Copper alloys with high strength and high conductivity, and processes for making such copper alloys
A copper alloy that is devoid of beryllium and has a 0.2% offset yield strength of at least 70 ksi and an electrical conductivity of at least 75% IACS is disclosed. The copper alloy comprises chromium, silicon, silver, titanium, zirconium, and balance copper. The alloy is prepared by cold working, solution annealing, and aging. The alloy can be used in several different applications.
1. A copper alloy, comprising:
from about 0.55 wt % to about 0.85 wt % chromium;
from about 0.02 wt % to about 0.1 wt % silicon;
from about 0.1 wt % to about 0.2 wt % silver;
from about 0.015 wt % to about 0.05 wt % titanium;
from about 0.02 wt % to about 0.06 wt % zirconium, wherein the zirconium is present as zirconium oxide; and
balance copper;
wherein the copper alloy has a 0.2% offset yield strength of at least 70 ksi and an electrical conductivity of at least 75% IACS and wherein the copper alloy is devoid of zirconium silicides.
2. The copper alloy of claim 1 , further having an ultimate tensile strength of at least 80 ksi.
3. The copper alloy of claim 1 , further having a % total elongation to break of at least 7%.
4. The copper alloy of claim 1 , further having a formability ratio in the longitudinal direction to the transverse direction of 0.0/0.0.
5. The copper alloy of claim 1 , wherein the copper alloy has a 0.2% offset yield strength of at least 75 ksi and an electrical conductivity of at least 80% IACS.
6. The copper alloy of claim 1 , wherein the copper alloy has an ultimate tensile strength of at least 75 ksi; and a % total elongation to break of at least 7%.
7. The copper alloy of claim 1 , wherein the copper alloy does not contain tin or beryllium.
8. An article formed from the copper alloy of claim 1 .
9. The article of claim 8 , wherein the article is a billet, plate, strip, foil, wire, rod, tube, or bar.