INSULATOR WITH CONDUCTIVE DISSIPATIVE COATING
Embodiments of the invention provide a conductive coating on an insulator of an x-ray tube and a method for applying the conductive coating. The method may use a first process, such as brazing, to join a support to the insulator and a second process, such as vapor deposition, to apply the conductive coating onto a substrate surface of the insulator. The second process may be carried out after the first process without any damage to x-ray tube insulator assembly.
1 . An insulator assembly for an x-ray tube, the insulator assembly comprising:
an insulator comprising:
at least one surface; and
a conductive dissipative coating applied to the at least one surface by a vapor deposition process, the conductive dissipative coating configured to reduce an electrical charge buildup on the insulator; and
at least one support joined to the insulator via a brazing process using a filler material, wherein the brazing process occurs before the conductive dissipative coating is applied,
wherein a process temperature of the vapor deposition process is lower than a melting point temperature of the filler material.
2 . The insulator assembly of claim 1 , wherein the conductive dissipative coating comprises a plurality of layers.
3 . The insulator assembly of claim 1 , wherein the at least one surface of the insulator is an outer surface of the insulator.
4 . The insulator assembly of claim 1 , wherein the at least one support is configured to mount the insulator assembly to a frame within the x-ray tube.
5 . The insulator assembly of claim 1 , wherein the filler material comprises a metal alloy.
6 . The insulator assembly of claim 1 , wherein the insulator comprises a ceramic material.
7 . The insulator assembly of claim 1 , wherein the conductive dissipative coating comprises aluminum nitride, boron nitride, chromium nitride, silicon nitride, titanium nitride, or combinations thereof.
8 . A method for manufacturing one or more x-ray tube insulators, the method comprising:
joining at least one support onto the one or more x-ray tube insulators using a brazing process in which a filler material is heated to a first temperature which exceeds a melting point temperature of the filler material;
after the brazing process is complete, applying a conductive dissipative coating to at least one surface of the one or more x-ray tube insulators using a vapor deposition process, the vapor deposition process occurring at a second temperature which is lower than the first temperature; and
mounting the one or more x-ray tube insulators to a frame of a respective x-ray tube using the at least one support.
9 . The method of claim 8 , wherein the one or more x-ray tube insulators comprises a plurality of x-ray tube insulators.
10 . The method of claim 9 , wherein the vapor deposition process is a batch vapor deposition process, further comprising:
applying the conductive dissipative coating to each of the plurality of x-ray tube insulators simultaneously.
11 . The method of claim 8 , further comprising:
after mounting the one or more x-ray tube insulators to the frame of the respective x-ray tube, removing the one or more x-ray tube insulators from the frame;
and
applying a second conductive dissipative coating to the at least one surface of the one or more x-ray tube insulators.
12 . The method of claim 8 , further comprising reducing an electrical charge buildup on the one or more x-ray tube insulators within the respective x-ray tube using the conductive dissipative coating.
13 . The method of claim 8 , further comprising applying the conductive dissipative coating within a vacuum environment.
14 . The method of claim 8 , wherein the vapor deposition process comprises: a physical vapor deposition process, a chemical vapor deposition process, a sputtering process, or a cathodic arc deposition process.
15 . An insulator assembly for an x-ray tube, the insulator assembly comprising:
an insulator comprising:
at least one surface; and
a conductive dissipative coating applied to the at least one surface by a coating application process; and
at least one support joined to the insulator via a joining process using a filler material,
wherein a process temperature of the coating application process is lower than a melting point temperature of the filler material.
16 . The insulator assembly of claim 15 , wherein the conductive dissipative coating comprises a plurality of conductive layers.
17 . The insulator assembly of claim 16 , wherein the plurality of conductive layers includes:
a first conductive layer comprising an aluminum nitride material.
18 . The insulator assembly of claim 17 , wherein the plurality of conductive layers further includes:
a second conductive layer comprising a boron nitride material.
19 . The insulator assembly of claim 15 , wherein a thickness of the conductive dissipative coating is between about 10 nanometers and about 10 micrometers.
20 . The insulator assembly of claim 15 , wherein the conductive dissipative coating comprises a first section and a second section, and wherein a thickness of the second section is greater than a thickness of the first section.