Wavelength conversion member, light source device, and method for manufacturing wavelength conversion member
A wavelength conversion member includes a ceramic fluorescent body for converting a wavelength of incident light, a heat radiation member for radiating heat of the ceramic fluorescent body to an outside atmosphere, and a solder layer for joining together the ceramic fluorescent body and the heat radiation member. The solder layer includes a joining portion disposed between the ceramic fluorescent body and the heat radiation member and a protruding portion protruding outward from an outer circumferential portion of the ceramic fluorescent body. The protruding portion is spaced apart from a side surface formed on the outer circumferential portion of the ceramic fluorescent body. In the solder layer, the maximum value of thickness of the protruding portion is greater than the average value of thickness of the joining portion.
1. A wavelength conversion member comprising:
a ceramic fluorescent body for converting a wavelength of incident light;
a heat radiation member for radiating heat of the ceramic fluorescent body to an outside atmosphere; and
a solder layer for joining together the ceramic fluorescent body and the heat radiation member,
wherein the solder layer includes a joining portion disposed between the ceramic fluorescent body and the heat radiation member and a protruding portion protruding outward from an outer circumferential portion of the ceramic fluorescent body,
the protruding portion is spaced apart from a side surface formed on the outer circumferential portion of the ceramic fluorescent body, and
in the solder layer, a maximum value of thickness of the protruding portion is greater than an average value of thickness of the joining portion.
2. The wavelength conversion member according to claim 1 , wherein the protruding portion is formed to surround the entire circumference of the outer circumferential portion of the ceramic fluorescent body.
3. The wavelength conversion member according to claim 1 , wherein a maximum value of thickness of the protruding portion is not less than two times an average value of thickness of the joining portion and not greater than ten times the average value.
4. The wavelength conversion member according to claim 1 , wherein a height of the protruding portion from the heat radiation member is less than a height of a light incident surface of the ceramic fluorescent body from the heat radiation member.
5. A light source device comprising:
the wavelength conversion member according to claim 1 ; and
a light source for applying light to the ceramic fluorescent body.
6. The wavelength conversion member according to claim 2 , wherein a maximum value of thickness of the protruding portion is not less than two times an average value of thickness of the joining portion and not greater than ten times the average value.
7. The wavelength conversion member according to claim 6 , wherein a height of the protruding portion from the heat radiation member is less than a height of a light incident surface of the ceramic fluorescent body from the heat radiation member.
8. A wavelength conversion member comprising:
a ceramic fluorescent body for converting a wavelength of incident light;
a heat radiation member for radiating heat of the ceramic fluorescent body to an outside atmosphere; and
a solder layer for joining together the ceramic fluorescent body and the heat radiation member,
wherein the solder layer includes a joining portion disposed between the ceramic fluorescent body and the heat radiation member and a protruding portion protruding outward from an outer circumferential portion of the ceramic fluorescent body, and
a void fraction of the joining portion is lower than a void fraction of the protruding portion.
9. The wavelength conversion member according to claim 8 , wherein the protruding portion is formed to surround the entire circumference of the outer circumferential portion of the ceramic fluorescent body.
10. The wavelength conversion member according to claim 8 , wherein a maximum value of thickness of the protruding portion is not less than two times an average value of thickness of the joining portion and not greater than ten times the average value.
11. The wavelength conversion member according to claim 8 , wherein a height of the protruding portion from the heat radiation member is less than a height of a light incident surface of the ceramic fluorescent body from the heat radiation member.
12. A light source device comprising:
the wavelength conversion member according to claim 8 ; and
a light source for applying light to the ceramic fluorescent body.
13. The wavelength conversion member according to claim 9 , wherein a maximum value of thickness of the protruding portion is not less than two times an average value of thickness of the joining portion and not greater than ten times the average value.
14. A wavelength conversion member comprising:
a ceramic fluorescent body for converting a wavelength of incident light;
a heat radiation member for radiating heat of the ceramic fluorescent body to an outside atmosphere; and
a solder layer for joining together the ceramic fluorescent body and the heat radiation member,
wherein the solder layer includes a joining portion disposed between the ceramic fluorescent body and the heat radiation member and a protruding portion protruding outward from an outer circumferential portion of the ceramic fluorescent body, and
in the joining portion, a void fraction of a central portion through which a center axis of the wavelength conversion member extends is lower than a void fraction of a remaining portion of the joining portion remaining after exclusion of the central portion.
15. The wavelength conversion member according to claim 14 , wherein the protruding portion is formed to surround the entire circumference of the outer circumferential portion of the ceramic fluorescent body.
16. The wavelength conversion member according to claim 14 , wherein a maximum value of thickness of the protruding portion is not less than two times an average value of thickness of the joining portion and not greater than ten times the average value.
17. The wavelength conversion member according to claim 14 , wherein a height of the protruding portion from the heat radiation member is less than a height of a light incident surface of the ceramic fluorescent body from the heat radiation member.
18. A light source device comprising:
the wavelength conversion member according to claim 14 ; and
a light source for applying light to the ceramic fluorescent body.
19. The wavelength conversion member according to claim 15 , wherein a maximum value of thickness of the protruding portion is not less than two times an average value of thickness of the joining portion and not greater than ten times the average value.