IP Library Granted Patent US 12,073,549
Granted Patent B2
US 12,073,549 · App. 17/679,298 · Granted Aug 27, 2024

Stress analysis device

Inventors: Yousuke Irie (Nara, JP); Hirotsugu Inoue (Tokyo, JP); Michiyasu Hirota (Nagano, JP)
Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
G06T7/0004G01K11/26G06T2207/20212G06T2207/30108
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,073,549
App. No.
17/679,298
Granted
Aug 27, 2024
Kind
B2
Abstract

A stress analysis device includes: an imaging element that obtains temperature images over a same time range for a same region of an object; a feature point extractor that extracts a feature point in each of the temperature images; a projection transformer that performs projective transformation on each of the temperature images to align the feature point in the temperature images, and aligns the temperature images with respect to a temperature image being a reference; a pixel rearranger that rearranges a pixel array of each of the temperature images subjected to the projective transformation with respect to a pixel array of the temperature image that is the reference; a stress converter that obtains a stress image by multiplying each of the temperature images after pixel rearrangement by a stress conversion coefficient; and an additional averaging part that obtains an additional averaging stress image by adding and averaging the stress images.

Claims (34)

1. A stress analysis device comprising:

an imaging element that obtains two or more temperature images over a same time range for a same region of an object;

a feature point extractor that extracts a feature point in each of the temperature images;

a projection transformer that performs projective transformation on each of the temperature images so as to align the feature point in the temperature images, and aligns the temperature images with respect to a temperature image that is a reference;

a pixel rearranger that rearranges a pixel array of each of the temperature images subjected to the projective transformation with respect to a pixel array of the temperature image that is the reference;

a stress converter that obtains a stress image by multiplying each of the temperature images after pixel rearrangement by a stress conversion coefficient; and

an additional averaging part that obtains an additional averaging stress image by adding and averaging the stress images.

2. The stress analysis device according to claim 1 , further comprising a background temperature subtractor that subtracts a background temperature from each of the temperature images after pixel rearrangement.

3. The stress analysis device according to claim 1 , further comprising an amplitude corrector that corrects amplitude of each of the temperature images after pixel rearrangement by dividing a relationship between a frequency and an amplitude after Fourier transformation by a frequency response function of a first-order lag system.

4. The stress analysis device according to claim 1 , further comprising a spline interpolator that performs spline interpolation over the same time range of each of the temperature images after pixel rearrangement.

5. The stress analysis device according to claim 1 , wherein

when obtaining the two or more temperature images, the imaging element causes a synchronization signal to be included in the two or more temperature images, and

the stress analysis device further comprises a starting point setter that aligns starting point for the temperature images after pixel rearrangement based on the synchronization signal.

6. A stress analysis method comprising:

obtaining two or more temperature images over a same time range for a same region of an object;

extracting a feature point in each of the temperature images;

performing projective transformation on each of the temperature images so as to align the feature point in the temperature images, and aligning the temperature images with respect to a temperature image that is a reference;

rearranging a pixel array of each of the temperature images subjected to the projective transformation with respect to a pixel array of the temperature image that is the reference;

obtaining a stress image by multiplying each of the temperature images after pixel rearrangement by a stress conversion coefficient; and

obtaining an additional averaging stress image by adding and averaging the stress images.

7. A temperature measuring device comprising:

an imaging element that obtains two or more temperature images over a same time range for a same region of an object;

a feature point extractor that extracts a feature point in each of the temperature images;

a projection transformer that performs projective transformation on each of the temperature images so as to align the feature point in the temperature images, and aligns the temperature images with respect to a temperature image that is a reference;

a pixel rearranger that rearranges a pixel array of each of the temperature images subjected to the projective transformation with respect to a pixel array of the temperature image that is the reference;

a temperature image obtainer that obtains each of the temperature images after pixel rearrangement; and

a temperature image additional averaging part that obtains an additional averaging temperature image by adding and averaging the temperature images.

8. A temperature measuring method comprising:

obtaining two or more temperature images over a same time range for a same region of an object;

extracting a feature point in each of the temperature images;

performing projective transformation on each of the temperature images so as to align the feature point in the temperature images, and aligning the temperature images with respect to a temperature image that is a reference;

rearranging a pixel array of each of the temperature images subjected to the projective transformation with respect to a pixel array of the temperature image that is the reference;

obtaining each of the temperature images after pixel rearrangement; and

obtaining an additional averaging temperature image by adding and averaging the temperature images.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 21, 2022
From: IRIE, YOUSUKE; INOUE, HIROTSUGU; HIROTA, MICHIYASU
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 060585/0679 →
Priority Claims (1)
JP 2019-158453 · Aug 30, 2019 · national
Continuity (2)
Continuation PCTJP2020027271 · Jul 13, 2020
Related Publication 20220180502A1 · Jun 9, 2022