IP Library Granted Patent US 12,249,697
Granted Patent B2
US 12,249,697 · App. 17/632,068 · Granted Mar 11, 2025

Temperature measurement module and power storage module

Inventors: Xueqing Dong (Mie, JP); Hiroomi Hiramitsu (Mie, JP); Yuto Sato (Mie, JP); Masato Tsutsuki (Mie, JP)
Assignees: AUTONETWORKS TECHNOLOGIES, LTD.; SUMITOMO WIRING SYSTEMS, LTD.; SUMITOMO ELECTRIC INDUSTRIES, LTD.
H01M10/482H01M10/425H01M10/653H01M10/655H01M50/204H01M50/502H05K1/11H05K1/189
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Quick Facts
Patent No.
US 12,249,697
App. No.
17/632,068
Granted
Mar 11, 2025
Kind
B2
Abstract

A temperature measurement module is for measuring the temperature of a temperature measurement target and includes a flexible printed circuit board that includes an insulating sheet member and circuit patterns routed in the sheet member, a temperature sensor attached to the flexible printed circuit board, and a heat transfer member thermally fixed to the temperature sensor. The sheet member is provided with through holes located outward of a region overlapped with the temperature sensor, and the heat transfer member includes heat receiving portions that are arranged inside the through holes and receive heat from the temperature measurement target.

Claims (24)

1. A temperature measurement module for measuring the temperature of a temperature measurement target, the temperature measurement module comprising:

a flexible printed circuit board that includes an insulating sheet member and a circuit pattern routed in the sheet member;

a temperature sensor attached to the flexible printed circuit board; and

a heat transfer member thermally fixed to the temperature sensor,

wherein the sheet member includes a through hole located outward of a region overlapped with the temperature sensor,

the heat transfer member includes a heat receiving portion that is arranged in the sheet member through hole and is configured to receive heat from the temperature measurement target,

the temperature measurement module further comprises:

a reinforcing plate arranged on a temperature measurement target side of the flexible printed circuit board,

the reinforcing plate includes a reinforcing plate through hole that is in communication with the sheet member through hole, and the heat receiving portion is arranged inside the reinforcing plate through hole, and

the heat receiving portion is provided so as to fill the space in the sheet member through hole and the reinforcing plate through hole, and a lower end of the heat receiving portion is formed at a position conforming to a lower surface of the reinforcing plate.

2. The temperature measurement module according to claim 1 ,

wherein a plurality of the sheet member through holes are provided respectively on opposite sides of the temperature sensor in the sheet member.

3. The temperature measurement module according to claim 1 ,

wherein the heat transfer member fills the sheet member through hole.

4. The temperature measurement module according to claim 1 ,

wherein the temperature sensor includes a plurality of terminals, and

the flexible printed circuit board includes a plurality of the circuit patterns that are connected to the terminals, and the plurality of circuit patterns include a first circuit pattern and a second circuit pattern that extends in a direction opposite to the first circuit pattern relative to the temperature sensor.

5. The temperature measurement module according to claim 1 ,

wherein the temperature sensor includes a plurality of terminals, and

the circuit pattern extends along a direction orthogonal to a direction in which the plurality of terminals are arranged side by side.

6. A power storage module comprising:

a plurality of power storage elements that each include a positive electrode terminal and a negative electrode terminal;

bus bars that serve as a temperature measurement target and each connect adjacent electrode terminals of the power storage elements; and

the temperature measurement module according to claim 1 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 31, 2022
From: DONG, XUEQING; HIRAMITSU, HIROOMI; SATO, YUTO; TSUTSUKI, MASATO
To: AUTONETWORKS TECHNOLOGIES, LTD.; SUMITOMO WIRING SYSTEMS, LTD.; SUMITOMO ELECTRIC INDUSTRIES, LTD.
Reel/Frame 059462/0427 →
Priority Claims (1)
JP 2019-142753 · Aug 2, 2019 · national
Continuity (1)
Related Publication 20220255154A1 · Aug 11, 2022
References Cited (8)
US 20140150571A1 · Kuniyoshi · 2014 [cited by examiner]
US 20180034115A1 · Li et al. · 2018 [cited by applicant]
US 20210381909A1 · Lorenz · 2021 [cited by examiner]
JP 04122341 · 1992 [cited by applicant]
JP 2013251294 · 2013 [cited by applicant]
JP 2018059902 · 2018 [cited by applicant]
JP 2018124125 · 2018 [cited by applicant]
International Search Report issued in International Bureau of WIPO Patent Application No. PCT/JP2020/027441, dated Oct. 6, 2020, along with an English translation thereof. [cited by applicant]