NANOIMPRINT LITHOGRAPHY PROCESSES FOR SWITCHING MECHANICAL PROPERTIES OF IMPRINT MATERIALS

1 . A method, comprising:

applying an imprint mask to a nano-imprint lithography (NIL) material layer to create an imprinted NIL material layer, the NIL material layer comprised of a NIL material;

detaching the imprinted NIL material layer from the imprint mask, a modulus level of the NIL material below a flexibility threshold to cause a shape of the imprinted NIL material layer to remain unchanged after detachment; and

increasing the modulus level of the NIL material of the imprinted NIL material layer beyond a strength threshold to create an imprint layer, the imprint layer having a structure that remains unaffected by a subsequent process to form a second imprint layer matching a master mold pattern.

2 . The method of claim 1 , wherein the NIL material layer has one or more first reacted functional groups, and increasing the modulus level of the NIL material further comprises:

curing the imprinted NIL material layer to cause reaction in one or more second functional groups of the NIL material of the imprinted NIL material layer.

3 . The method of claim 2 , wherein the curing of the imprinted NIL material layer comprises curing the imprinted NIL material layer using ultraviolet (UV) light radiation.

4 . The method of claim 2 , wherein the curing of the imprinted NIL material layer comprises curing the imprinted NIL material layer using thermal energy.

5 . The method of claim 1 , wherein increasing the modulus level of the NIL material further comprises:

applying an overcoat layer of inorganic material to a surface of the imprinted NIL material layer using atomic layer deposition, the overcoat layer having a modulus level beyond the strength threshold.

6 . The method of claim 5 , wherein the inorganic material is at least one of Al 2 O 3 , AlN, and Er 2 O 3 .

7 . The method of claim 1 , wherein increasing the modulus level of the NIL material further comprises:

applying a layer of inorganic material to a surface of the imprinted NIL material layer using atomic layer deposition; and

causing the layer of inorganic material to reactively infuse into the imprinted NIL material layer, wherein a combined NIL material and infusion material has a modulus level beyond the strength threshold.

8 . A nano-imprint lithography (NIL) modification system, comprising:

a NIL imprinting system configured to apply an imprint mask to a NIL material layer;

a NIL material modification system configured to modify a modulus level of NIL material;

a NIL post-processing system configured to perform post-processing operations on an imprint layer; and

a controller to transmit instructions to the NIL modification system configured to:

apply an imprint mask to a nano-imprint lithography (NIL) material layer to create an imprinted NIL material layer, the NIL material layer comprised of a NIL material,

detach the imprinted NIL material layer from the imprint mask, the modulus level of the NIL material below a flexibility threshold to cause a shape of the imprinted NIL material layer to remain unchanged after detachment, and

increase the modulus level of the NIL material of the imprinted NIL material layer beyond a strength threshold to create a first imprint layer, the imprint layer having a structure that remains unaffected by a subsequent process to form a second imprint layer matching a master mold pattern.

9 . The system of claim 8 , wherein the NIL material layer has one or more first reacted functional groups reacted, and wherein further transmitted instructions from the controller cause the NIL modification system to:

cure the imprinted NIL material layer to cause reaction in one or more second functional groups of the NIL material of the imprinted NIL material layer.

10 . The system of claim 9 , wherein the cure of the imprinted NIL material layer uses ultraviolet (UV) light radiation.

11 . The system of claim 9 , wherein the curing of the imprinted NIL material layer uses thermal energy.

12 . The system of claim 8 , wherein further transmitted instructions from the controller cause the NIL modification system to

apply an overcoat layer of inorganic material to a surface of the imprinted NIL material layer using atomic layer deposition, the overcoat layer having a modulus level beyond the strength threshold.

13 . The system of claim 12 , wherein the inorganic material is at least one of Al 2 O 3 , AlN, and Er 2 O 3 .

14 . The method of claim 8 , wherein further transmitted instructions from the controller cause the NIL modification system to:

apply a layer of inorganic material to a surface of the imprinted NIL material layer using atomic layer deposition; and

cause the layer of inorganic material to reactively infuse into the imprinted NIL material layer, wherein a combined NIL material and infusion material has a modulus level beyond the strength threshold.

15 . The system of claim 8 , wherein the imprinted NIL material layer has a plasticizer previously infused within the NIL material of the imprinted NIL material layer, and wherein further transmitted instructions from the controller cause the NIL modification system to:

remove the plasticizer from the NIL material of the imprinted NIL material layer.

16 . The system of claim 15 , wherein the removal of the plasticizer is achieved by increasing a temperature and decreasing a pressure of a chamber containing the imprinted NIL material layer.

17 . An imprint layer manufactured by:

applying an imprint mask to a nano-imprint lithography (NIL) material layer to create an imprinted NIL material layer, the NIL material layer comprised of a NIL material;

detaching the imprinted NIL material layer from the imprint mask, a modulus level of the NIL material below a flexibility threshold to cause a shape of the imprinted NIL material layer to remain unchanged after detachment; and

increasing the modulus level of the NIL material of the imprinted NIL material layer beyond a strength threshold to create an imprint layer, the imprint layer having a structure that remains unaffected by a subsequent process to form a second imprint layer matching a master mold pattern.