IP Library Patent Application 17635464
Patent Application
App. No. 17/635,464

CARBON FIBER REINFORCED MOLDING COMPOSITION SUITABLE FOR ELECTROPHORETIC COATING

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Patent No.
US None
App. No.
17/635,464
Abstract

A cured article includes a cured thermoset resin matrix defining an article surface. Hollow glass microspheroids are dispersed in the cured thermoset resin matrix. A low profile additive package is dispersed in the cured thermoset resin matrix. A plurality of carbon fiber bundles are present and wet by the cured thermoset resin matrix. The matrix formed from a prepolymer and styrenic monomer. A free radical initiator is provided to cure the thermoset resin matrix and having limited decomposition products with a boiling point of between 160-210° C.; wherein the article emits less than 250 parts per million (ppm) of volatiles as measured after heating to 185° C. at a rate of 14° C./min and held for 1 minute.

Claims (17)

1 . A cured article comprising:

a cured thermoset resin matrix defining an article surface;

hollow glass microspheroids dispersed in said cured thermoset resin matrix;

a low profile additive package dispersed in said cured thermoset resin matrix; and

a plurality of carbon fiber bundles wet by said cured thermoset resin matrix;

styrenic monomer cured into and part of said cured thermoset resin matrix; and

free radical initiator curing said cured thermoset resin matrix and having limited decomposition products with a boiling point of between 160-210° C.; wherein the article emits less than 250 parts per million (ppm) of volatiles as measured after heating to 185° C. at a rate of 14° C./min and held for 1 minute.

2 . The article of claim 1 , wherein said cured thermoset resin matrix is a polyester.

3 . The article of claim 1 wherein said hollow glass microspheroids further comprise a silane surface derivative bonded to said matrix.

4 . The article of claim 1 wherein said hollow glass microspheroids are present from 5 to 15 total weight percent.

5 . The article of claim 1 wherein said low profile additive package further comprises at least one of polystyrene, styrene-butadiene rubber, polyvinyl acetate, or polyethylene.

6 . The article of claim 1 wherein said styrenic monomer is styrene present in an amount that contributes less than 200 ppm of the volatiles.

7 . The article of claim 1 further comprising a thickener, said thickener being an alkaline earth oxide, an alkaline earth hydroxide, or a combination thereof.

8 . The article of claim 7 wherein said thickener and the article are devoid of polyurea interpenetrating network.

9 . The article of claim 7 further comprising an e-coating applied to the article surface, said e-coating being free of blisters visible to an unaided, normal human eye.

10 . The article of claim 1 further comprising an e-coating applied to the article surface, said e-coating being free of blisters visible to an unaided, normal human eye.

11 . The article of claim 8 further comprising an e-coating applied to the article surface, said e-coating being free of blisters visible to an unaided, normal human eye.

Assignments (5)
CORRECTIVE ASSIGNMENT TO CORRECT THE CONVEYING PARTY DATA PREVIOUSLY RECORDED AT REEL: 73593 FRAME: 669. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME. Recorded Jan 28, 2026
From: TEIJIN AUTOMOTIVE TECHNOLOGIES, INC.
To: CSP INNOVATIONS, INC.
Reel/Frame 074512/0614 →
CHANGE OF NAME Recorded Oct 31, 2025
From: TEIJIN AUTOMOTIVE TECHNOLOGIES, INC.
To: CSP INNOVATIONS, INC.
Reel/Frame 073593/0669 →
SECURITY AGREEMENT Recorded Jul 3, 2025
From: TEIJIN AUTOMOTIVE TECHNOLOGIES, INC.
To: PNC BANK, NATIONAL ASSOCIATION
Reel/Frame 071815/0728 →
SECURITY INTEREST Recorded Jul 2, 2025
From: TEIJIN AUTOMOTIVE TECHNOLOGIES, INC.
To: STORK HOLDCO INC.
Reel/Frame 071788/0005 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 15, 2022
From: KRUG, DAVID J., III; KAMAR, NICHOLAS T.; ASUNCION, MICHAEL Z.; PRASCIUS, STEVEN L.; SIWAJEK, MICHAEL J.
To: TEIJIN AUTOMOTIVE TECHNOLOGIES, INC.
Reel/Frame 059013/0556 →