Build plates for additive manufacturing systems and methods of using the same
A build plate is configured for use in a 3D printer. The build plate comprises a base comprising a base material and one or more vacuum channels. A removable plate is disposed proximate the base so as to be in fluid communication with the vacuum channels.
1. A build plate configured for use in a 3D printer, the build plate comprising:
a base;
a porous layer positioned on the base;
and a removable plate, wherein the removable plate comprises a sacrificial layer, wherein the sacrificial layer comprises one or more protuberances that are integral with the sacrificial layer, wherein the protuberances extend through an entire dimension of the base, and etch stop layer positioned on the sacrificial layer, wherein the etch stop layer is thinner than the sacrificial layer, wherein the etch stop layer has a thickness from about 0.1% to about 10% of a total thickness of the removable plate, wherein the sacrificial layer has a thickness from about 90% to about 99.9% of the removable plate.
2. The build plate of claim 1 , wherein the sacrificial layer comprises at least one sacrificial material chosen from a metal and metal oxide.
3. The build plate of claim 2 , wherein the sacrificial material is disposed between the etch stop layer and the base.
4. The build plate of claim 3 , wherein the etch stop layer comprises one or more materials chosen from gold, gold alloys, silver, silver alloys, platinum, platinum alloys, chromium, chromium alloys, chromium oxides, brass, copper, copper alloys, copper oxides and iron oxide.
5. The build plate of claim 1 , wherein the removable plate comprises a support layer.
6. The build plate of claim 1 , wherein the porous layer comprises a porous network disposed proximate to, and being in fluid communication with, the one or more vacuum channels.
7. The build plate of claim 6 , wherein the base material comprises a first metal and the porous layer comprises a second metal, the first metal and the second metal being the same or different and being independently chosen from aluminum, aluminum alloys, brass, bronze, chromium, chromium alloys, cobalt, cobalt alloys, cobalt-chrome alloys, copper, copper alloys, iron, iron alloys, nickel, nickel alloys, nickel-titanium alloys, stainless steel, tin, tin alloys, titanium, titanium alloys, gold, gold alloys, silver, silver alloys, molybdenum, molybdenum alloys, tungsten and tungsten alloys.
8. The build plate of claim 7 , wherein the removable plate further comprises a sacrificial material, the sacrificial material being different than one or both of the first metal and the second metal.
9. The build plate of claim 8 , wherein the sacrificial material is a metal or metal oxide chosen from copper, copper alloys, copper oxide, tantalum, tantalum alloys, aluminum, aluminum alloys, chromium, chromium alloys, gallium, gallium alloys, germanium, germanium alloys, gold, gold alloys, hafnium, hafnium alloys, indium, indium alloys, indium tin oxide, iron, iron alloys, iron oxide, magnesium, magnesium oxide, niobium, niobium alloys, nichrome, nickel, nickel alloys, palladium, palladium alloys, tin, tin alloys, titanium, titanium alloys, tungsten and tungsten alloys.
10. The build plate of claim 6 , wherein the porous layer further comprises a non-porous sidewall disposed proximate the periphery of the porous layer.
11. The build plate of claim 6 , wherein the porous layer is removably disposed on the base, the porous layer further comprising one or more handles.
12. The build plate of claim 1 , wherein the removable plate has a thickness, the thickness ranging from about 0.1 mm to about 5 mm.
13. The build plate of claim 1 , wherein the removable plate comprises a material having a Young's modulus ranging from about 50 to about 300 GPa.
14. The build plate of claim 1 , wherein the etch stop layer etches more slowly than the sacrificial layer.
15. The build plate of claim 1 , wherein the sacrificial layer is configured to be removed using an electromechanical etch with a first voltage, and wherein the etch stop layer is configured to be removed with an electromechanical etch with a second voltage that is higher than the first voltage.
16. A three-dimensional (3D) printer, comprising: a printhead; a stage disposed proximal the printhead, the stage comprising a build plate, the build plate comprising: a base comprising a base material and defining one or more vacuum channels therethrough; a porous layer positioned on the base; and a removable plate positioned on the porous layer, wherein the removable plate comprises a sacrificial layer positioned on the porous layer, and an etch stop layer positioned on the sacrificial layer, wherein the etch stop layer is thinner than the sacrificial layer, wherein the sacrificial layer comprises one or more protuberances that are integral with the sacrificial layer, wherein the protuberances extend through an entire dimension of the base, and wherein the removable plate is configured to be detachably coupled to the base using vacuum pressure supplied through the one or more vacuum channels and the porous layer; and a computer controlled motion system that allows the printhead and the stage to move in three dimensions relative to each other during operation of the 3D printer.
17. The 3D printer of claim 16 , wherein the sacrificial layer comprises at least one sacrificial material chosen from a metal and metal oxide.
18. The 3D printer of claim 17 , wherein sacrificial layer is disposed between the etch stop layer and the base.
19. The 3D printer of claim 16 , wherein the porous layer comprises a porous network disposed proximate to, and being in fluid communication with, the one or more vacuum channels.
20. The 3D printer of claim 16 , wherein a porosity of the porous layer is from about 1 vol % to about 80 vol %.
21. The 3D printer of claim 16 , wherein the porous layer comprises a porous network through which the vacuum pressure is communicated, and wherein the one or more channels are not defined in the porous layer.
22. The 3D printer of claim 14 , wherein the porous layer is coupled to the base using one or more mechanical fasteners, and wherein the removable plate is not coupled to the base or the porous layer using the one or more mechanical fasteners.