Bridge apparatus and method for semiconductor die transfer
An apparatus for transferring a semiconductor die (“die”) from the first substrate to the second substrate. The apparatus includes a stage configured to hold a product substrate. A first bridge holds a transfer mechanism assembly. A second bridge holds a die substrate holder configured to hold the first substrate. A controller is configured to cause the first bridge and the second bridge to move to align the transfer mechanism assembly with the die on the first substrate with a transfer position on the second substrate where the die is to be transferred.
1. An apparatus for transferring a semiconductor die from a first substrate to a second substrate, the apparatus comprising:
a stage configured to hold the second substrate;
a first rail disposed on a first side of the stage;
a second rail disposed on a second side of the stage, the second side opposite the first side;
a first bridge holding a transfer mechanism assembly, the first bridge attached to the first rail and the second rail;
a second bridge holding a die substrate holder configured to hold the first substrate, the second bridge directly attached to the first rail and the second rail; and
a controller configured to cause the first bridge and the second bridge to move to align the transfer mechanism assembly with the semiconductor die on the first substrate and with a transfer position on the second substrate where the semiconductor die is to be transferred.
2. The apparatus for transferring the semiconductor die from the first substrate to the second substrate according to claim 1 , wherein the transfer mechanism assembly includes:
a needle, and
a needle actuator that moves the needle toward and away from the transfer position on the second substrate responsive to a signal from the controller, and
wherein the needle actuator is configured to push the needle against the semiconductor die to push the semiconductor die into the transfer position on the second substrate.
3. The apparatus for transferring the semiconductor die from the first substrate to the second substrate according to claim 1 , further comprising:
a sensor in communication with the controller, the sensor configured to indicate a position of the transfer mechanism assembly on the first bridge.
4. The apparatus for transferring the semiconductor die from the first substrate to the second substrate according to claim 3 , wherein the first bridge and the second bridge are configured to move along the first rail and the second rail in a first direction, the transfer mechanism assembly configured to move along a track disposed on the first bridge, and the die substrate holder configured to move along a track disposed on the second bridge.
5. The apparatus for transferring the semiconductor die from the first substrate to the second substrate according to claim 1 , further comprising:
a third bridge holding a second transfer mechanism assembly; and
a fourth bridge holding a second die substrate holder,
wherein the controller is further configured to cause the third bridge and the fourth bridge to move to align the second transfer mechanism assembly with a second transfer position on the second substrate where a second semiconductor die is to be transferred.
6. The apparatus for transferring the semiconductor die from the first substrate to the second substrate according to claim 1 , further comprising:
an optical sensor positioned to sense a position of the semiconductor die with respect to the transfer position on the second substrate.