Substrate with fluorinated yttrium coatings, and methods of preparing and using the substrates
Described are substrates that include high aspect ratio surfaces and non-high aspect ratio surfaces, at least two coatings, one coating at high aspect ratio surfaces and a second coating at non-high aspect ratio surfaces, and having fluorinated outer surfaces; methods of preparing these coatings; and substrates, surfaces, equipment, and components of equipment that include the coatings.
1. A coated substrate comprising:
a substrate comprising high aspect ratio surfaces including a feature having an aspect ratio of least 2 to 1 and non-high aspect ratio surfaces which are not high aspect ratio surfaces; and
at least two coatings on the substrate, the coatings comprising:
a first yttrium oxide coating that covers high aspect ratio surfaces; and
a second yttrium oxide coating that covers non-high aspect ratio surfaces,
wherein an outermost portion of the coatings comprises fluorinated yttrium oxide at both high aspect ratio surfaces and non-high aspect ratio surfaces.
2. The substrate of claim 1 , wherein
the first yttrium oxide coating covers high aspect ratio surfaces and at least a portion of non-high aspect ratio surfaces, and
the second yttrium oxide coating covers non-high aspect ratio surfaces and at least a portion of high aspect ratio surfaces.
3. The substrate of claim 1 , wherein the first yttrium oxide coating is an atomic layer deposition coating.
4. The substrate of claim 1 , wherein the second yttrium oxide coating is a physical vapor deposition coating.
5. The substrate of claim 1 , wherein an outer portion of the first yttrium oxide coating comprises yttrium fluoride, yttrium oxyfluoride, or a composite that includes aluminum oxide and yttrium fluoride or yttrium oxyfluoride.
6. The substrate of claim 1 , wherein the first yttrium oxide coating has a thickness in a range from 50 to 500 nanometers.
7. The substrate of claim 1 , wherein an outer portion of the second yttrium oxide coating comprises yttrium oxyfluoride.
8. The substrate of claim 1 , wherein the second yttrium oxide coating has a thickness of at least 1 micron.
9. The substrate of claim 1 , comprising a non-yttrium-containing buffer layer between the substrate surface and the first yttrium oxide coating, the second yttrium oxide coating, or both.
10. The substrate of claim 9 , wherein the buffer layer comprises an atomic layer deposition layer that comprises aluminum oxide.
11. The substrate of claim 9 , further comprising:
the buffer layer covering high aspect ratio surfaces and non-high aspect ratio surfaces,
the first coating covering the buffer layer at high aspect ratio surfaces and non-high aspect ratio surfaces, and
the second coating covering the first coating at non-high aspect ratio surfaces.
12. The substrate of claim 1 , comprising:
the second yttrium oxide coating deposited onto the non-high aspect ratio surfaces, and
the first yttrium oxide coating deposited onto the high aspect ratio surface and covering the second yttrium oxide coating.
13. The substrate of claim 1 , wherein:
the substrate comprises:
two opposed surfaces each having a length and a width dimension,
a thickness between the two opposed surfaces, and
an aperture extending between the two opposed surfaces, the aperture comprising a high aspect ratio aperture surface extending along the thickness, and an aperture diameter, and
the ratio of the thickness to the aperture diameter (thickness:diameter) is greater than 5:1.
14. The substrate of claim 13 , wherein the feature has an aspect ratio of at least 10 to 1.
15. The substrate of claim 13 , wherein the substrate is a process chamber component of a semiconductor processing device.