Connectors for high density neural interfaces

1. A lead assembly comprising:

a cable comprising a proximal end, a distal end, and first conductive traces;

a connector comprising a core and a supporting structure wrapped around at least a portion of the core, wherein:

the connector is located at the proximal end of the cable;

the supporting structure comprises a first layer of dielectric material and a second layer of dielectric material;

the first layer of dielectric material is a high temperature liquid crystal polymer;

the second layer of dielectric material is a low temperature liquid crystal polymer that is reflowed to attach the supporting structure to the core;

second conductive traces are buried between the first layer of dielectric material and the second layer of dielectric material;

the second conductive traces terminate at conductive contacts formed on a surface of the first layer of dielectric material; and

the connector has a predetermined shape or profile, which facilitates alignment and insertion of the connector into a header; and

an electrode assembly located at the distal end of the cable, the electrode assembly comprising electrodes electrically connected to the conductive contacts via the first conductive traces and the second conductive traces.

2. The lead assembly of claim 1 , wherein the connector further comprises a sealing feature, which is a section of the predetermined shape or profile at a distal end of the connector, and the sealing feature comprises a different material, texture, or stiffness from the core and the supporting structure to engage a sealing surface of the header.

3. The lead assembly of claim 1 , wherein the connector further comprises a retention feature for mechanical retention or connection with a corresponding feature in the header to retain insertion of the connector in the header.

4. The lead assembly of claim 1 , wherein the predetermined shape or profile is a square shaped profile having quadruple planar sectors, and one or more contacts of the contacts are arranged in each sector of the quadruple planar sectors.

5. The lead assembly of claim 4 , wherein the connector further comprises one or more additional contacts with impedance, resistive, or ohmic fiducials to provide orientation queues of the contacts.

6. The lead assembly of claim 1 , wherein the connector further comprises multiple sectors extending along the surface of the first dielectric layer, and one or more contacts of the conductive contacts are arranged in each sector of the multiple sectors.

7. The lead assembly of claim 6 , wherein the conductive contacts are arranged as split annular rings positioned around an axis of the connector and exposed on the surface of the first dielectric layer, and a first portion of the split annular rings is disposed in a first sector of the multiple sectors and a second portion of the split annular rings is disposed in a second sector of the multiple sectors.

8. The lead assembly of claim 6 , wherein the predetermined shape or profile is a “D”-shaped profile, the contacts are arranged as split rings on the surface of the first layer of dielectric material in the curved portion of the “D”-shaped profile, and the flat portion of the “D”-shaped profile is an indexing feature for keying during insertion of the connector into the header.

9. The lead assembly of claim 6 , wherein the predetermined shape or profile is a notched profile, the contacts are arranged as split rings on the surface of the first layer of dielectric material in a curved portion of the notched profile, and a notch of the notched profile is an indexing feature for keying during insertion of the connector into the header.

10. The lead assembly of claim 9 , wherein a first portion of the split annular rings is disposed in a first sector of the multiple sectors and a second portion of the split annular rings is disposed in a second sector of the multiple sectors.

11. The lead assembly of claim 9 , wherein each split annular ring is spaced apart from one another on the surface by a region of the first layer of the dielectric material.

12. A header and lead assembly comprising:

a connector comprising a core and a first supporting structure wrapped around at least a portion of the core, wherein:

the first supporting structure comprises a first layer of dielectric material and a second layer of dielectric material;

the first layer of dielectric material is a high temperature liquid crystal polymer;

the second layer of dielectric material is a low temperature liquid crystal polymer that is reflowed to attach the first supporting structure to the core;

first conductive traces are buried between the first layer of dielectric material and the second layer of dielectric material;

the first conductive traces terminate at first conductive contacts formed on a surface of the first dielectric layer; and

the connector has a first predetermined shape or profile;

a header comprising a second supporting structure, wherein:

the second supporting structure comprises one or more layers of polymer;

second conductive traces are buried between the one or more layers of polymer;

the second conductive traces terminate at second conductive contacts formed on a surface of the one or more layers of polymer; and

the header has a second predetermined shape or profile structured to receive the first predetermined shape or profile of the connector; and

a clip structured to hold the first conductive contacts in electrical contact with the second conductive contacts.

13. The header and lead assembly of claim 12 , wherein the first predetermined shape or profile is a blade shape with the first supporting structure folded over the core, and the first conductive contacts face outward on the surface of the first layer of dielectric material.

14. The header and lead assembly of claim 12 , wherein the clip is one or more clip springs or spring-fibers arranged into a comb or rib-cage arrangement on an outside of the second supporting structure, and the clip springs or spring-fibers have a spring force that exerts a clasping pressure on the second supporting structure to electrically connect the header to the connector.

15. The header and lead assembly of claim 14 , further comprising a cable comprising a proximal end, a distal end, and third conductive traces, wherein the connector is located at the proximal end of the cable.

16. The header and lead assembly of claim 15 , further comprising an electrode assembly located at the distal end of the cable, the electrode assembly comprising electrodes electrically connected to the second conductive traces via the third conductive traces, the first conductive traces, the first conductive contacts, and the second conductive contacts.

17. The header and lead assembly of claim 12 , wherein the connector further comprises multiple sectors extending along the surface of the first layer of dielectric material, and one or more contacts of the first conductive contacts are arranged in each sector of the multiple sectors.

18. The header and lead assembly of claim 17 , wherein the first conductive contacts are arranged as split rows positioned in columns and exposed on the surface of the first layer of dielectric material, and a first portion of the split rows is disposed in a first sector of the multiple sectors and a second portion of the split rows is disposed in a second sector of the multiple sectors.

19. The header and lead assembly of claim 18 , wherein the first sector is located on a first side of the connector and the second sector is located on a second side of the connector.

20. A lead assembly comprising:

a first cable comprising a proximal end and a distal end;

a second cable comprising a proximal end and a distal end;

a connection assembly comprising:

a first connector comprising a core and a first supporting structure wrapped around at least a portion of the core, wherein:

the first connector is located at the proximal end of the first cable;

the first supporting structure comprises a first layer of dielectric material and a second layer of dielectric material;

the first layer of dielectric material is a high temperature liquid crystal polymer;

the second layer of dielectric material is a low temperature liquid crystal polymer that is reflowed to attach the first supporting structure to the core;

first conductive traces are buried between the first layer of dielectric material and the second layer of dielectric material; and

the first conductive traces terminate at first conductive contacts formed on a surface of the first layer of dielectric material;

a second connector comprising a second supporting structure, wherein:

the second connector is located at the distal end of the second cable;

the second supporting structure comprises a one or more layers of polymer;

second conductive traces are buried between the one or more layers of polymer; and

the second conductive traces terminate at second conductive contacts formed on a surface of the one or more layers of polymer; and

one or more attachment features that hold the first connector in physical contact with the second connector such that the first conductive contacts are in electrical contact with the second conductive contacts.