IP Library Granted Patent US 12,566,242
Granted Patent B2
US 12,566,242 · App. 17/672,557 · Granted Mar 3, 2026

Radio frequency apparatus and method for assembling radio frequency apparatus

Inventors: Zhe Cheng (Xi'an, CN); Daqing Peng (Shanghai, CN); Zhiwei Zhang (Shanghai, CN); Jie Peng (Xi'an, CN); Bin Hu (Shenzhen, CN); Lungang Yun (Shenzhen, CN)
Assignee: Shenzhen Yinwang Intelligent Technologies Co., Ltd.
G01S7/038G01S13/931H01Q1/3233H01Q1/42H01Q17/00
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Quick Facts
Patent No.
US 12,566,242
App. No.
17/672,557
Granted
Mar 3, 2026
Kind
B2
Abstract

Embodiments provide a radio frequency apparatus including a radome, an absorber, and a radio frequency circuit board that may be used for millimeter wave radar of an intelligent automobile to reduce high-frequency radiation interference from a radio frequency chip and an antenna feeder.

Claims (34)

1 . A radio frequency apparatus, comprising:

a radome;

an absorber comprising a top surface, one or more supporting pieces, and one or more securing pieces; and

a radio frequency (RF) circuit board comprising at least one RF chip, at least one antenna feeder, and at least one RF antenna array, wherein the at least one antenna feeder connects the at least one RF chip to the at least one radio frequency antenna;

the radome being configured to accommodate the RF circuit board, the top surface of the absorber covering the at least one RF chip and covering the at least one antenna feeder so as to electromagnetically shield the at least one RF chip and the at least one antenna feeder, the at least one RF antenna array arranged beyond the top surface of the absorber so as to be uncovered and electromagnetically unshielded by the top surface of the absorber, the at least one RF antenna array being electromagnetically shielded from interference from the at least one RF chip and the at least one antenna feeder, and the one or more securing pieces being configured to secure the absorber to the RF circuit board and to position the top surface of the absorber between the radome and the RF circuit board.

2 . The radio frequency apparatus according to claim 1 , wherein a thickness of the top surface of the absorber is 0.2 to 0.75 air wavelength, the air wavelength being a wavelength of a radio frequency electromagnetic wave, the radio frequency electromagnetic wave having a frequency corresponding to a center frequency of an absorption frequency band of the absorber when the radio frequency electromagnetic wave is transmitted in an air medium.

3 . The radio frequency apparatus according to claim 1 , wherein a distance between the top surface of the absorber and the radome is less than 0.5 air wavelength, the air wavelength being a wavelength of a radio frequency electromagnetic wave, the radio frequency electromagnetic wave having a frequency corresponding to a center frequency of an absorption frequency band of the absorber when the radio frequency electromagnetic wave is transmitted in an air medium.

4 . The radio frequency apparatus according to claim 1 , wherein a distance between the top surface of the absorber and the RF circuit board is less than 0.5 air wavelength, the air wavelength being a wavelength of a radio frequency electromagnetic wave, the radio frequency electromagnetic wave having a frequency corresponding to a center frequency of an absorption frequency band of the absorber when the radio frequency electromagnetic wave is transmitted in an air medium.

5 . The radio frequency apparatus according to claim 1 , wherein the absorber is integrally formed and is made of a wave-absorbing material.

6 . The radio frequency apparatus according to claim 5 , wherein the wave-absorbing material is a mixture of a high-frequency absorbent, a coupling agent, and a thermoplastic resin substrate.

7 . The radio frequency apparatus according to claim 1 , wherein the top surface of the absorber comprising at least one radio frequency chip cavity configured to accommodate a protrusion formed by the at least one RF chip on the RF circuit board.

8 . The radio frequency apparatus according to claim 1 , wherein the one or more securing pieces comprise a scrivet that includes an elastic part configured to pass through a through-hole formed in the RF circuit board corresponding to the scrivet.

9 . The radio frequency apparatus according to claim 1 , wherein the one or more securing pieces comprise a fixing pin configured to be inserted into a through-hole corresponding to the fixing pin on the RF circuit board, the one or more securing pieces or the one or more supporting pieces being adhesively bonded to the RF circuit board.

10 . The radio frequency apparatus according to claim 1 , further comprising a base configured to receive and secure the RF circuit board and the radome.

