IP Library Granted Patent US 11,548,262
Granted Patent B2
US 11,548,262 · App. 17/666,772 · Granted Jan 10, 2023

Bonding film, and light-transmitting laminate including same

Inventors: Hyejin Kim (Suwon-si, KR); Kyuhun Kim (Seoul, KR); Sungjin Chung (Seoul, KR); Jaechul Han (Ulsan, KR)
Assignee: SKC Co., Ltd.
B32B3/30B32B3/263B32B17/10302B32B17/10761B32B17/10889B32B17/10935C08J5/18B60J1/001C08J2329/14
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Quick Facts
Patent No.
US 11,548,262
App. No.
17/666,772
Granted
Jan 10, 2023
Kind
B2
Abstract

Embodiment relates to film for bonding, and a light-transmitting laminate including the same and the like, a film for bonding comprising an embossed surface, wherein the embossed surface has an A2/A1 value of 1 or less are disclosed. A film for bonding have improved in deairing stability during formation of a light transmitting laminate, an edge sealing characteristic, and the like by controlling characteristics of a embossed surface.

Claims (63)

1. A film for bonding comprising:

an embossed surface,

wherein the embossed surface has an A2/A1 value of 1 or less,

wherein the film comprises a thickness increasing area,

wherein the thickness increasing area has both ends which are one end and the other end

wherein a thickness of the one end is different from a thickness of the other end,

wherein a wedge angle (θ) is calculated by below Equation 1, and

wherein the wedge angle of the thickness increasing area is 0.01 to 0.04°;

θ

=

arctan

(

Hb

-

Ha

w

)

[

Equation

1

]

where, in Equation 1, Hb is a thickness of thicker one between the one end and the other end of the thickness increasing area, Ha is a thickness of thinner one between the one end and the other end of the thickness increasing area, and w is a width from the one end to the other end of the thickness increasing area.

2. The film for bonding of claim 1 ,

wherein the embossed surface has a Sz value of 30 to 90 um.

3. The film for bonding of claim 1 ,

wherein the A1 value is 0.5 or more.

4. The film for bonding of claim 1 ,

wherein the A2 value is 0.6 or less.

5. The film for bonding of claim 1 ,

wherein a ratio of the Ha to the w is 0.0002 to 0.0015.

6. The film for bonding of claim 1 ,

which is a single layer film or a laminated film with two or more layers, and comprises a polyvinyl acetal resin.

7. A film for bonding comprising:

an embossed surface having a regular pattern or an irregular pattern,

wherein the embossed surface has a Mr1 value and a Mr2 value,

wherein a rev_Mr2 value is a value of subtracting the Mr2 value from 100%, and

wherein the embossed surface has a Mr1 value which is equal to or greater than the rev_Mr2 value.

8. The film for bonding of claim 7 ,

a peak valley distribution value is calculated by below Equation 1, and

wherein the embossed surface has the peak valley distribution value of 0% to 25%;

Spv=Mr 1− rev _ Mr 2  [Equation 1]

wherein in the Equation 1,

the Spy is peak valley distribution value, and

the rev_Mr2 value is a value of subtracting the Mr2 value from 100%.

9. The film for bonding of claim 7 ,

wherein the Mr1 value is 10% or more.

10. A film for bonding comprising:

an embossed surface having a regular pattern or an irregular pattern,

wherein the embossed surface has a DSvk value of 6 um or less which is calculated by below Equation 2, and

which comprises a plasticizer of 24 to 40 wt % based on the whole weight of the film for bonding;

DSvk=S*vk−Svk   [Equation 2]

wherein in the Equation 2,

the Svk value is a value calculated by ISO_25178, and

the S*vk value is a height value of a point where an areal material ratio is a Mr2 in an areal material ratio curve according to ISO_25178.

11. The film for bonding of claim 10 ,

wherein a ratio of the Svk value to the DSvk value is 0.1 to 1.5.

12. The film for bonding of claim 10 ,

wherein the S*vk is 12 um or less.

13. The film for bonding of claim 10 ,

wherein an A2 value is 0.16 to 0.5.

Assignments (3)
CHANGE OF NAME Recorded Jan 21, 2026
From: SK MICROWORKS CO., LTD.
To: MICROWORKS CO., LTD.
Reel/Frame 073532/0116 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 13, 2023
From: SKC CO., LTD.
To: SK MICROWORKS CO., LTD.
Reel/Frame 063931/0273 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 8, 2022
From: KIM, HYEJIN; KIM, KYUHUN; CHUNG, SUNGJIN; HAN, JAECHUL
To: SKC CO., LTD.
Reel/Frame 058922/0984 →