SURFACE PROTECTION FILM, METHOD FOR MANUFACTURING SURFACE PROTECTION FILM, AND METHOD FOR MANUFACTURING ORGANIC LIGHT-EMITTING ELECTRONIC DEVICE
The present application relates to a surface protective film, a method for preparing a surface protective film, and a method for manufacturing an organic light emitting electronic device.
1 . A surface protective film comprising:
a base layer; and
an adhesive layer provided on one surface of the base layer,
wherein the adhesive layer includes a cured material of an adhesive composition including a urethane polymer; an acryl-based polymer; and a curing agent;
the acryl-based polymer includes a (meth)acrylate monomer including an alkyl group having 10 or more carbon atoms; a (meth)acrylate monomer including a hydroxyl group; and a (meth)acrylate monomer including silicone as a monomer unit; and
a peel strength when peeling a surface opposite to the base layer-provided surface of the adhesive layer from glass at a peeling rate of 1.8 m/min and a peeling angle of 180° is greater than or equal to 0.5 gf/in and less than or equal to 5 gf/in.
2 . The surface protective film of claim 1 , wherein the adhesive layer has an adhesive strength retention rate of 45% or greater:
the adhesive strength retention rate of the adhesive layer is (high temperature peel strength)/(low temperature peel strength)×100(%);
low temperature peel strength obtained when attaching the adhesive layer of the surface protective film to glass, storing the result for 24 hours at 25° C., and then peeling the surface protective film from the glass at a peeling rate of 1.8 m/min and a peeling angle of 180° at a temperature of 25° C.; and
high temperature peel strength obtained when attaching the adhesive layer of the surface protective film to glass, storing the result for 24 hours at 25° C. and then 1 minute at 50° C., and peeling the surface protective film from the glass at a peeling rate of 1.8 m/min and a peeling angle of 180° at a temperature of 50° C.
3 . The surface protective film of claim 1 , wherein peel strength when peeling a surface opposite to the base layer-provided surface of the adhesive layer from glass at a peeling rate of 30 m/min and a peeling angle of 180° that is greater than or equal to 1 gf/in and less than or equal to 10 gf/in.
4 . The surface protective film of claim 1 , wherein a surface opposite to the base layer-provided surface of the adhesive layer has a residual adhesion rate of 80% or greater.
5 . The surface protective film of claim 1 , wherein the acryl-based polymer is included in 1 parts by weight to 20 parts by weight, with respect to 100 parts by weight of the urethane polymer.
6 . The surface protective film of claim 1 , wherein the acryl-based polymer has a weight average molecular weight of 10,000 g/mol to 70,000 g/mol.
7 . The surface protective film of claim 1 , wherein the (meth)acrylate monomer including an alkyl group having 10 or more carbon atoms is included in 5% by weight to 20% by weight, with respect to a total amount of the monomer unit included in the acryl-based polymer.
8 . The surface protective film of claim 1 , wherein the (meth)acrylate monomer including silicone is included in 0.1% by weight to 5% by weight, with respect to a total amount of the monomer unit included in the acryl-based polymer.
9 . The surface protective film of claim 1 , wherein the (meth)acrylate monomer including a hydroxyl group is included in 1% by weight to 20% by weight, with respect to a total amount of the monomer unit included in the acryl-based polymer.
10 . The surface protective film of claim 1 , wherein the urethane polymer has a weight average molecular weight of 60,000 g/mol to 160,000 g/mol.
11 . The surface protective film of claim 1 , wherein the urethane polymer includes a hydroxyl group.
12 . The surface protective film of claim 1 , wherein the base layer includes a base film; and a first antistatic layer and a second antistatic layer provided on both surfaces of the base film, and the adhesive layer is provided on a surface of the second antistatic layer opposite to the surface provided to the base layer.
13 . The surface protective film of claim 1 , further comprising a protective layer provided on a surface of the adhesive layer opposite to the surface provided to the base layer.
14 . The surface protective film of claim 13 , wherein the protective layer consecutively includes a release layer; a third antistatic layer; a protective film; and a fourth antistatic layer, and the adhesive layer is provided on a surface of the release layer opposite to the surface presented to the third release layer.
15 . An adhesive composition comprising:
a urethane polymer;
an acryl-based polymer; and
a curing agent,
wherein the acryl-based polymer includes a (meth)acrylate monomer including an alkyl group having 10 or more carbon atoms; a (meth)acrylate monomer including a hydroxyl group; and a (meth)acrylate monomer including silicone as a monomer unit.
16 . A method for preparing the surface protective film of claim 1 , the method comprising:
coating the adhesive composition on one surface of the base layer; and
curing the coated adhesive composition,
wherein the adhesive composition includes a urethane polymer; an acryl-based polymer; and a curing agent; and
the acryl-based polymer includes a (meth)acrylate monomer including an alkyl group having 10 or more carbon atoms; a (meth)acrylate monomer including a hydroxyl group; and a (meth)acrylate monomer including silicone as a monomer unit.
17 . A method for manufacturing an organic light emitting electronic device, the method comprising attaching the adhesive layer of the surface protective film of claim 1 on an encapsulation layer of an organic light emitting device.
18 . The method for manufacturing an organic light emitting electronic device of claim 17 , wherein the organic light emitting device consecutively includes glass, a plastic substrate, a thin film transistor, an organic light emitting diode and an encapsulation layer.
19 . The method for manufacturing an organic light emitting electronic device of claim 17 , further comprising:
peeling off the surface protective film from the encapsulation layer; and
laminating a touch screen panel and a cover window on the encapsulation layer.