IP Library Patent Application 17605531
Patent Application
App. No. 17/605,531

SURFACE PROTECTION FILM, METHOD FOR MANUFACTURING SURFACE PROTECTION FILM, AND METHOD FOR MANUFACTURING ORGANIC LIGHT-EMITTING ELECTRONIC DEVICE

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Quick Facts
Patent No.
US None
App. No.
17/605,531
Abstract

The present application relates to a surface protective film, a method for preparing a surface protective film, and a method for manufacturing an organic light emitting electronic device.

Claims (37)

1 . A surface protective film comprising:

a base layer; and

an adhesive layer provided on one surface of the base layer,

wherein the adhesive layer includes a cured material of an adhesive composition including a urethane polymer; an acryl-based polymer; and a curing agent;

the acryl-based polymer includes a (meth)acrylate monomer including an alkyl group having 10 or more carbon atoms; a (meth)acrylate monomer including a hydroxyl group; and a (meth)acrylate monomer including silicone as a monomer unit; and

a peel strength when peeling a surface opposite to the base layer-provided surface of the adhesive layer from glass at a peeling rate of 1.8 m/min and a peeling angle of 180° is greater than or equal to 0.5 gf/in and less than or equal to 5 gf/in.

2 . The surface protective film of claim 1 , wherein the adhesive layer has an adhesive strength retention rate of 45% or greater:

the adhesive strength retention rate of the adhesive layer is (high temperature peel strength)/(low temperature peel strength)×100(%);

low temperature peel strength obtained when attaching the adhesive layer of the surface protective film to glass, storing the result for 24 hours at 25° C., and then peeling the surface protective film from the glass at a peeling rate of 1.8 m/min and a peeling angle of 180° at a temperature of 25° C.; and

high temperature peel strength obtained when attaching the adhesive layer of the surface protective film to glass, storing the result for 24 hours at 25° C. and then 1 minute at 50° C., and peeling the surface protective film from the glass at a peeling rate of 1.8 m/min and a peeling angle of 180° at a temperature of 50° C.

3 . The surface protective film of claim 1 , wherein peel strength when peeling a surface opposite to the base layer-provided surface of the adhesive layer from glass at a peeling rate of 30 m/min and a peeling angle of 180° that is greater than or equal to 1 gf/in and less than or equal to 10 gf/in.

4 . The surface protective film of claim 1 , wherein a surface opposite to the base layer-provided surface of the adhesive layer has a residual adhesion rate of 80% or greater.

5 . The surface protective film of claim 1 , wherein the acryl-based polymer is included in 1 parts by weight to 20 parts by weight, with respect to 100 parts by weight of the urethane polymer.

6 . The surface protective film of claim 1 , wherein the acryl-based polymer has a weight average molecular weight of 10,000 g/mol to 70,000 g/mol.

7 . The surface protective film of claim 1 , wherein the (meth)acrylate monomer including an alkyl group having 10 or more carbon atoms is included in 5% by weight to 20% by weight, with respect to a total amount of the monomer unit included in the acryl-based polymer.

8 . The surface protective film of claim 1 , wherein the (meth)acrylate monomer including silicone is included in 0.1% by weight to 5% by weight, with respect to a total amount of the monomer unit included in the acryl-based polymer.

9 . The surface protective film of claim 1 , wherein the (meth)acrylate monomer including a hydroxyl group is included in 1% by weight to 20% by weight, with respect to a total amount of the monomer unit included in the acryl-based polymer.

10 . The surface protective film of claim 1 , wherein the urethane polymer has a weight average molecular weight of 60,000 g/mol to 160,000 g/mol.

11 . The surface protective film of claim 1 , wherein the urethane polymer includes a hydroxyl group.

12 . The surface protective film of claim 1 , wherein the base layer includes a base film; and a first antistatic layer and a second antistatic layer provided on both surfaces of the base film, and the adhesive layer is provided on a surface of the second antistatic layer opposite to the surface provided to the base layer.

13 . The surface protective film of claim 1 , further comprising a protective layer provided on a surface of the adhesive layer opposite to the surface provided to the base layer.

14 . The surface protective film of claim 13 , wherein the protective layer consecutively includes a release layer; a third antistatic layer; a protective film; and a fourth antistatic layer, and the adhesive layer is provided on a surface of the release layer opposite to the surface presented to the third release layer.

15 . An adhesive composition comprising:

a urethane polymer;

an acryl-based polymer; and

a curing agent,

wherein the acryl-based polymer includes a (meth)acrylate monomer including an alkyl group having 10 or more carbon atoms; a (meth)acrylate monomer including a hydroxyl group; and a (meth)acrylate monomer including silicone as a monomer unit.

16 . A method for preparing the surface protective film of claim 1 , the method comprising:

coating the adhesive composition on one surface of the base layer; and

curing the coated adhesive composition,

wherein the adhesive composition includes a urethane polymer; an acryl-based polymer; and a curing agent; and

the acryl-based polymer includes a (meth)acrylate monomer including an alkyl group having 10 or more carbon atoms; a (meth)acrylate monomer including a hydroxyl group; and a (meth)acrylate monomer including silicone as a monomer unit.

17 . A method for manufacturing an organic light emitting electronic device, the method comprising attaching the adhesive layer of the surface protective film of claim 1 on an encapsulation layer of an organic light emitting device.

18 . The method for manufacturing an organic light emitting electronic device of claim 17 , wherein the organic light emitting device consecutively includes glass, a plastic substrate, a thin film transistor, an organic light emitting diode and an encapsulation layer.

19 . The method for manufacturing an organic light emitting electronic device of claim 17 , further comprising:

peeling off the surface protective film from the encapsulation layer; and

laminating a touch screen panel and a cover window on the encapsulation layer.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 24, 2025
From: LG CHEM, LTD.
To: XINMEI FONTANA HOLDING (HONG KONG) LIMITED
Reel/Frame 070608/0517 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 23, 2025
From: LG CHEM, LTD
To: XINMEI FONTANA HOLDING (HONG KONG) LIMITED
Reel/Frame 070609/0245 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 21, 2021
From: CHOI, JEONG MIN; KIM, HYUN CHEOL; KIM, SOJIN; KANG, HYUNGOO; LYM, JAE SEUNG
To: LG CHEM, LTD.
Reel/Frame 057870/0535 →