IP Library › Granted Patent US 12,532,671
Granted Patent B1
US 12,532,671 · App. 17/667,720 · Granted Jan 20, 2026

Superconducting vias for routing electrical signals through substrates and their methods of manufacture

Inventors: James Russell Renzas (San Mateo, CA); Jayss Daniel Marshall (Fair Oaks, CA); Cat-Vu Huu Bui (Fremont, CA); Mehrnoosh Vahidpour (El Cerrito, CA); William Austin O'Brien, IV (Sylmar, CA); Andrew Joseph Bestwick (Berkeley, CA); Chad Tyler Rigetti (Walnut Creek, CA); Keith Matthew Jackson (Berkeley, CA)
Assignee: Rigetti & Co, LLC
H10N69/00G06N10/00H01L23/5383H01L23/552H05K1/115H10N60/12
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Quick Facts
Patent No.
US 12,532,671
App. No.
17/667,720
Granted
Jan 20, 2026
Kind
B1
Abstract

In a general aspect, a superconducting via for routing electrical signals through a substrate includes the substrate and a layer formed of superconducting material. The substrate has a first orifice disposed on a first surface and a second orifice disposed on a second surface. A cavity extends through the substrate from the first orifice to the second orifice. The layer of superconducting material includes a first portion occluding the first orifice and having an exterior surface facing outward from the substrate. The layer also includes a second portion in contact with a side wall of the cavity an extending to the second orifice. A quantum circuit element may optionally be disposed on the first surface and electrically coupled to the exterior surface of the first portion of the layer.

Claims (29)

1 . A method of fabricating an integrated quantum circuit comprising a superconducting via for routing electrical signals through a substrate, the method comprising:

depositing an etch-stop layer onto a first surface of the substrate;

etching a cavity through the substrate to the etch-stop layer, the cavity extending from a second surface of the substrate to an interior surface of the etch-stop layer; and

depositing a layer of superconducting material onto the interior surface of the etch-stop layer and a side wall of the cavity, wherein, during operation of the integrated quantum circuit, the layer of superconducting material is superconducting and transmits the electrical signals through the substrate.

2 . The method of claim 1 , wherein depositing the layer of superconducting material comprises:

depositing the layer of superconducting material onto an area of the second surface.

3 . The method of claim 1 , wherein the cavity tapers progressively from the second surface to the etch-stop layer.

4 . The method of claim 3 ,

wherein the first surface and the second surface are planar surfaces parallel to each other; and

wherein the cavity extends through the substrate along a longitudinal axis perpendicular to the first and second surfaces.

5 . The method of claim 1 , comprising:

removing the etch-stop layer from the first surface of the substrate, thereby exposing an exterior surface of the layer of superconducting material.

6 . The method of claim 1 , comprising:

depositing a support material over the layer of superconducting material, the support material formed of a polymeric material or an inorganic material.

7 . The method of claim 1 , comprising:

selectively removing one or more portions of the etch-stop layer to produce a patterned etch-stop layer on the first surface of the substrate.

8 . The method of claim 1 , wherein depositing the layer of superconducting material comprises:

depositing a first layer of superconducting material onto the interior surface of the etch-stop layer and the side wall of the cavity; and

depositing a second layer of second superconducting material over the first layer of superconducting material.

9 . The method of claim 8 , comprising:

depositing a support material over the second layer of superconducting material, the support material formed of a polymeric material or an inorganic material.

10 . The method of claim 1 , wherein depositing the layer of superconducting material comprises:

depositing a first layer of superconducting material onto the interior surface of the etch-stop layer and the side wall of the cavity;

depositing a second layer of superconducting material over the first layer of superconducting material; and

depositing a third layer of superconducting material over the second layer of superconducting material.

11 . The method of claim 10 , comprising:

depositing a support material over the third layer of superconducting material, the support material formed of a polymeric material or an inorganic material.

12 . The method of claim 6 , wherein depositing the layer of superconducting material comprises depositing the layer of superconducting material onto an area of the second surface; and the method includes selectively removing one or more portions of the support material to expose at least at least a portion of the layer of superconducting material on the area of the second surface.

13 . The method of claim 12 , further comprising selectively removing one or more portions of the superconducting material to expose at least a portion of the area of the second surface.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Dec 12, 2024
From: TRINITY CAPITAL INC.
To: RIGETTI & CO, LLC
Reel/Frame 069603/0771 →
RELEASE OF SECURITY INTEREST Recorded Dec 12, 2024
From: TRINITY CAPITAL INC.
To: RIGETTI & CO, LLC; RIGETTI INTERMEDIATE LLC; RIGETTI COMPUTING, INC.
Reel/Frame 069603/0831 →
AMENDED AND RESTATED INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Jul 8, 2024
From: RIGETTI & CO, LLC; RIGETTI INTERMEDIATE LLC; RIGETTI COMPUTING, INC.
To: TRINITY CAPITAL INC.
Reel/Frame 068146/0416 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 11, 2022
From: RENZAS, JAMES RUSSELL; MARSHALL, JAYSS DANIEL; BUI, CAT-VU HUU; VAHIDPOUR, MEHRNOOSH; BESTWICK, ANDREW JOSEPH; RIGETTI, CHAD TYLER
To: RIGETTI & CO, INC.
Reel/Frame 058989/0363 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 11, 2022
From: A.M. FITZGERALD & ASSOCIATES, LLC
To: RIGETTI & CO, LLC
Reel/Frame 059082/0487 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 11, 2022
From: JACKSON, KEITH MATTHEW
To: A.M. FITZGERALD & ASSOCIATES, LLC
Reel/Frame 058989/0387 →
CHANGE OF NAME Recorded Feb 11, 2022
From: RIGETTI & CO, INC.
To: RIGETTI & CO, LLC
Reel/Frame 059082/0414 →
Continuity (2)
Division 16012262 · Jun 19, 2018
Provisional Application 62521781 · Jun 19, 2017
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