Granted Patent B2

US 12,197,060 · App. 17/669,439 · Granted Jan 14, 2025

Inventors: William Dunn (Alpharetta, GA); Marcos Diaz (Alpharetta, GA); Tim Hubbard (Alpharetta, GA); Matt Dosch (Alpharetta, GA)

Assignee: Manufacturing Resources International, Inc.

G02F1/133385G02F1/133308H05K7/202G02F2202/28

Abstract

Claims (55)

1. A method for manufacturing a thermal management substructure for a display assembly, said method comprising the steps of:

moving a first component of said thermal management substructure to a table;

temporarily securing the first component of said thermal management substructure to the table;

depositing structural adhesive to portions of the first component corresponding with planned contact points for a second component of the thermal management substructure;

placing the second component atop the first component;

depositing additional structural adhesive along exposed portions of the second component corresponding with planned contact points for a third component of the first thermal management substructure;

securing the third component atop the second component; and

securing the thermal management substructure within a housing of the display assembly, wherein the thermal management substructure is secured rearward of an electronic display such that a first portion of said thermal management substructure forms part of an open loop pathway within the housing for ambient air.

2. The method of claim 1 wherein:

said first component comprises a first panel;

said second component comprise a non-flat layer;

said third component comprise a second panel;

said portions of the first component receiving the structural adhesive correspond to troughs of said non-flat layer; and

said portions of said second component receiving the additional structural adhesive comprise peaks of said non-flat layer.

3. The method of claim 1 wherein:

said first component comprises a first one of multiple layers of a heat exchanger of said thermal management substructure;

said second component comprises a second one of said multiple layers of said heat exchanger; and

said third component comprises a third one of said multiple layers of said heat exchanger.

4. The method of claim 1 wherein:

the step of temporarily securing the first component of said thermal management substructure to the table comprises activating a vacuum system for said table;

the step of depositing the structural adhesive is performed by a robotic system;

the step of depositing the additional structural adhesive is performed by a robotic system;

the step of moving the first component to the table is performed by a robot;

the step of placing the second component atop the first component is performed by the robot; and

the step of placing the third component atop the second component is performed by the robot.

5. The method of claim 1 further comprising the steps of:

allowing the structural adhesive and the additional structural adhesive to cure for a period of time; and

placing weight atop the thermal management substructure during at least part of the period of time.

6. The method of claim 1 wherein:

the thermal management substructure is secured within the housing such that a second portion of said thermal management substructure forms part of a closed loop pathway within the housing for circulating gas.

7. The method of claim 1 wherein:

assembly of the thermal management substructure is accomplished without use of fasteners other than said structural adhesive.

8. The method of claim 1 wherein:

the thermal management substructure does not comprise fasteners other than said structural adhesive.

9. The method of claim 1 wherein:

said structural adhesive and said additional structural adhesive comprises a pressure sensitive adhesive and a spacing material; and

said first component, said second component, and said third component each comprise one or more metals.

10. The method of claim 9 further comprising the steps of:

preparing the structural adhesive and said additional structural adhesive by mixing multiple components, wherein the mixing of the multiple components is performed by a computer-controlled system, wherein the spacing material comprises a plurality of small objects of a predetermined size, and wherein the pressure sensitive adhesive comprises methyl methacrylate.

11. A method for manufacturing a ducted, multi-layer heat exchanger for moving heat between separated airflows within a display assembly, said method comprising the steps of:

moving a first component forming, at least in part, a first layer of said ducted, multi-layer heat exchanger to a table;

temporarily securing the first component of said ducted, multi-layer heat exchanger to the table;

preparing a structural adhesive mixture by mixing multiple components comprising methyl methacrylate in a liquid form and glass beads p mined size suspended within the pressure sensitive adhesive, wherein the mixing of the multiple components is performed, at least in part, by a computer-controlled system;

depositing the structural adhesive mixture in a substrate-less form to portions of the first component corresponding with planned contact points for a second component forming, at least in part, a second layer of the multi-layer heat exchanger;

placing the second component atop the first component;

depositing additional amounts of the structural adhesive along exposed portions of the second component corresponding with planned contact points for a third component forming, at least part, the second layer of the multi-layer heat exchanger; and

securing the third component atop the second component;

wherein said first component, said second component, and said third component each comprise one or more metals.

12. A method for manufacturing a ducted, multi-layer heat exchanger for moving heat between separated airflows within a display assembly, said method comprising the steps of:

moving a first component forming, at least in part, a first layer of said ducted, multi-layer heat exchanger to a table;

temporarily securing the first component of said ducted, multi-laver heat exchanger to the table;

depositing a structural adhesive mixture in a substrate-less form to portions of the first component corresponding with planned contact points for a second component forming at least part of a second layer of the multi-layer heat exchanger, wherein the structural adhesive comprises a pressure sensitive adhesive in a liquid form and a plurality of substantially uniform, glass beads suspended therein;

placing the second component atop the first component;

depositing additional portions of the structural adhesive mixture in the substrate-less form along exposed portions of the second component corresponding with planned contact points for a third component forming at least part of the second layer of the first multi-layer heat exchanger; and

securing the third component atop the second component.

Assignments (1)

Continuity (2)

References Cited (306)