Power semiconductor module and method of forming the same

1. A method of providing a power semiconductor module with a cooler, the method comprising:

a) providing a power semiconductor module that comprises a substrate having a first substrate side for carrying at least one electric circuit and having a second substrate side being located opposite to the first substrate side, wherein the second substrate side is connected to a first baseplate side, wherein the baseplate further comprises a second baseplate side being located opposite to its first baseplate side and being adapted for coming in contact with the cooler, wherein the cooler comprises a first casing component and a second casing component, wherein the second baseplate side is equipped with a cooling area which is surrounded by a connecting area;

b) connecting the first casing component to the second baseplate side at the connecting area, wherein the first casing component comprises at least one opening for receiving the cooling area;

c) connecting a second casing component to the first casing component such, that a cooling channel for providing the cooling area with cooling fluid is provided between the first casing component and the second casing component;

wherein the method comprises at least one of the steps b100) and c100),

wherein according to the step b100), step b) comprises the steps of

b1) welding the first casing component to the baseplate by an intermittent welding technique along a first mechanical connection path which fully surrounds the opening; and

b2) providing a sealing agent along a first sealing path which fully surrounds the opening in order to seal the baseplate against the first casing component; and

wherein according to the step c100), step c) comprises the steps of

c1) welding the second casing component to the first casing component by an intermittent welding technique along a second mechanical connection path which fully surrounds the cooling channel; and

c2) providing a sealing agent along a second sealing path in order to seal the first casing component against the second casing component.

2. The method according to claim 1 , wherein the method comprises performing both the steps b1) and b2).

3. The method according to claim 1 , wherein welding in at least one of steps b1) and b2) is performed by means of laser welding.

4. The method according to claim 1 , wherein welding in at least one of steps b1) and b2) is performed by means of tack welding.

5. The method according to claim 1 , wherein at least one of the steps b1) and b2) is performed from a side opposing the baseplate.

6. The method according to claim 1 , wherein the cooling area is equipped with a cooling structure before step b), or in that a cooling structure is attached to the cooling area after step b) and before step c).

7. The method according to claim 1 , wherein the sealing agent comprises an adhesive.

8. The method according to claim 1 , wherein at least one of the first casing component and the second casing component comprises at least one of a fluid inlet and a fluid outlet.

9. An arrangement of a power semiconductor module and a cooler, wherein the power semiconductor module comprises a substrate having a first substrate side which carries at least one electric circuit and having a second substrate side being located opposite to the first substrate side, wherein the second substrate side is connected to a first baseplate side, wherein the baseplate further comprises a second baseplate side being located opposite to its first baseplate side and being in contact with the cooler, wherein the second baseplate side is equipped with a cooling area which is surrounded by a connecting area, wherein a first casing component of the cooler is connected to the second baseplate side at the connecting area, wherein the first casing component comprises at least one opening for receiving the cooling area, and wherein a second casing component is connected to the first casing component such that a cooling channel for providing the cooling area with cooling fluid is provided between the first casing component and the second casing component, wherein at least one of the features i) and ii) is provided, wherein according to the feature i), the first casing component is welded to the baseplate by an intermittent welding technique along a first mechanical connection path which fully surrounds the opening and a sealing agent is provided completely along a first sealing path fully surrounding the opening in order to seal the baseplate against the first casing component, and wherein according to the feature ii), the second casing component is welded to the first casing component by an intermittent welding technique along a second connection path which fully surrounds the cooling channel, and a sealing agent is provided completely along a second sealing path in order to seal the first casing component against the second casing component.

10. The arrangement according to claim 9 , wherein the power semiconductor module is a transfer molded module.