Signal delivery in stacked device
Some embodiments include apparatus, systems, and methods having a base, a first die, a second arranged in a stacked with the first die and the base, and a structure located in the stack and outside at least one of the first and second dice and configured to transfer signals between the base and at least one of the first and second dice.
1. An apparatus comprising:
a base;
a first device, and a second device arranged in a stack with the first device and the base, the first device including at least one conductive path at least partly through the first device, wherein the first device comprises a memory device;
an interposer located between and coupled to the first device and the second device;
a first structure portion located on a first side of the first device;
a second structure portion located on a second side of the first device, wherein the first structure portion, the second structure portion, and the memory device have a same height; and
conductive paths including a first portion of conductive paths going through vias of the first structure portion, and a second portion of conductive paths going through vias of the second structure portion.
2. The apparatus of claim 1 , wherein the interposer includes a length measured between edges of the interposer, and the length of the interposer is greater than a length of the first device.
3. The apparatus of claim 1 , wherein the interposer includes a length measured between edges of the interposer, the length of the interposer is greater than a length of the second device.
4. The apparatus of claim 1 , wherein the interposer includes a via, and the first portion of conductive paths includes a conductive path going through the via.
5. The apparatus of claim 4 , wherein the interposer includes an additional via, and the second portion of conductive paths includes a conductive path going through the additional via.
6. The apparatus of claim 1 , further comprising solder located between and coupled to the first device and the interposer.
7. The apparatus of claim 6 , further comprising additional solder located between and coupled to the interposer and the second device.