specified range; and
responsive to the microwave circuit network parameters being within or not within the specified range, respectively approving or rejecting customer shipment of the microwave circuit.
2. The method of claim 1 , wherein the open-circuit current is a first current at the first port with the second port open circuited, the first short-circuit current is a second current at the second port with the second port short circuited, and the second short-circuit current is a third current at the first port with the second port short circuited.
3. The method of claim 1 , wherein the first port is a plurality of first ports, the second port is a plurality of second ports, the feed line is a plurality of feed lines, and the SOC is a vector-SOC (VSOC).
4. The method of claim 1 , wherein the feed line generates a port discontinuity that is de-embedded in obtaining the microwave circuit network parameters.
5. The method of claim 1 , wherein network parameters of the multilayered planar substrate include S-parameters and the network parameters of the feed line include ABCD-parameters.
6. The method of claim 5 , the method further comprising converting the ABCD-parameters of the feed line to S-parameters of the feed line.
7. The method of claim 1 , wherein the microwave circuit is a distributed microwave circuit.
8. The method of claim 1 , wherein the microwave circuit is a multiport microwave circuit.
9. The method of claim 1 , wherein the multilayered planar substrate is a printed circuit board.
10. A system comprising:
a multilayered planar substrate including a microwave circuit and a feed line with a first port at a reference plane coupled to the microwave circuit and a second port coinciding with a boundary of the multilayered planar substrate; and
test equipment configured to:
measure, with reference to the first port and the second port, an open-circuit current, a first short-circuit current, and a second short-circuit current;
obtain network parameters of the feed line using a short-open-calibration (SOC) according to an ABCD-matrix, wherein an “a” block of the ABCD-matrix comprises a first matrix multiplied by a transpose of the first short-circuit current, wherein the first matrix is an inverse of a difference of the open-circuit current and the second short-circuit current, and wherein a “c” block of the ABCD-matrix comprises the open-circuit current multiplied by the a block;
de-embed the feed line to obtain microwave circuit network parameters;
compare the microwave circuit network parameters to a specified range; and
responsive to the microwave circuit network parameters being within or not within the specified range, respectively indicate passing or failing specifications for the microwave circuit.
11. The system of claim 10 , wherein the open-circuit current is a first current at the first port with the second port open circuited, the first short-circuit current is a second current at the second port with the second port short circuited, and the second short-circuit current is a third current at the first port with the second port short circuited.
12. The system of claim 10 , wherein the first port is a plurality of first ports, the second port is a plurality of second ports, the feed line is a plurality of feed lines, and the SOC is a vector-SOC (VSOC).
13. The system of claim 10 , wherein the feed line generates a port discontinuity that is de-embedded in obtaining the microwave circuit network parameters.
14. The system of claim 10 , wherein network parameters of the multilayered planar substrate include S-parameters and the network parameters of the feed line include ABCD-parameters.
15. The system of claim 14 , the test equipment further configured to convert the ABCD-parameters of the feed line to S-parameters of the feed line.
16. The system of claim 10 , wherein the microwave circuit is a distributed microwave circuit.
17. The system of claim 10 , wherein the microwave circuit is a multiport microwave circuit.
18. The system of claim 10 , wherein the multilayered planar substrate is a printed circuit board.
19. A method comprising:
simulating network parameters of a microwave circuit model including a reference port associated with a reference plane within the microwave circuit model and an external port coinciding with a boundary of the microwave circuit model;
simulating, with reference to the reference port and the external port, an open-circuit current, a first short-circuit current, and a second short-circuit current;
obtaining network parameters between the reference port and the external port using a short-open-calibration (SOC) according to an ABCD-matrix, wherein an “a” block of the ABCD-matrix comprises a first matrix multiplied by a transpose of the first short-circuit current, wherein the first matrix is an inverse of a difference of the open-circuit current and the second short-circuit current, and wherein a “c” block of the ABCD-matrix comprises the open-circuit current multiplied by the “a” block;
de-embedding discontinuities of the external port to obtain de-embedded microwave circuit model network parameters;
comparing the de-embedded microwave circuit model network parameters to a specified range; and
responsive to the de-embedded microwave circuit model network parameters being within or not within the specified range, respectively determining to use or not use the microwave circuit model as an input to a manufacturing process.
20. The method of claim 19 , wherein the reference port is coupled to the external port with a feed line.