MEMS mirror arrays with reduced crosstalk
Methods, apparatuses and methods of manufacture are described for a MEMS mirror array with reduced crosstalk. The MEMS mirror array has a plurality of reflective surfaces wherein each reflective surface has a resonant frequency, and further wherein adjacent reflective surfaces do not have the same resonant frequency.
1. A microelectromechanical (MEMS) array, comprising:
a first stage, a first frame pivotally coupled to the first stage, and a first stage reflective surface, wherein the first stage reflective surface has a first resonant frequency;
a second stage, a second frame pivotally coupled to the second stage, and a second stage reflective surface, wherein the second stage reflective surface has a second resonant frequency; and
a base wafer positioned below the first stage and the second stage, wherein the first stage is adjacent the second stage on a device wafer, wherein the device wafer is secured to the base wafer by a bonding element.
2. The MEMS array of claim 1 , wherein the first stage is pivotally coupled to the first frame with a pair of first stage flexures and the second stage is pivotally coupled to the second frame with a pair of second stage flexures.
3. The MEMS array of claim 2 , wherein the first stage flexures and the second stage flexures are configured to rotate about a single axis and substantially restrict rotation about other axes, the single axis residing along a length of one or more of the first stage flexures and the second stage flexures.
4. The MEMS array of claim 3 , wherein the flexures comprise a plurality of torsion beams.
5. The MEMS array of claim 4 , wherein the plurality of torsion beams are substantially parallel to one another.
6. The MEMS array claim 4 , wherein each of the plurality of torsion beams has a torsion beam length and wherein the plurality of torsion beams are non-parallel along portion of the torsion beam lengths.
7. The MEMS array of claim 1 , further comprising:
a first set of one or more first stage blades coupled to the first stage, the first set of one or more first stage blades electrically connected to each other; and a second set of one or more first stage blades coupled to the first stage, the second set of one or more first stage blades electrically connected to each other; and
a first set of one or more second stage blades coupled to the second stage, the first set of one or more second stage blades electrically connected to each other; and a second set of one or more second stage blades coupled to the second stage, the second set of one or more second stage blades electrically connected to each other.
8. The MEMS array of claim 1 , further comprising:
a third stage, a third frame pivotally coupled to the third stage, and a third stage reflective surface, wherein the third stage reflective surface has a third resonant frequency, further wherein the third stage is positioned on the base wafer adjacent the first stage on a first side and the second stage on a second side perpendicular to the first side.
9. The MEMS array of claim 8 , further comprising:
a fourth stage, a fourth frame pivotally coupled to the fourth stage, and a fourth stage reflective surface, wherein the fourth stage reflective surface has a fourth resonant frequency, further wherein the fourth stage is positioned on the base wafer adjacent at least one of the first stage, the second stage and the third stage.
10. The MEMS array of claim 1 wherein the base wafer further comprises a support anchor in contact with a support webbing, further wherein the contact between the support anchor and the support webbing is operable to dampen mechanical motion of the reflective surface.
11. A microelectromechanical (MEMS) array, comprising:
a first stage, a first frame pivotally coupled to the first stage, and a first stage reflective surface; and
a base wafer positioned below the first stage, wherein the base wafer further comprises a support anchor in contact with a support webbing, further wherein the contact between the support anchor and the support webbing is operable to dampen mechanical motion of the reflective surface.
12. The MEMS array of claim 11 , wherein the first stage is pivotally coupled to the first frame with a pair of first stage flexures.
13. The MEMS array of claim 12 , wherein the first stage flexures are configured to rotate about a single axis and substantially restrict rotation about other axes, the single axis residing along a length of the flexures.
14. The MEMS array of claim 13 , wherein the flexures comprise a plurality of torsion beams.
15. The MEMS array of claim 14 , wherein the plurality of torsion beams are substantially parallel to one another.
16. The MEMS array claim 14 , wherein each of the plurality of torsion beams has a torsion beam length and wherein the plurality of torsion beams are non-parallel along portion of the torsion beam lengths.
17. The MEMS array of claim 11 , further comprising:
a first set of one or more first stage blades coupled to the first stage, the first set of one or more first stage blades electrically connected to each other; and a second set of one or more first stage blades coupled to the first stage, the second set of one or more first stage blades electrically connected to each other.
18. The MEMS array of claim 11 further comprising a device wafer secured to the base wafer by a bonding element.