Curable silicone composition, encapsulant and optical semiconductor device
Curable silicone compositions, encapsulants including the same, and optical semiconductor devices including the encapsulants are provided herein. In an embodiment, a curable silicone composition includes: (A) an alkenyl group-containing organopolysiloxane having at least two alkenyl groups per molecule; (B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; (C) an epoxy group-containing resinous organopolysiloxane represented by Average Unit Formula (I): (R 1 3 SiO 1/2 ) f (R 2 2 SiO 2/2 ) g (R 1 SiO 3/2 ) h (SiO 4/2 ) i (XO 1/2 ) j wherein R 1 are independently halogen-substituted or unsubstituted monovalent hydrocarbon groups, at least two R 1 are alkenyl groups; R 2 are independently halogen-substituted or unsubstituted monovalent hydrocarbon groups or epoxy group-containing organic groups, wherein at least one R 2 is an epoxy group-containing organic group; X is a hydrogen atom or an alkyl group; 0≤f<1; 0<g<1; 0≤h<0.9; 0≤i<0.5; and 0<j<0.5; f+g+h+i+j=1.0; h+i>0; and j/(f+g+h+i+j)>0.05 and (D) a curing catalyst.
1. A curable silicone composition comprising:
(A) an alkenyl group-containing organopolysiloxane having at least two alkenyl groups per molecule;
(B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule;
(C) an epoxy group-containing resinous organopolysiloxane represented by Average Unit Formula (I):
(R 1 3 SiO 1/2 ) f (R 2 2 SiO 2/2 ) g (R 1 SiO 3/2 ) h (SiO 4/2 ) i (XO 1/2 ) j
wherein, in Formula (I),
R 1 are, in each case, independently halogen-substituted or unsubstituted monovalent hydrocarbon groups, wherein at least two R 1 are alkenyl groups;
R 2 are, in each case, independently halogen-substituted or unsubstituted monovalent hydrocarbon groups or epoxy group-containing organic groups, wherein at least one R 2 is an epoxy group-containing organic group;
X is a hydrogen atom or an alkyl group;
0≤f<1; 0<g<1; 0≤h<0.9; 0≤i<0.5;
0<j<0.5; f+g+h+i+j=1.0; h+i>0; and
j/(f+g+h+i+j)>0.05}; and
(D) a curing catalyst.
2. The curable silicone composition according to claim 1 wherein, in Formula (I), at least 30 mol % of R 1 are aryl groups.
3. The curable silicone composition according to claim 1 , wherein the (A) alkenyl group-containing organopolysiloxane includes resinous organopolysiloxane, linear organopolysiloxane, or both, in which the quantity of aryl groups in all of the silicon atom-bonded functional groups is 20 mol % or more.
4. The curable silicone composition according to claim 1 , wherein the (A) alkenyl group-containing organopolysiloxane includes resinous organopolysiloxane, in which the quantity of aryl groups in all of the silicon atom-bonded functional groups is 20 mol % or more.
5. The curable silicone composition according to claim 1 , wherein the (A) alkenyl group-containing organopolysiloxane includes linear organopolysiloxane, in which the quantity of aryl groups in all of the silicon atom-bonded functional groups is 20 mol % or more.
6. The curable silicone composition according to claim 1 , wherein the (B) organohydrogenpolysiloxane contains both linear organohydrogenpolysiloxane and resinous organohydrogenpolysiloxane.
7. The curable silicone composition according to claim 6 , wherein in the (A) alkenyl group-containing organopolysiloxane the quantity of aryl groups in all of the silicon atom-bonded functional groups is 20 mol % or more.
8. The curable silicone composition according to claim 1 , further comprising silica as an inorganic filler.
9. An encapsulant including the curable silicone composition according to claim 1 .
10. An optical semiconductor device, comprising the encapsulant according to claim 9 .