REACTION-BONDED SILICON-CARBIDE WITH IN-SITU FORMED SILICON LAYER FOR OPTICAL FINISHING
A mirror device includes a multi-phase substrate and a single-phase layer. The multi-phase layer is formed of reaction-bonded silicon-carbide (RB-SiC, or Si/SiC) material. The single-phase layer is formed of elemental silicon. The single-phase layer is formed in-situ, that is, contemporaneously with, the formation of RB-SiC material. The single-phase layer is integrally bonded, as one piece, to silicon of the multi-phase substrate. Methods of making a multi-layer device, such as a mirror device, are also described. One such method includes providing a porous mass of silicon carbide and carbon, causing molten elemental silicon to infiltrate the porous mass to form RB-SiC material, simultaneously causing the silicon to flow into a cavity to form a single-phase layer of polishable silicon, integrally bonding silicon in the cavity to the RB-SiC material, and, if desired, polishing a surface of the single-phase layer.
1 . A mirror device comprising:
a multi-phase substrate including reaction-bonded silicon-carbide material, wherein the multi-phase substrate has a first surface and a second surface; and
a single-phase layer including elemental silicon, wherein the single-phase layer has a first surface and a polished surface; and
wherein silicon located at the first surface of the single-phase layer is integrally bonded, as one piece, to silicon at the second surface of the multi-phase substrate.
2 . The mirror device of claim 1 , wherein the single-phase layer is formed by causing the elemental silicon to infiltrate and pass through a porous mass of interconnected silicon carbide and carbon.
3 . The mirror device of claim 1 , wherein the multi-phase substrate and the single-phase layer are cylindrical and the polished surface is circular.
4 . The mirror device of claim 1 , wherein the polished surface is planar.
5 . The mirror device of claim 4 , wherein the second surface of the substrate is planar, and parallel to the polished surface.
6 . The mirror device of claim 1 , wherein the polished surface is non-planar.
7 . The mirror device of claim 6 , wherein the polished surface and the second surface of the substrate have a common direction of concavity.
8 . A method of making a device, comprising:
providing a porous mass of silicon carbide and carbon;
causing molten elemental silicon to infiltrate the porous mass to form a multi-phase reaction-bonded silicon-carbide material;
causing the molten elemental silicon to flow into a cavity in the porous mass to form a single-phase layer of elemental silicon; and
integrally bonding, as one piece, silicon in the cavity to silicon in the reaction-bonded silicon-carbide material.
9 . The method of claim 8 , further comprising forming the cavity by a machining process before causing the molten elemental silicon to infiltrate the porous mass.
10 . The method of claim 8 , further comprising maintaining a metallostatic head to cause the molten elemental silicon to fill the cavity.
11 . The method of claim 10 , wherein elemental silicon within the cavity has a thickness of at least 0.5 mm.
12 . The method of claim 8 , further comprising using the porous mass of silicon carbon and carbon to remove contaminants from the molten elemental silicon before the molten elemental silicon flows into the cavity.
13 . The method of claim 8 , further comprising polishing the single-phase layer of elemental silicon.
14 . A method of making a mirror device, comprising:
providing a porous mass of silicon carbide and carbon;
causing molten elemental silicon to infiltrate the porous mass to form a multi-phase reaction-bonded silicon-carbide material;
causing the molten elemental silicon to flow into a cavity in the porous mass to form a single-phase layer of elemental silicon; and
subsequently polishing a surface of the single-phase layer of elemental silicon.
15 . The method of claim 14 , further comprising removing a portion of the reaction-bonded silicon-carbide material from around the single-phase layer of elemental silicon before polishing the surface of the single-phase layer.
16 . The method of claim 15 , further comprising forming a planar mirror surface by polishing the single-phase layer.
17 . The method of claim 15 , further comprising forming a non-planar mirror surface by polishing the single-phase layer.