Inter-board connection structure and power conversion apparatus
View Patent ↗Provided is an inter-board connection structure including: a first connector provided to the first board; a second connector provided to the second board, the second connector electrically connecting between the first board and the second board; and a vibration suppressor provided on a side of a surface opposite to a first surface where the second connector is placed, the surface opposite to the first surface being referred to as a second surface, the vibration suppressor supporting the second board from the side of the second surface to suppress vibration generated between the first board and the second board.
1. An inter-board connection structure for a first board and a second board, the inter-board connection structure comprising:
a first connector provided to the first board;
a second connector provided to the second board, the second connector electrically connecting between the first board and the second board when fitting to the first connector; and
a vibration suppressor provided on a side of a surface of the second board opposite to a first surface of the second board where the second connector is placed, the surface of the second board opposite to the first surface thereof being referred to as a second surface, the vibration suppressor supporting the second board from the side of the second surface to suppress vibration generated between the first board and the second board.
2. The inter-board connection structure according to claim 1 , wherein the vibration suppressor supports the second board from a back side of a portion of the second board at least partially corresponding to an area where the second connector is provided.
3. The inter-board connection structure according to claim 2 , wherein the vibration suppressor includes an elastic layer provided in contact with the second surface.
4. The inter-board connection structure according to claim 2 , further comprising a second vibration suppressor placed between the first board and the second board, the second vibration suppressor suppressing the vibration generated between the first board and the second board.
5. The inter-board connection structure according to claim 2 , wherein the vibration suppressor is configured to be capable of absorbing heat of the second board.
6. The inter-board connection structure according to claim 1 , wherein the vibration suppressor includes an elastic layer provided in contact with the second surface.
7. The inter-board connection structure according to claim 6 , wherein the vibration suppressor includes an inelastic layer provided to hold the elastic layer between the inelastic layer and the second board.
8. The inter-board connection structure according to claim 7 , wherein the inelastic layer is an insulator.
9. The inter-board connection structure according to claim 8 , wherein the vibration suppressor includes an elastic body positioned opposite the elastic layer with respect to the inelastic layer.
10. The inter-board connection structure according to claim 8 , further comprising a second vibration suppressor placed between the first board and the second board, the second vibration suppressor suppressing the vibration generated between the first board and the second board.
11. The inter-board connection structure according to claim 8 , wherein the vibration suppressor is configured to be capable of absorbing heat of the second board.
12. The inter-board connection structure according to claim 7 , wherein the vibration suppressor includes an elastic body positioned opposite the elastic layer with respect to the inelastic layer.
13. The inter-board connection structure according to claim 12 , further comprising a second vibration suppressor placed between the first board and the second board, the second vibration suppressor suppressing the vibration generated between the first board and the second board.
14. The inter-board connection structure according to claim 7 , further comprising a second vibration suppressor placed between the first board and the second board, the second vibration suppressor suppressing the vibration generated between the first board and the second board.
15. The inter-board connection structure according to claim 7 , wherein the vibration suppressor is configured to be capable of absorbing heat of the second board.
16. The inter-board connection structure according to claim 6 , further comprising a second vibration suppressor placed between the first board and the second board, the second vibration suppressor suppressing the vibration generated between the first board and the second board.
17. The inter-board connection structure according to claim 6 , wherein the vibration suppressor is configured to be capable of absorbing heat of the second board.
18. The inter-board connection structure according to claim 1 , further comprising a second vibration suppressor placed between the first board and the second board, the second vibration suppressor suppressing the vibration generated between the first board and the second board.
19. The inter-board connection structure according to claim 1 , wherein the vibration suppressor is configured to be capable of absorbing heat of the second board.
20. A power conversion apparatus, comprising:
a first board and a second board each equipped with an electric circuit related to a power conversion circuit; and
an inter-board connection structure for the first board and the second board, the inter-board connection structure including: a first connector provided to the first board; a second connector provided to the second board, the second connector electrically connecting between the first board and the second board when fitting to the first connector; and a vibration suppressor provided on a side of a surface of the second board opposite to a first surface of the second board where the second connector is placed, the surface of the second board opposite to the first surface thereof being referred to as a second surface, the vibration suppressor supporting the second board from the side of the second surface to suppress vibration generated between the first board and the second board.