Methods for producing an etch resist pattern on a metallic surface
A method of forming a metallic pattern on a substrate is provided. The method includes applying onto a metallic surface, a chemically surface-activating solution having an activating agent that chemically activates the metallic surface; non-impact printing an etch-resist ink on the activated surface to produce an etch resist mask according to a predetermined pattern, wherein at least one ink component within the etch-resist ink undergoes a chemical reaction with the activated metallic surface to immobilize droplets of the etch-resist ink when hitting the activated surface; performing an etching process to remove unmasked metallic portions that are not covered with the etch resist mask; and removing the etch-resist mask.
1. A method of forming a metallic pattern on a substrate, the method comprising:
chemically activating a metallic surface of a substrate to form metal ions;
after chemically activating the metallic surface, selectively printing an etch-resist ink onto the metallic surface;
reacting a component of the etch-resist ink with the ions to immobilize the etch-resist ink into an etch-resist mask on the metallic surface; and
performing an etching process to remove portions of the metallic layer that are not covered by the etch-resist mask to form the metallic pattern.
2. The method of claim 1 , wherein the metallic pattern has multiple metallic lines, each having a width of less than 50 microns.
3. The method of claim 1 , wherein the etch-resist mask has lines having a width of less than 50 microns.
4. The method of claim 1 , wherein the metallic pattern has metallic lines having a width of less than 30 microns.
5. The method of claim 1 , further comprising, prior to printing, treating the activated surface of the metallic layer using a solvent.
6. The method of claim 1 , wherein the component that reacts with the ions is a polymeric component comprising an acrylate, a phosphate, a sulfonate, or any combination thereof.
7. The method of claim 1 , wherein chemically activating the metallic surface comprises treating the metallic surface using a material selected from the group consisting of a copper salt, a ferric salt, a chromic-sulfuric acid, a persulfate salt, sodium chlorite, and hydrogen peroxide.
8. The method of claim 1 , wherein chemically activating the metallic surface comprises immersing the metallic surface in a bath of an aqueous solution for about 10-60 seconds or spraying the aqueous solution onto the metallic surface.
9. The method of claim 1 , wherein selectively printing the etch-resist ink onto the metallic surface comprises ink-jet printing.
10. The method of claim 1 , wherein the etch-resistant ink comprises a dye.
11. The method of claim 1 , wherein the metallic surface comprises copper and the ions of the metallic surface comprise copper cations.
12. A method of forming a metallic pattern on a substrate, the method comprising:
forming metal ions on a metallic surface of a substrate by applying an aqueous solution comprising an inorganic agent onto the metallic surface;
ink-jet printing a reactive ink onto the metallic surface;
reacting a component of the reactive ink with the ions to produce a resist;
performing an etching process to remove portions of the metallic layer that are not covered by the resist; and
removing the resist to form the metallic pattern.
13. The method of claim 12 , wherein the metallic comprises metallic lines, each having a width of less than 50 microns.
14. The method of claim 12 , wherein the reactive ink comprises an acrylate, a phosphate, a sulfonate, or any combination thereof.
15. The method of claim 12 , wherein the inorganic agent comprises one or more materials selected from the group consisting of a copper salt, a ferric salt, a chromic-sulfuric acid, a persulfate salt, sodium chlorite, and hydrogen peroxide.
16. The method of claim 12 , wherein the reactive ink further comprises a dye.
17. The method of claim 12 , wherein the component of the reactive ink is a polymer.
18. A method of forming a pattern on a copper substrate, the method comprising:
activating a copper surface of a substrate by applying an aqueous solution comprising an inorganic activating agent selected from the group consisting of a copper salt, a ferric salt, a chromic-sulfuric acid, a persulfate salt, sodium chlorite, and hydrogen peroxide onto the metallic surface;
after chemically activating the copper surface, ink-jet printing an ink comprising an acrylate, a phosphate, a sulfonate, or a combination thereof onto the copper surface;
reacting a component of the ink with copper ions of the copper surface to produce a resist;
performing an etching process to remove portions of the copper surface that are not covered by the resist; and
removing the resist to form the pattern on the copper surface.
19. The method of claim 18 , wherein the pattern has copper lines having a width of less than 30 microns.
20. The method of claim 18 , wherein the ink comprises a dye.