Granted Patent B2

US 12,453,002 · App. 17/642,956 · Granted Oct 21, 2025

Inventors: Fei Li (Beijing, CN); Xinpeng Wang (Beijing, CN); Wenxiao Niu (Beijing, CN); Hao Huang (Beijing, CN); Zijian Wang (Beijing, CN); Xiaolong Zhu (Beijing, CN); Xu Lu (Beijing, CN); Hengzhen Liang (Beijing, CN)

Assignees: Chengdu BOE Optoelectronics Technology Co., Ltd.; Beijing BOE Technology Development Co., Ltd.

H05K1/0281H05K1/115H05K2201/2009

Abstract

Claims (11)

1. A reinforcement board for flexible printed circuit board, comprising a substrate, wherein the substrate comprises a first surface and a second surface which are opposite to each other, the substrate is provided with a through hole penetrating through the first surface and the second surface, wherein each of the first surface, the second surface and a hole wall of the through hole is provided with a conductive layer, the conductive layers on the first surface and the second surface are communicated with each other by the conductive layer on the hole wall of the through hole, and the second surface is a connecting surface facing the flexible printed circuit board when the reinforcement board is fixed on the flexible printed circuit board; and

the conductive layer on the second surface is grid-shaped, the conductive layer on the second surface comprises a plurality of wires crossing each other, the plurality of wires crossing each other comprise a plurality of wires extending in a transverse direction and a plurality of wires extending in a longitudinal direction, grid holes are formed between the plurality of wires extending in the transverse direction and the plurality of wires extending in the longitudinal direction, and the grid holes are a plurality of openings which expose or do not expose the second surface.

2. The reinforcement board for flexible printed circuit board according to claim 1 , wherein a material of the substrate comprises an organic insulating material.

3. The reinforcement board for flexible printed circuit board according to claim 2 , wherein the material of the substrate comprises a material of FR4 standard.

4. The reinforcement board for flexible printed circuit board according to claim 1 , wherein a material of the conductive layer is metal.

5. The reinforcement board for flexible printed circuit board according to claim 1 , wherein the substrate is provided with a plurality of through holes, and the plurality of through holes are arranged in an array.

6. The reinforcement board for flexible printed circuit board according to claim 1 , wherein a sectional shape of the through hole is circular, rectangular or polygonal.

7. A flexible printed circuit board assembly comprising a flexible printed circuit board and the reinforcement board for flexible printed circuit board according to claim 1 , wherein the reinforcement board is fixed on the flexible printed circuit board by conductive adhesive, and the conductive layer on the second surface is connected to a ground wire of the flexible printed circuit board by the conductive adhesive.

8. The flexible printed circuit board assembly according to claim 7 , further comprising a connector provided on the flexible printed circuit board, the connector and the reinforcement board are provided at corresponding positions on two opposite surfaces of the flexible printed circuit board respectively, and the connector is configured to connect the flexible printed circuit board to an external circuit module.

9. A display device, comprising a display screen and a display module for driving the display screen to display, wherein the display module comprises the flexible printed circuit board assembly according to claim 7 .

10. A display device, comprising a display screen and a display module for driving the display screen to display, wherein the display module comprises the flexible printed circuit board assembly according to claim 8 .

Assignments (2)

Priority Claims (1)

Continuity (1)

References Cited (17)