IP Library Granted Patent US 11,880,731
Granted Patent B2
US 11,880,731 · App. 17/633,675 · Granted Jan 23, 2024

Chip card

Inventor: Josef Riedl (Attenkirchen, DE)
Assignee: GIESECKE+DEVRIENT MOBILE SECURITY GMBH
G06K19/0723G06K19/07722
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Quick Facts
Patent No.
US 11,880,731
App. No.
17/633,675
Granted
Jan 23, 2024
Kind
B2
Abstract

A chip card configured as a metal card is RFID-capable on both sides, by the windings of the transponder coil being formed by the metal layer itself. Gaps between the windings of the transponder coil are filled with insulating material. A chip module is arranged above the ends of the transponder coil such that these ends are not visible for the viewer.

Claims (39)

1. A chip card comprising:

a card body composed of one or several layers, of which at least one layer is a self-supporting metal layer,

an integrated circuit, and

a transponder coil coupled to the integrated circuit,

wherein the transponder coil has windings and gaps between the windings,

wherein the windings of the transponder coil are formed by the at least one metal layer,

wherein the gaps between the windings are filled with insulating material;

wherein the card body has two mutually opposite main areas, and

wherein at least one of the main areas is formed by the at least one metal layer and is covered fully with a cover layer arranged to protect the windings of the transponder coil from contact external to the card body.

2. The chip card according to claim 1 , wherein the insulating material is ferrite.

3. The chip card according to claim 1 , wherein the at least one metal layer is lacquered, printed or coated with a foil.

4. The chip card according to claim 1 , wherein texture elements are introduced into the surface of the at least one metal layer.

5. The chip card according to claim 1 , wherein the card body has a thickness and the at least one metal layer overall has a total thickness,

wherein the total thickness of the at least one metal layer amounts to at least 25%, of the thickness of the card body.

6. The chip card according to claim 5 , wherein the total thickness of the at least one metal layer is in a range of 0.2 and 0.76 mm.

7. The chip card according to claim 1 , wherein the card body is formed completely by the at least one metal layer.

8. The chip card according to claim 1 , wherein the windings of the transponder coil have a winding running along an outer edge of the metal layer.

9. The chip card according to claim 1 , wherein the windings of the transponder coil comprise an outer winding which runs in a manner spaced apart from an outer edge of the metal layer.

10. The chip card according to claim 1 , wherein a chip module is arranged over the windings of the transponder coil in such a manner that, when the chip card is viewed from above, in the region of the chip module exclusively sections of the windings of the transponder coil are visible, which run parallel to a respective nearest outer edge of the metal layer.

11. The chip card according to claim 1 , wherein the chip module has the integrated circuit and contact areas for contact-based data transmission.

12. The chip card according to claim 1 , wherein a central region of the at least one metal layer is recessed and filled with plastic.

13. A method for producing a chip card according to claim 1 , wherein the windings of the transponder coil in the at least one metal layer is produced in a region corresponding to the gaps between the windings by removing material in one of the gaps,

wherein this region is subsequently filled with the insulating material.

14. The method according to claim 13 , wherein a central region of the at least one metal layer is removed and filled with plastic.

15. The chip card according to claim 1 , wherein the cover layer is a transparent or translucent lacquer layer.

16. The chip card according to claim 1 , wherein the cover layer is opaque.

17. The chip card according to claim 1 , wherein the cover layer is a transparent or translucent printing layer or a laminated plastic foil.

18. The chip card according to claim 1 , wherein the cover layer is plastic.

19. A chip card comprising:

a card body composed of one or several layers, of which at least one layer is a self-supporting metal layer,

an integrated circuit, and

a transponder coil coupled to the integrated circuit,

wherein the transponder coil has windings and gaps between the windings,

wherein the windings of the transponder coil are formed by the at least one metal layer,

wherein the gaps between the windings are filled with insulating material;

wherein the card body has two mutually opposite main areas, and

wherein at least one of the main areas is formed by the at least one metal layer and is covered with a plastic cover layer arranged to protect the windings of the transponder coil from contact external to the card body;

wherein the cover layer is transparent, translucent or opaque;

wherein the cover layer is selected from the group consisting of a lacquer layer, a printing layer and a laminated plastic foil.

Assignments (2)
CHANGE OF NAME Recorded Jul 21, 2024
From: GIESECKE+DEVRIENT MOBILE SECURITY GMBH
To: GIESECKE+DEVRIENT EPAYMENTS GMBH
Reel/Frame 068465/0720 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 8, 2022
From: RIEDL, JOSEF
To: GIESECKE+DEVRIENT MOBILE SECURITY GMBH
Reel/Frame 058925/0254 →
Priority Claims (1)
DE 10 2019 005 934.4 · Aug 22, 2019 · national
Continuity (1)
Related Publication 20220318584A1 · Oct 6, 2022
Cited By (2)
US 12,450,463 US 12,699,862