Semiconductor device, display apparatus, and manufacturing method of semiconductor device
A semiconductor device includes a conductive resin layer that includes an insulating resin and first fillers dispersed in the insulating resin and has first and second main surfaces, and an element layer that is arranged on the first main surface and includes a semiconductor element. The first fillers are each a fibrous conductive filler. The conductive resin layer has a first surface layer section that includes the first main surface and has a thickness which is 30% of a thickness of the conductive resin layer, a second surface layer section that includes the second main surface and has a thickness which is 30% of the thickness of the conductive resin layer, and an intermediate layer section arranged between the first and second surface layer sections. First fillers have a smaller directional angle relative to the first main surface in the first surface layer section than in the intermediate layer section.
1. A semiconductor device comprising:
a conductive resin layer that includes an insulating resin and a plurality of first fillers dispersed in the insulating resin and has a first main surface and a second main surface on a side opposite to the first main surface; and
an element layer that is arranged on the first main surface and includes a semiconductor element, wherein
each of the plurality of first fillers is a fibrous conductive filler,
the conductive resin layer has
a first surface layer section that includes the first main surface and has a thickness which is 30% of a thickness of the conductive resin layer,
a second surface layer section that includes the second main surface and has a thickness which is 30% of the thickness of the conductive resin layer, and
an intermediate layer section arranged between the first surface layer section and the second surface layer section, and,
among the plurality of first fillers, first fillers arranged in the first surface layer section have a directional angle relative to the first main surface which is smaller than a directional angle of first fillers arranged in the intermediate layer section.
2. The semiconductor device according to claim 1 , wherein the directional angle of the first fillers arranged in the first surface layer section relative to the first main surface is equal to or smaller than 10°.
3. The semiconductor device according to claim 1 , wherein the plurality of first fillers include at least one of a carbon fiber, a carbon nanofiber, and a needle-shaped metal oxide.
4. The semiconductor device according to claim 3 , wherein the plurality of first fillers include a carbon nanotube.
5. The semiconductor device according to claim 1 , wherein
the conductive resin layer further includes a plurality of second fillers, and
each of the plurality of second fillers is a granular conductive filler.
6. The semiconductor device according to claim 5 , wherein the plurality of second fillers include at least one of a carbon black, metal particles, and metal oxide particles.
7. The semiconductor device according to claim 1 , further comprising:
a metal layer arranged between the conductive resin layer and the element layer.
8. The semiconductor device according to claim 1 , further comprising:
an electrode that is electrically connected with the conductive resin layer and receives an applied potential.
9. The semiconductor device according to claim 8 , wherein the electrode includes a conductive sheet arranged on the second main surface.
10. The semiconductor device according to claim 1 , wherein the semiconductor element is a thin-film transistor.
11. A display apparatus comprising:
the semiconductor device according to claim 1 ; and
a display layer that is arranged on the element layer and displays an image.
12. A method of manufacturing a semiconductor device, the semiconductor device including
a conductive resin layer that includes an insulating resin and a plurality of first fillers dispersed in the insulating resin and has a first main surface and a second main surface on a side opposite to the first main surface, and
an element layer that is arranged on a first-main-surface side of the conductive resin layer and includes a semiconductor element,
the method comprising:
forming the conductive resin layer by die coating using a die head; and
forming the element layer, wherein
the die head has an opening whose gap dimension is equal to or larger than 100 μm but equal to or smaller than 500 μm,
each of the plurality of first fillers is a fibrous conductive filler,
the conductive resin layer has
a first surface layer section that includes the first main surface of the conductive resin layer and has a thickness which is 30% of a thickness of the conductive resin layer,
a second surface layer section that includes the second main surface of the conductive resin layer and has a thickness which is 30% of the thickness of the conductive resin layer, and
an intermediate layer section arranged between the first surface layer section and the second surface layer section, and,
among the plurality of first fillers, first fillers arranged in the first surface layer section have a directional angle relative to the first main surface which is smaller than a directional angle of first fillers arranged in the intermediate layer section.