Pixel package and method of making the same
A pixel package includes an electrode structure, a plurality of light-emitting units arranged on the electrode structure, and a light transmitting layer. The electrode structure has an upper layer with a first upper sheet, a lower layer with a first lower sheet, and a supporting layer arranged between the upper layer and the lower layer. The electrode structure and the plurality of light-emitting units are fully embedded in the light transmitting layer. In a top view of the pixel package, the first upper sheet is overlapped with and larger than the first lower sheet.
1. A pixel package, comprising:
an electrode structure comprising an upper layer with a first upper sheet, a lower layer with a first lower sheet, and a supporting layer arranged between the upper layer and the lower layer;
a plurality of light-emitting units each arranged on the electrode structure, and having a first top surface; and
a light transmitting layer having a second top surface located above the first top surface, wherein the electrode structure and the plurality of light-emitting units are fully embedded in the light transmitting layer,
wherein the upper layer has a total area which is larger than 50% area of the second top surface,
wherein, in a top view, the first upper sheet is overlapped with and larger than the first lower sheet.
2. The pixel package according to claim 1 , wherein, the lower layer has a portion exposed from the light transmitting layer.
3. The pixel package according to claim 1 , wherein the upper layer further comprises a second upper sheet.
4. The pixel package according to claim 3 , wherein the first upper sheet or the second upper sheet has a smallest width larger than 30 μm.
5. The pixel package according to claim 3 , wherein the upper layer and the lower layer have a same quantity of sheet.
6. The pixel package according to claim 1 , wherein the supporting layer comprises a plurality of metal pillars electrically and physically connecting the upper later and the lower layer.
7. The pixel package according to claim 6 , wherein each of the plurality of metal pillars has a diameter larger than 20 μm.
8. The pixel package according to claim 1 , wherein the electrode structure further comprises a plurality of electrode pairs arranged on the upper layer and connected to the plurality of light-emitting units.
9. The pixel package according to claim 8 , wherein the plurality of electrode pairs, the upper layer, the lower layer and the supporting layer have a same thickness.
10. The pixel package according to claim 9 , wherein the thickness is between 3 μm and 10 μm.
11. The pixel package according to claim 1 , wherein the lower layer and the light transmitting layer have bottom surfaces which are coplanar with each other.
12. The pixel package according to claim 11 , further comprising a solder mask arranged under the bottom surface of the light transmitting layer without covering the bottom surface of the lower layer.
13. The pixel package according to claim 12 , wherein the solder mask comprises an insulating material.
14. The pixel package according to claim 1 , wherein the plurality of light-emitting units comprises a light-emitting unit having a width between 100 μm and 500 μm.
15. The pixel package according to claim 1 , wherein the plurality of light-emitting units is configured to emit green light, red light or blue light.
16. The pixel package according to claim 1 , wherein the second top surface and the first top surface are separated from each other by a vertical distance between 10 μm and 100 μm.
17. The pixel package according to claim 1 , wherein, in the top view, the upper layer is larger than a total area of the plurality of light-emitting units.
18. The pixel package according to claim 1 , wherein, in the top view, the upper layer is larger than the lower layer.