IP Library Granted Patent US 12,084,575
Granted Patent B2
US 12,084,575 · App. 17/577,919 · Granted Sep 10, 2024

Polyamide-imide film, preparation method thereof, cover window and display device comprising the same

Inventors: Sang Hun Choi (Gyeonggi-do, KR); Jin Woo Lee (Gyeonggi-do, KR); Jung Hee Ki (Gyeonggi-do, KR); Dae Seong Oh (Gyeonggi-do, KR); Han Jun Kim (Gyeonggi-do, KR); Sun Hwan Kim (Gyeonggi-do, KR); Heung Sik Kim (Gyeonggi-do, KR)
Assignee: SK MICROWORKS CO., LTD.
C08L79/08B32B27/281C08G73/1039C08G73/14C08J5/18C08K3/30C08K3/36B32B2264/025B32B2264/1021B32B2264/104B32B2264/301B32B2264/302B32B2307/412B32B2457/20C08K2003/3045C08K2201/003C08K2201/009C08K2201/011C08L2203/20
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Quick Facts
Patent No.
US 12,084,575
App. No.
17/577,919
Granted
Sep 10, 2024
Kind
B2
Abstract

The embodiments relate to a polyamide-imide film excellent in optical properties and mechanical properties, to a process for preparing the same, and to a cover window and a display device comprising the same. There are provided a polyamide-imide film, which comprises a polyamide-imide polymer and has a reduced modulus of a top surface measured by the nanoindentation method according to the ISO 14577-2 standard of 5.6 GPa or more and a haze of 1% or less, a process for preparing the same, and a cover window and a display device comprising the same.

Claims (18)

1. A polyamide-imide film, which comprises a polyamide-imide polymer and has a reduced modulus of a top surface measured by the nanoindentation method according to the ISO 14577-2 standard of 6.0 GPa or more, a hardness of the top surface measured by the nanoindentation method according to the ISO 14577-2 standard of 0.35 GPa or more, and a haze of 1% or less, and wherein the polyamide-imide film further comprises a filler, and the filler has a hardness of 2.5 to 6.

2. The polyamide-imide film of claim 1 , wherein the average particle diameter of the filler is 80 nm to 500 nm.

3. The polyamide-imide film of claim 1 , wherein the content of the filler is 100 ppm to 3,000 ppm based on the total weight of the solids content of the polyamide-imide polymer.

4. The polyamide-imide film of claim 1 , wherein the filler is at least one selected from the group consisting of barium sulfate, silica, and an acrylate polymer.

5. The polyamide-imide film of claim 1 , wherein the polyamide-imide polymer comprises an imide-based repeat unit and an amide-based repeat unit at a molar ratio of 2:98 to 50:50.

6. A cover window for a display device, which comprises a polyamide-imide film and a functional layer,

wherein the polyamide-imide film comprises a polyamide-imide polymer and has a reduced modulus of a top surface measured by the nanoindentation method according to the ISO 14577-2 standard of 6.0 GPa or more, a hardness of the top surface measured by the nanoindentation method according to the ISO 14577-2 standard of 0.35 GPa or more, and a haze of 1% or less, and wherein the polyamide-imide film further comprises a filler, and the filler has a hardness of 2.5 to 6.

7. A display device, which comprises a display unit; and a cover window disposed on the display unit,

wherein the cover window comprises a polyamide-imide film and a functional layer, and

the polyamide-imide film comprises a polyamide-imide polymer and has a reduced modulus of a top surface measured by the nanoindentation method according to the ISO 14577-2 standard of 6.0 GPa or more, a hardness of the top surface measured by the nanoindentation method according to the ISO 14577-2 standard of 0.35 GPa or more, and a haze of 1% or less, and wherein the polyamide-imide film further comprises a filler, and the filler has a hardness of 2.5 to 6.

8. A process for preparing the polyamide-imide film according to claim 1 , which comprises:

polymerizing a diamine compound, a dianhydride compound, and a dicarbonyl compound in an organic solvent to prepare a polyamide-imide polymer solution;

charging the polymer solution into a tank;

extruding and casting the polymer solution in the tank and then drying it to prepare a gel sheet; and

thermally treating the gel sheet,

wherein the polymerizing step is carried out at a temperature of −20 to 15° C., and

wherein a step of adding a filler dispersion in which the filler is dispersed to the solution is carried out after the polymerizing step.

9. The process for preparing the polyamide-imide film of claim 8 , wherein the solids content of the filler contained in the filer dispersion is 10% by weight to 30% by weight.

Assignments (5)
CHANGE OF NAME Recorded Jan 15, 2026
From: SK MICROWORKS SOLUTIONS CO., LTD.
To: MICROWORKS SOLUTIONS CO., LTD.
Reel/Frame 074078/0923 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 24, 2025
From: SK MICROWORKS CO., LTD.
To: SK MICROWORKS SOLUTIONS CO., LTD.
Reel/Frame 070929/0875 →
CORRECTIVE ASSIGNMENT TO CORRECT THE THE ASSIGNMENT DOCUMENT PREVIOUSLY RECORDED AT REEL: 063240 FRAME: 0192. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Dec 8, 2023
From: SKC CO., LTD.
To: SK MICROWORKS CO., LTD.
Reel/Frame 065841/0822 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 3, 2023
From: SKC CO., LTD.
To: SK MICROWORKS CO., LTD.
Reel/Frame 063240/0192 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 18, 2022
From: CHOI, SANG HUN; LEE, JIN WOO; KI, JUNG HEE; OH, DAE SEONG; KIM, HAN JUN; KIM, SUN HWAN; KIM, HEUNG SIK
To: SKC CO., LTD.
Reel/Frame 058680/0717 →