IP Library Granted Patent US 11,894,364
Granted Patent B2
US 11,894,364 · App. 17/572,653 · Granted Feb 6, 2024

Semiconductor device

Inventor: Hiroaki Takasu (Tokyo, JP)
Assignee: ABLIC Inc.
H01L27/0266H01L29/41775
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Quick Facts
Patent No.
US 11,894,364
App. No.
17/572,653
Granted
Feb 6, 2024
Kind
B2
Abstract

A semiconductor device has an off transistor ( 10 ) in which a gate electrode ( 3 ) and a source region ( 6 ) of an N-type MOS transistor are connected to a ground terminal and a drain region ( 5 ) is connected to an external signal terminal ( 100 b ). In the off transistor ( 10 ), the gate electrode ( 3 ) is extensively provided over a portion or entirety of the drain region ( 5 ) in addition to a channel region. A capacitance (C 2 ) formed between the gate electrode ( 3 ) and the drain region ( 5 ) may be greater than a capacitance (C 1 ) generated between the gate electrode ( 3 ) and a ground potential.

Claims (10)

1. A semiconductor device, comprising:

an off transistor in which a gate electrode and a source region of a MOS transistor are connected to a first power terminal or a second power terminal, and a drain region is connected to an external signal terminal,

wherein in the off transistor, the gate electrode is extensively provided over a portion or entirety of the drain region in addition to a channel region, and

a capacitance formed between the gate electrode and the drain region is greater than a capacitance generated between the gate electrode and a ground potential.

2. The semiconductor device according to claim 1 , wherein the gate electrode is provided with an opening at a place covering the drain region.

3. The semiconductor device according to claim 2 , wherein a shape of the opening is a rectangular shape in plan view.

4. The semiconductor device according to claim 3 , wherein the shape of the opening in plan view has a recess part in a portion of the rectangular shape.

5. The semiconductor device according to claim 1 , wherein the gate electrode is provided with an opening at a place covering the drain region.

6. The semiconductor device according to claim 5 , wherein a shape of the opening is a rectangular shape in plan view.

7. The semiconductor device according to claim 6 , wherein the shape of the opening in plan view has a recess part in a portion of the rectangular shape.

Assignments (2)
CHANGE OF ADDRESS Recorded Jun 8, 2023
From: ABLIC INC.
To: ABLIC INC.
Reel/Frame 064021/0575 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 12, 2022
From: TAKASU, HIROAKI
To: ABLIC INC.
Reel/Frame 058625/0943 →
Priority Claims (1)
JP 2021-009959 · Jan 26, 2021 · national
Continuity (1)
Related Publication 20220238510A1 · Jul 28, 2022