11 . A radar system, comprising:

a radio frequency (RF) apparatus comprising a radome, an absorber, and a RF circuit board;

the absorber comprising a top surface, one or more supporting pieces, and one or more securing pieces;

the RF circuit board comprising at least one RF chip, at least one antenna feeder, and at least one RF antenna array, wherein the at least one antenna feeder connects the at least one RF chip to the at least one radio frequency antenna; and

the radome being configured to accommodate the RF circuit board, the top surface of the absorber covering the at least one RF chip and covering the at least one antenna feeder so as to electromagnetically shield the at least one RF chip and the at least one antenna feeder, the at least one RF antenna array arranged beyond the top surface of the absorber so as to be uncovered by the top surface of the absorber and electromagnetically unshielded by the top surface of the absorber, the at least one RF antenna array being electromagnetically shielded from interference from the at least one RF chip and the at least one antenna feeder, and the one or more securing pieces being configured to secure the absorber to the RF circuit board and to position the top surface of the absorber between the radome and the RF circuit board.

12 . The radar system according to claim 11 , wherein a thickness of the top surface of the absorber is 0.2 to 0.75 air wavelength, the air wavelength being a wavelength of a radio frequency electromagnetic wave, the radio frequency electromagnetic wave having a frequency corresponding to a center frequency of an absorption frequency band of the absorber when the radio frequency electromagnetic wave is transmitted in an air medium.

13 . The radar system according to claim 11 , wherein a distance between the top surface of the absorber and the radome is less than 0.5 air wavelength, the air wavelength being a wavelength of a radio frequency electromagnetic wave, the radio frequency electromagnetic wave having a frequency corresponding to a center frequency of a absorption frequency band of the absorber when the radio frequency electromagnetic wave is transmitted in an air medium.

14 . The radar system according to claim 11 , wherein a distance between the top surface of the absorber and the radio frequency circuit board is less than 0.5 air wavelength, the air wavelength being a wavelength of a radio frequency electromagnetic wave, the radio frequency electromagnetic wave having a frequency corresponding to a center frequency of an absorption frequency band of the absorber when the radio frequency electromagnetic wave is transmitted in an air medium.

15 . The radar system according to claim 11 , wherein the absorber is integrally formed and is made of a wave-absorbing material.

16 . The radar system according to claim 15 , wherein the wave-absorbing material is a mixture of a high-frequency absorbent, a coupling agent, and a thermoplastic resin substrate.

17 . The radar system according to claim 11 , wherein the top surface of the absorber comprises at least one radio frequency chip cavity configured to accommodate a protrusion formed by the at least one RF chip.

18 . The radar system according to claim 11 , wherein the one or more securing pieces comprise a scrivet that includes an elastic part configured to pass through a through-hole formed in the RF circuit board corresponding to the scrivet.

19 . A vehicle, comprising:

a radar system, comprising: a radio frequency (RF) apparatus comprising a radome, an absorber, and a RF circuit board;

the absorber comprising a top surface, one or more supporting pieces, and one or more securing pieces;

the RF circuit board comprising at least one RF chip, at least one antenna feeder, and at least one RF antenna array, wherein the at least one antenna feeder connects the at least one RF chip to the at least one radio frequency antenna; and

the radome being configured to accommodate the RF circuit board, the top surface of the absorber covering the at least one RF chip and covering the at least one antenna feeder so as to electromagnetically shield the at least one RF chip and the at least one antenna feeder, the at least one RF antenna array arranged beyond the top surface of the absorber so as to be uncovered and electromagnetically unshielded by the top surface of the absorber, the at least one RF antenna array being electromagnetically shielded from interference from the at least one RF chip and the at least one antenna feeder, and the one or more securing pieces being configured to secure the absorber to the RF circuit board and to position the top surface of the absorber between the radome and the RF circuit board.

20 . The radio frequency apparatus according to claim 1 ,

wherein the at least one antenna feeder connects a transmitting RF antenna of the at least one RF antenna array to the at least one RF chip and connects a receiving RF antenna of the at least one RF antenna array to the at least one RF chip; and

wherein the transmitting RF antenna and the receiving RF antenna are arranged beyond the top surface of the absorber so as to be uncovered and electromagnetically unshielded by the top surface of the absorber.

Assignments (3)
CHANGE OF NAME Recorded May 1, 2026
From: SHENZHEN YINWANG INTELLIGENT TECHNOLOGIES CO., LTD.
To: YINWANG INTELLIGENT TECHNOLOGIES CO., LTD.
Reel/Frame 075316/0074 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 12, 2024
From: HUAWEI TECHNOLOGIES CO., LTD.
To: SHENZHEN YINWANG INTELLIGENT TECHNOLOGIES CO., LTD.
Reel/Frame 069335/0897 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 4, 2024
From: CHENG, ZHE; PENG, DAQING; ZHANG, ZHIWEI; PENG, JIE; HU, BIN; YUN, LUNGANG
To: HUAWEI TECHNOLOGIES CO., LTD.
Reel/Frame 069128/0602 →
Priority Claims (1)
CN 201910759450.1 · Aug 16, 2019 · national
Continuity (2)
Continuation PCTCN2020082373 · Mar 31, 2020
Related Publication 20220171018A1 · Jun 2, 2022
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