Metal material with thermodynamic anisotropy and a method of preparing the same
A metal material having thermodynamic anisotropy has an X-axis hardness of 160-180 HV, an X-axis hardness thermal expansion coefficient of 5×10−6-100×10−6 K −1 ; a Y-axis hardness of 160-180 HV, a Y-axis hardness thermal expansion coefficient of 5×10−6-100×10−6 K −1 ; and a Z-axis hardness of 180-250 HV, a Z-axis hardness thermal expansion coefficient of 50×10−6-1000×10−6 K −1 . A method for preparing a metal material having thermodynamic anisotropy is also disclosed.
1. A method for preparing a metal material having thermodynamic anisotropy comprising:
(1) providing an electroplating base solution that includes a copper sulfate solution having a divalent copper ion concentration of 40 g/L, a sulfuric acid solution having a sulfuric acid concentration of 120 g/L, and a hydrochloric acid having a chloride ion concentration of 50 ppm;
(2) providing additives to the electroplating base solution, the additives including a carrier, a surfactant, an antioxidant, an organosulfate having a concentration of 4 mL/L, and a leveler having a concentration of 35 mL/L;
(3) mixing the additives with the electroplating base solution to form an electroplating solution; and
(4) conducting electroplating at a current density of 5 A/dm 2 for 40 minutes to form the metal material,
wherein the carrier is a copolymer of ethylene oxide and propylene oxide, the surfactant is polyethylene glycol, the antioxidant is sorbic acid or citric acid, the organosulfate is sodium lauryl sulfate, disodium 3,3-dithiobispropane-sulphonate, or 3, 3′-dithiobispropanesulfonic acid; and the leveler is
2. The method of claim 1 , wherein in the electroplating solution, the carrier has a concentration of 10-20 mL/L.
3. The method of claim 1 , wherein in the electroplating solution, the surfactant has a concentration of 20-120 mL/L.
4. The method of claim 1 , wherein in the electroplating solution, the antioxidant has a concentration of 10 g/L.