Method for producing textured solar wafers
The present invention relates to a method for producing solar wafers textured at least on one side, wherein in a first method step, sawn solar wafers with sawing damage are provided, and at the end of the last method step textured solar wafers with different size types of large and small pyramids are provided, and wherein the textured solar wafers can then be further processed to produce solar cells. The problem addressed by the present invention is that of providing an improved texturing method within the framework of the technology for the production of solar cells. This problem is solved by a method for producing textured solar wafers wherein in the first texture etching step the large pyramids are created in a low surface area density such that at the end of the method less than 30% of the textured surface of the solar wafer is occupied by the large pyramids; and in the second texture etching step the small pyramids are produced with a large surface area density.
1. A method for producing solar wafers textured on at least one side, wherein,
in a first method step, sawn solar wafers with sawing damage are provided and, at an end of a last method step, textured solar wafers with different size types of large and small pyramids are provided,
the large pyramids have a height above 4 μm and the small pyramids have a height below 4 μm,
the textured solar wafers can subsequently be further processed into solar cells,
the method includes a first texture etching step and a second texture etching step,
in the first texture etching step, by using a first texture etching solution containing from 1 to 15% KOH or NaOH or NH 4 OH or TMAH the large pyramids are created in a lower surface density, so that the first texture etching step-solution removes the sawing damage and at an end of the method less than 30% of a textured surface of the solar wafers is occupied by the large pyramids,
in the second texture etching step, by using a second texture etching solution that is a different etching solution composition than the first texture etching solution, the second texture etching solution containing from 1 to 5% KOH or NaOH or NH 4 OH or TMAH and a texture additive, the small pyramids are produced with a greater surface density, and
the large pyramids and the small pyramids occur in a statistical 2-fold or multiple distribution.
2. The method according to claim 1 , wherein the first texture etching step immediately follows the first method step in a second method step.
3. The method according to claim 1 , wherein the first texture etching solution contains a texture additive.
4. The method according to claim 1 , wherein at least one rinsing step is carried out between the first texture etching step and the second texture etching step.
5. The method according to claim 1 , wherein at least one cleaning step is carried out between the first texture etching step and the second texture etching step and/or at least one rinsing step.
6. The method according to claim 1 , wherein that the large pyramids are produced on less than 10% of the textured surface and the small pyramids are produced on more than 90% of the textured surface of the solar wafer.
7. A production line, wherein the production line for carrying out the method according to claim 1 is equipped with corresponding baths, wherein, in the production line, a first texture etching station is arranged as a first wet-chemical processing station and a second first texture etching station is arranged at a production line position located further back.
8. A Solar cell, wherein the solar cell is produced from a solar wafer that is produced using the method according to claim 1 with large pyramids and the small pyramids being present in a statistical 2-fold or multiple distribution within solar wafer texturing.
9. The solar cell according to claim 8 , wherein the solar cell has a thickness below 150 μm.
10. The method according to claim 1 , wherein the large pyramids have a height of 6 μm and most of the small pyramids have a height of 2 μm.