Granted Patent B2

US 12,187,878 · App. 17/610,768 · Granted Jan 7, 2025

Inventors: Per-Ola Hagstrand (Stenungsund, SE); Thomas Gkourmpis (Stenungsund, SE); Christian Müller (Gothenburg, SE); Yingwei Ouyang (Gothenburg, SE)

Assignee: BOREALIS AG

C08L23/06B32B27/32H01B3/441H01B9/027B32B15/085B32B15/20B32B27/08B32B27/18B32B2270/00B32B2307/202B32B2307/206C08L2203/202C08L2205/03C08L2207/02

Abstract

Claims (28)

1. A polymer composition comprising:

(i) 40 to 90 wt % of a low density polyethylene (LDPE);

(ii) 12 to 25 wt % of a polypropylene homopolymer; and

(iii) 1.0 to 15 wt % of a random heterophasic polypropylene copolymer.

2. The polymer composition as claimed in claim 1 comprising:

(i) 50 to 90 wt % of the LDPE;

(ii) 12 to 25 wt % of the polypropylene homopolymer; and

(iii) 2 to 15 wt % of the random heterophasic polypropylene copolymer.

3. The polymer composition as claimed in claim 1 , wherein the LDPE is present in an amount of 65 to 90 wt % of the polymer composition.

4. The polymer composition as claimed in claim 1 , wherein the polypropylene homopolymer has a melting point of 150° C. or more.

5. The polymer composition as claimed in claim 1 , wherein the polypropylene homopolymer (ii) is an isotactic polypropylene homopolymer.

6. The polymer composition as claimed in claim 1 , wherein the random heterophasic polypropylene copolymer comprises 3.0 to 10 wt % of the polymer composition.

7. The polymer composition as claimed in claim 1 , wherein the random heterophasic polypropylene copolymer comprises 10 to 50 wt % of a propylene copolymer rubber component and 50 to 75 wt % of a propylene homopolymer or copolymer matrix component.

8. The polymer composition as claimed in claim 1 , wherein the polymer composition does not contain a peroxide.

9. A cable comprising one or more conductors surrounded by at least one layer, wherein said layer comprises the polymer composition of claim 1 .

10. The cable as claimed in claim 9 where said one or more conductors are surrounded by at least an inner semiconductive layer, an insulation layer and an outer semiconductive layer, in that order.

11. The cable as claimed in claim 9 , wherein said layer is an insulation layer.

12. The cable as claimed in claim 11 , wherein the insulation layer of said cable is not crosslinked.

13. A process for producing the cable of claim 9 , the process comprising: applying, on the one or more conductors, the layer comprising the polymer composition.

14. A process for the preparation of the polymer composition as claimed in claim 1 , the process comprising compounding:

(i) said 40 to 90 wt % LDPE;

(ii) said 12 to 25 wt % of the polypropylene homopolymer; and

(iii) said 1.0 to 15 wt % of the random heterophasic polypropylene copolymer.

15. A polymer composition comprising:

(i) 40 to 90 wt % of a low density polyethylene (LDPE);

(ii) 5 to 30 wt % of a polypropylene homopolymer; and

(iii) 1.0 to 15 wt % of a random heterophasic polypropylene copolymer;

wherein the random heterophasic polypropylene copolymer comprises 10 to 50 wt % of a propylene copolymer rubber component and 50 to 75 wt % of a propylene homopolymer or copolymer matrix component.

Assignments (2)

Priority Claims (1)

Continuity (1)

References Cited (61)