Method of using processing oven
A method of using a solder reflow oven can include disposing at least one substrate including solder in a chamber of the oven. The method can include decreasing a pressure of the chamber to a first pressure between about 0.1-50 Torr. After decreasing the pressure of the chamber, the temperature of the at least one substrate can be increased to a first temperature. Formic acid vapor can be admitted into the chamber above the at least one substrate while nitrogen is discharged into the chamber below the at least one substrate. The method can also include removing at least a portion of the formic acid vapor from the enclosure. After the removing step, the temperature of the at least one substrate can be further increased to a second temperature higher than the first temperature. The at least one substrate can be maintained at the second temperature for a first time. And then, the at least one substrate can be cooled.
1. A method of using a solder reflow oven, comprising:
disposing at least one substrate including solder in a chamber of the oven;
decreasing a pressure of the chamber to a first pressure between about 0.1-50 Torr;
after decreasing the pressure of the chamber, increasing a temperature of the at least one substrate to a first temperature;
after increasing the temperature, admitting formic acid vapor into the chamber above the at least one substrate while admitting nitrogen gas into the chamber below the at least one substrate;
removing at least a portion of the formic acid vapor from the chamber;
after the removing, further increasing the temperature of the at least one substrate to a second temperature higher than the first temperature;
maintaining the at least one substrate at the second temperature for a first time; and
after the maintaining, cooling the at least one substrate.
2. The method of claim 1 , wherein increasing the temperature includes increasing the temperature of the at least one substrate using a lamp assembly disposed in the chamber above the at least one substrate.
3. The method of claim 1 , wherein further increasing the temperature includes further increasing the temperature of the at least one substrate using a lamp assembly disposed in the chamber above the at least one substrate.
4. The method of claim 1 , wherein increasing the temperature includes increasing the temperature of the at least one substrate to a temperature between about 150° C.-180° C.
5. The method of claim 4 , wherein further increasing the temperature includes further increasing the temperature of the at least one substrate to a temperature between about 220° C.-250° C.
6. The method of claim 1 , wherein admitting formic acid vapor into the chamber includes admitting vapor having a concentration of 3-15 wt. % formic acid into the chamber.
7. The method of claim 1 , wherein admitting formic acid vapor into the chamber includes directing formic acid vapor into the chamber from a source that is adapted to vary a concentration of formic acid in the formic acid vapor.
8. The method of claim 1 , wherein admitting formic acid vapor into the chamber includes directing formic acid vapor into the chamber from a bubbler.
9. The method of claim 1 , wherein cooling the at least one substrate includes cooling the at least one substrate to a temperature between about 15° C.-30° C.
10. The method of claim 1 , wherein the first time is between about 0.5 minutes to 4 minutes.
11. The method of claim 1 , wherein admitting formic acid vapor into the chamber includes admitting formic acid vapor into the chamber while the at least one substrate is rotating in the chamber.
12. The method of claim 1 , further including lowering the at least one substrate in the chamber to a dosing zone after increasing the temperature of the at least one substrate and before admitting formic acid vapor into the chamber.
13. The method of claim 1 , wherein cooling the at least one substrate includes lowering the at least one substrate in the chamber to contact a cold plate of the chamber.
14. The method of claim 13 , further including directing a liquid coolant through the cold plate to assist in cooling the at least one substrate.
15. The method of claim 1 , wherein cooling the at least one substrate includes lowering the at least one substrate in the chamber to a cool-down zone of the chamber and directing an inert gas on the at least one substrate to assist in cooling the at least one substrate.
16. The method of claim 1 , wherein admitting formic acid vapor into the chamber includes admitting formic acid vapor into the chamber through a chemical delivery tube positioned proximate a top surface of the chamber.
17. The method of claim 16 , wherein the chemical delivery tube comprises one of (i) a straight tube that extends from a side of the chamber towards a center of the chamber, (ii) a tube that includes one or more angled portions, or (iii) a T-shaped tube.
18. The method of claim 16 , wherein the chemical delivery tube comprises a plurality of gas nozzles configured to direct the formic acid vapor toward a top surface of the at least one substrate.