Cavity resonance suppression using discrete thermal pedestals in active electronically scanned array
An AESA (Active Electronically Scanned Array), including: a PCB (Printed Circuit Board) substrate having an obverse surface; TRMs (Transmit/Receive Modules) disposed on the obverse surface; thermal pedestals wherein each thermal pedestal includes a wall, having a wall height, including wall surfaces and one of the wall surfaces being a contact surface; and a TIM (Thermal Interface Material), having a TIM height, disposed between a respective contact surface of the thermal pedestals and the obverse surface. The thermal pedestals are discrete with respect to one another, the contact surfaces of the thermal pedestals are interspersed about the TRMs, the thermal pedestals do not contact the TRMs, the TIM is electrically and thermally conductive, and the wall height plus the TIM height is sufficient to suppress resonances of the TRMs below a frequency greater than the Tx and Rx frequency bands of the TRMs.
1. An AESA (Active Electronically Scanned Array) comprising:
a PCB (Printed Circuit Board) substrate having an obverse surface;
TRMs (Transmit/Receive Modules) disposed on the obverse surface;
thermal pedestals wherein each thermal pedestal comprises a wall, having a wall height, comprising wall surfaces and one of the wall surfaces being a contact surface; and
a TIM (Thermal Interface Material), having a TIM height, disposed between a respective contact surface of the thermal pedestals and the obverse surface,
wherein the thermal pedestals are discrete with respect to one another,
the contact surfaces of the thermal pedestals are interspersed about the TRMs,
the thermal pedestals do not contact the TRMs,
the TIM is electrically and thermally conductive, and
the wall height plus the TIM height is sufficient to suppress resonances of the TRMs below a frequency greater than Tx and Rx frequency bands of the TRMs.
2. The AESA of claim 1 , further comprising a heat sink, wherein the thermal pedestals extend from the heat sink.
3. The AESA of claim 2 , further comprising fins extending from a first surface of the heat sink, wherein the thermal pedestals extend from a second surface of the heat sink different than the first surface of the heat sink.
4. The AESA of claim 3 , wherein the heat sink, the fins and the thermal pedestals are of a unitary, one-piece construction.
5. The AESA of claim 2 , wherein the heat sink is connected to a ground.
6. The AESA of claim 1 , wherein the thermal pedestals are organized with substantial bilateral symmetry along both a first axis and a second axis orthogonal to the first axis.
7. The AESA of claim 1 , wherein the TRMs are disposed in a non-equilateral triangular lattice.
8. The AESA of claim 1 , further comprising antenna elements and a radome layer disposed over a reverse surface of the PCB.
9. The AESA of claim 8 , further comprising a polarizer layer disposed between the radome layer.
10. The AESA of claim 1 , wherein the thermal pedestals, the TIM and the PCB together form a stack having a cross-section depth less than or equal to 100 mils (2.54 millimeter).
11. The AESA of claim 1 , wherein the thermal pedestals are shaped as a cross.
12. The AESA of claim 1 , wherein the thermal pedestals are interspersed without contacting, the TRMs.
13. The AESA of claim 1 , wherein the AESA is configured to operate in Ku and X frequency bands.
14. The AESA of claim 1 , wherein an upper limit of the Tx and Rx frequency bands is less than or equal to 14.5 GHz and resonance frequencies are suppressed below 16 GHz.
15. The AESA of claim 1 , wherein the AESA is configured to operate with a scan angle θ from 0° to 45° and a φ scan angle from 0° and 360°.
16. The AESA of claim 1 , wherein an upper limit of the Tx and Rx frequency bands is less than or equal to 14.5 GHz with a scan angle θ from 0° to 45° and a φ scan angle from 0°≤φ≤360°.
17. An AESA (Active Electronically Scanned Array), comprising:
a PCB (Printed Circuit Board) substrate having an obverse surface;
TRMs (Transmit/Receive Modules) disposed on the obverse surface;
thermal pedestals wherein each thermal pedestal comprises a wall, having a wall height, comprising wall surfaces and one of the wall surfaces being a contact surface;
a TIM (Thermal Interface Material), having a TIM height, disposed between a respective contact surface of the thermal pedestals and the obverse surface; and
a heat sink comprising fins,
wherein the thermal pedestals are discrete with respect to one another,
the contact surfaces of the thermal pedestals are interspersed about the TRMs,
the thermal pedestals do not contact the TRMs,
the TIM is electrically and thermally conductive,
the wall height plus the TIM height is sufficient to suppress resonances of the TRMs below a frequency greater than Tx and Rx frequency bands of the TRMs,
the fins extend from a first surface of the heat sink and the thermal pedestals extend from a second surface of the heat sink different than the first surface of the heat sink,
the heat sink, the fins and the thermal pedestals are of a unitary, one-piece construction, and
an upper limit of the Tx and Rx frequency bands of the TRMs is less than or equal to 14.5 GHz with a scan angle θ from 0° to 45° and a φ scan angle from 0°≤φ≤360°.