IP Library Granted Patent US 12,061,246
Granted Patent B2
US 12,061,246 · App. 17/654,624 · Granted Aug 13, 2024

Method and apparatus for magnetic sensor producing a changing magnetic field

Inventors: Paul A. David (Bow, NH); William P. Taylor (Amherst, NH)
Assignee: Allegro MicroSystems, LLC
G01R33/093G01D5/2013G01R33/07G01R33/09G01R33/00
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Quick Facts
Patent No.
US 12,061,246
App. No.
17/654,624
Granted
Aug 13, 2024
Kind
B2
Abstract

Methods and apparatus for detecting a magnetic field include a semiconductor substrate, a coil configured to provide a changing magnetic field in response to a changing current in the coil; and a magnetic field sensing element supported by the substrate. The coil receives the changing current and, in response, generates a changing magnetic field. The magnetic field sensing element detects the presence of a magnetic target by detecting changes to the magnetic field caused by the target and comparing them to an expected value.

Claims (42)

1. An assembly comprising:

a semiconductor package comprising a lead frame, a die attached to the lead frame, and a magnetic field sensing element supported by the die;

a coil unit placed in proximity to a rotating target and comprising a coil configured to provide a changing magnetic field in response to a changing current in the coil to produce eddy currents within the rotating target, wherein the magnetic field sensing element is configured to detect the rotating target by detecting variations in the changing magnetic field caused by the rotating target; and

a housing comprising a case and an endcap, the housing containing the semiconductor package and the coil unit.

2. The assembly of claim 1 , wherein the housing has a first end comprising an opening, and a second end comprising a window,

wherein the semiconductor package, the coil unit and the endcap are serially positioned in order through the opening of the first end of the housing with the magnetic field sensor first, the coil unit second and the endcap last.

3. The assembly of claim 2 , wherein the semiconductor package having a body face portion; and

wherein the body face portion of the semiconductor package extends through the window of the housing.

4. The assembly of claim 1 , wherein the coil unit comprises:

a coil body portion comprising a spiral coil or a solenoid-type coil; and

at least two leads attached to the coil body portion and comprising a first lead and a second lead.

5. The assembly of claim 4 , wherein the first lead of the coil unit is a signal input for connecting to a signal source, and

wherein the second lead of the coil unit is connected to a reference potential.

6. The assembly of claim 1 , wherein the coil unit comprises a spiral coil.

7. The assembly of claim 1 , wherein the coil unit comprises a solenoid-type coil.

8. The assembly of claim 7 , wherein the solenoid-type coil comprises a ferromagnetic core.

9. The assembly of claim 1 , wherein the rotating target is comprised of a non-ferromagnetic material.

10. The assembly of claim 1 , wherein the magnetic field sensing element comprises a tunneling magnetoresistance (TMR) element transducer or a giant magnetoresistance (GMR) transducer.

11. A magnetic field sensor assembly comprising:

a magnetic field sensor comprising a magnetic field sensing element;

a coil unit placed in proximity to a rotating target and comprising a coil configured to provide a changing magnetic field in response to a changing current in the coil to produce eddy currents within the rotating target, wherein the magnetic field sensing element is configured to detect the rotating target by detecting variations in the changing magnetic field caused by the rotating target; and

a housing comprising a case and an endcap, the housing having a first end comprising an opening, and a second end comprising a window, the housing containing the magnetic field sensor and the coil unit,

wherein the magnetic field sensor, the coil unit and the endcap are serially positioned in order through the opening of the first end of the housing with the magnetic field sensor first, the coil unit second and the endcap last.

12. The magnetic field sensor assembly of claim 11 , wherein the coil unit comprises a spiral coil.

13. The magnetic field sensor assembly of claim 11 , wherein the coil unit comprises a solenoid-type coil.

14. The magnetic field sensor assembly of claim 13 , wherein the solenoid-type coil comprises a ferromagnetic core.

15. The magnetic field sensor assembly of claim 11 , wherein the coil unit comprises:

a coil body portion comprising a spiral coil or a solenoid-type coil; and

at least two leads attached to the coil body portion and comprising a first lead and a second lead.

16. The magnetic field sensor assembly of claim 15 , wherein the first lead of the coil unit is a signal input for connecting to a signal source, and

wherein the second lead of the coil unit is connected to a reference potential.

17. The magnetic field sensor assembly of claim 16 , wherein the magnetic field sensor further comprises:

a magnetic field sensor package having a body face portion; and

at least three leads attached to the magnetic field sensor package and comprising a first lead, a second lead and a third lead.

18. The magnetic field sensor assembly of claim 17 , wherein the body face portion of the magnetic field sensor package extends through the window of the housing.

19. The magnetic field sensor assembly of claim 17 , wherein the first lead of the magnetic field sensor is a signal input for connecting to a signal source,

wherein the second lead of the magnetic field sensor is connected to a reference potential, and

wherein the third lead of the magnetic field sensor is a signal output.

20. The magnetic field sensor assembly of claim 19 , wherein the body face portion of the magnetic field sensor package extends through the window of the housing.

21. The magnetic field sensor assembly of claim 20 , wherein the body face portion is positioned in proximity to a profile of the rotating target.

22. The magnetic field sensor assembly of claim 11 , wherein the magnetic field sensing element comprises a tunneling magnetoresistance (TMR) element transducer or a giant magnetoresistance (GMR) transducer.

23. The magnetic field sensor assembly of claim 11 , wherein the rotating target is comprised of a non-ferromagnetic material.

Assignments (2)
PATENT SECURITY AGREEMENT Recorded Jun 22, 2023
From: ALLEGRO MICROSYSTEMS, LLC
To: MORGAN STANLEY SENIOR FUNDING, INC., AS THE COLLATERAL AGENT
Reel/Frame 064068/0459 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 14, 2022
From: DAVID, PAUL; TAYLOR, WILLIAM P.
To: ALLEGRO MICROSYSTEMS, LLC
Reel/Frame 059253/0486 →
Continuity (4)
Continuation 16856582 · Apr 23, 2020
Continuation 16029826 · Jul 9, 2018
Continuation 13946400 · Jul 19, 2013
Related Publication 20220196763A1 · Jun 23, 2022