Micro OLEDs having narrow bezel
A device such as a micro-OLED includes a display element having a display active area disposed over a silicon backplane and a display driver integrated circuit (DDIC) electrically coupled to the display element through at least one contact that extends through the silicon backplane. Through silicon via (TSV) technology may be used to form the contacts. A chip-on-flex architecture may be used to orient and attach the DDIC to the silicon backplane.
1. A device comprising:
a display element having a display active area disposed over a front face of a silicon backplane; and
a display driver integrated circuit (DDIC), formed on a substrate layer, such that:
the DDIC is formed on a first surface of the substrate layer;
an opposing face of the substrate layer that is opposite the first surface of the substrate layer is coupled to a rear face of the silicon backplane such that the silicon backplane overlies the entirety of the display driver integrated circuit; and
the DDIC is electronically coupled to the display element by at least one contact that extends through a portion of the silicon backplane that is disposed between the display active area and the display driver integrated circuit.
2. The device of claim 1 , wherein the display active area completely overlies the display driver integrated circuit.
3. The device of claim 1 , wherein the display active area comprises a micro-OLED.
4. The device of claim 1 , wherein the display active area comprises at least 90% of an area of the silicon backplane.
5. The device of claim 1 , wherein the silicon backplane comprises single crystal silicon.
6. The device of claim 1 , wherein the substrate layer comprises a flexible substrate.
7. The device of claim 6 , wherein the flexible substrate is bonded to a surface of the silicon backplane opposite to the display element.
8. The device of claim 1 , wherein the contact comprises a metal.
9. The device of claim 1 , further comprising a plurality of pixel transistors disposed between the silicon backplane and the display element.
10. The device of claim 1 , further comprising a multiplexer communicatively coupling the display element to the display driver integrated circuit.
11. The device of claim 1 , wherein the silicon backplane is coupled to the DDIC using a chip-on-flex assembly.
12. The device of claim 11 , further comprising an environmental protection layer that encapsulates the DDIC.
13. The device of claim 12 , wherein the environmental protection layer comprises a thermally conductive compound.
14. A display system comprising:
a display device comprising:
a display element having a display active area disposed over a front face of a silicon backplane;
a display driver integrated circuit (DDIC), formed on a substrate layer, such that:
the DDIC is formed on a first surface of the substrate layer;
an opposing face of the substrate layer that is opposite the first surface of the substrate layer is coupled to a rear face of the silicon backplane such that the silicon backplane overlies the entirety of the display driver integrated circuit; and
the DDIC is electronically coupled to the display element by at least one contact that extends through a portion of the silicon backplane that is disposed between the display active area and the display driver integrated circuit; and
a frame that is configured to hold the display device in front of a user's eye.
15. The display system of claim 14 , wherein the display active area completely overlies the display driver integrated circuit.
16. The display system of claim 14 , wherein the display active area comprises a micro-OLED.
17. The display system of claim 14 , wherein the display active area comprises at least 90% of an area of the silicon backplane.
18. The display system of claim 14 , wherein the silicon backplane comprises single crystal silicon.
19. The display system of claim 14 , wherein the display driver integrated circuit is bonded to a flexible substrate and the flexible substrate is located between the display driver integrated circuit and the silicon backplane.
20. A method comprising:
forming at least one metallized via that extends entirely through a silicon backplane;
forming a display element comprising an LED-containing display active area over a front face of the silicon backplane such that the display element is electronically coupled to and overlies the at least one metallized via; and
forming a display driver integrated circuit (DDIC) over a rear face of the silicon backplane such that:
the DDIC is formed on a first surface of a substrate layer;
an opposing face of the substrate layer that is opposite the first surface of the substrate layer is coupled to the silicon backplane such that the silicon backplane overlies the entirety of the display driver integrated circuit;
the at least one metallized via is disposed between the display element and the DDIC; and
the DDIC is electronically coupled to the display element by the at least one metallized via.