Cooling automotive power electronics
The present disclosure relates generally to methods and devices for the cooling (or removal of heat from) power electronics modules in automotive vehicles, wherein the cooling is done by positioning the power electronics module in a housing, directing a fluid into the housing, and impinging the fluid onto the power electronics module and/or an electrical connection in contact with the power electronics module.
1. A system for cooling a power electronics module using a fluid, the system comprising:
a housing comprising a thickness and configured to contain the power electronics module;
a molding comprising at least one slot and configured to extend through the thickness, creating a first seal with the thickness, and contact at least a portion of the power electronics module;
an electrical connection extending through the slot and comprising a planar surface which extends through the molding and a cylindrical extension which extends through the thickness, creating a second seal with the thickness; and
a manifold positioned within the housing; wherein:
the power electronics module comprises a first side and a second side,
the electrical connection is configured to contact at least a portion of the power electronics module,
the manifold is configured to direct the fluid to contact the first side and the second side,
the first seal comprises interlocking grooves of the molding and the thickness,
the second seal comprises interlocking grooves of the cylindrical extension and the thickness, and
the fluid is configured to contact the power electronics module and the electrical connection inside the housing.
2. The system of claim 1 , further comprising:
a first port configured to extend through the thickness; and
a second port configured to extend through the thickness; wherein:
the fluid is configured to enter the housing through the first port, and
the fluid is configured to exit the housing through the second port.
3. The system of claim 1 , wherein the fluid comprises a dielectric fluid.
4. The system of claim 3 , wherein the dielectric fluid comprises a synthetic hydrocarbon.
5. The system of claim 1 , wherein the molding is configured to contact the first side and the second side of the power electronics module.
6. The system of claim 1 , wherein:
the manifold comprises a first channel and a second channel,
the first channel is configured to direct the fluid to the first side of the power electronics module, and
the second channel is configured to direct the fluid to the second side of the power electronics module.
7. A method for cooling a power electronics module using a fluid, the method comprising:
positioning the power electronics module within a housing comprising a thickness;
directing, using a manifold positioned within the housing, the fluid to contact a first side and a second side of the power electronics module; and
extending an electrical connection to contact at least a portion of the power electronics module; wherein:
the positioning comprises extending a molding comprising at least one slot through the thickness, creating a first seal with the thickness, to contact at least a portion of the power electronics module,
the extending comprises extending a planar surface of an electrical connection through the molding to contact at least a portion of the power electronics module and extending a cylindrical connection of the electrical connection through the thickness, creating a second seal with the thickness, to contact at least a portion of the power electronics module,
the first seal comprises interlocking grooves of the molding and the thickness, and
the second seal comprises interlocking grooves of the cylindrical extension and the thickness.
8. The method of claim 7 , wherein:
the directing comprises:
allowing the fluid to enter the housing through a first port,
contacting the power electronics module with the fluid, and
allowing the fluid to exit the housing through a second port.